公开(公告)号：EP2458595B1

公开(公告)日：2017-11-01

申请号：EP12152191.8

申请日：2008-04-04

Applicant: MBDA UK Limited

Inventor： Dunleavy, Michael ,  Haq, Sajad ,  Davies, Joseph, Maurice ,  Rew, Jason, Karl

IPC: H01B3/00

CPC classification number: B29C39/10 ,  H01B3/006 ,  H01G4/206 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0254 ,  Y10T428/24967

公开(公告)号：EP2017031B1

公开(公告)日：2017-09-13

申请号：EP07742163.4

申请日：2007-04-23

Applicant: Senju Metal Industry Co., Ltd

Inventor： KATO, Rikiya ,  YAMAGATA, Sakie

IPC: B23K35/26 ,  B23K35/02 ,  C22C5/00 ,  C22C9/02 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H05K3/34 ,  B22F1/02

CPC classification number: H05K3/3484 ,  B22F1/0003 ,  B22F1/0059 ,  B22F1/025 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  C22C5/00 ,  C22C9/02 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H05K2201/0215 ,  H05K2201/0218 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2982

公开(公告)号：EP2667990B1

公开(公告)日：2016-12-14

申请号：EP12739136.5

申请日：2012-01-25

Applicant: Lockheed Martin Corporation

Inventor： ZINN, Alfred, A.

IPC: B82Y30/00 ,  H05K1/09 ,  B22F1/00 ,  B22F9/24 ,  H05K3/12

CPC classification number: B22F1/0018 ,  B22F1/0062 ,  B22F9/24 ,  B22F2999/00 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2203/0514 ,  H05K2203/107 ,  B22F2301/10 ,  B22F2304/054

公开(公告)号：EP1946626B1

公开(公告)日：2013-03-06

申请号：EP06832782.4

申请日：2006-11-10

Applicant: Panasonic Corporation

Inventor： SAKAI, Tadahiko c/o Matsushita Electric Industrial Co., Ltd. ,  MAEDA, Tadashi c/o Matsushita Electric Industrial Co., Ltd. ,  OZONO, Mitsuru c/o Matsushita Electric Industrial Co., Ltd.

IPC: H05K3/34 ,  B23K35/02

CPC classification number: H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

公开(公告)号：EP2513912A1

公开(公告)日：2012-10-24

申请号：EP10807764.5

申请日：2010-12-15

Applicant: Shocking Technologies Inc

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert ,  WU, Junjun ,  SARAF, Pragnya ,  RANGANATHAN, Thangamani

IPC: H01B1/22 ,  H01C7/105 ,  H01L21/60

CPC classification number: H01C7/108 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0218 ,  H05K2201/0738 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: A composition of voltage switchable dielectric (VSD) material that comprises a concentration of core shelled particles that individually comprise a conductor core and a conductor shell, so as to form a conductor-on- conductor core shell particle constituent for the VSD material.

公开(公告)号：EP2346680A4

公开(公告)日：2012-04-18

申请号：EP09813434

申请日：2009-08-20

Applicant: LOCKHEED CORP

Inventor： ZINN ALFRED A

IPC: H05K3/34 ,  B22F1/00 ,  B22F1/02 ,  B22F9/24

CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

公开(公告)号：EP2024119A1

公开(公告)日：2009-02-18

申请号：EP07784258.1

申请日：2007-05-31

Applicant: Cabot Corporation

Inventor： KIM, Hyungrak

IPC: B22F9/24 ,  B22F1/02

CPC classification number: B22F1/0018 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/1241 ,  H05K2201/0218 ,  Y10S977/777 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: Metallic nanoparticles and processes for forming metallic nanoparticles. In one aspect, the invention is to a process for forming nanoparticles comprising the step of heating a solution comprising a first metal precursor and a nucleating agent (e.g., nucleate nanoparticles or a nucleate precursor) in the presence of a base under conditions effective to form the nanoparticles. The first metal precursor preferably comprises a cationic metal species having a low reduction potential. The invention is also to a nanoparticle or plurality of nanoparticles, each nanoparticle comprising a core having a largest dimension less than about 10 nm; and a metal layer substantially surrounding the core and having a largest dimension less than about 200 nm.

公开(公告)号：EP2017031A1

公开(公告)日：2009-01-21

申请号：EP07742163.4

申请日：2007-04-23

Applicant: Senju Metal Industry Co., Ltd

Inventor： KATO, Rikiya ,  YAMAGATA, Sakie

IPC: B23K35/26

CPC classification number: H05K3/3484 ,  B22F1/0003 ,  B22F1/0059 ,  B22F1/025 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  C22C5/00 ,  C22C9/02 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H05K2201/0215 ,  H05K2201/0218 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2982

Abstract: High-temperature solders having a higher melting point than solder alloys used for soldering of printed circuit boards are used for internal bonding of electronic parts, but high-temperature solders which are free from Pb have not been developed. There exist high-temperature solders which comprises Sn balls and Cu balls and which perform bonding through the formation of an intermetallic compound without melting to form a single-phase structure, but they have poor wettability to the lands of a printed circuit board or electrodes of electronic parts and have not been used.
A solder paste according to the present invention is provided by mixing flux with a powder mixture of Sn powder or an Sn based lead-free solder powder with Cu or Ag powder which has Ni plating formed on its surface. Although the solder paste performs bonding by means of an intermetallic compound without melting to form a single phase structure, the Ni plating acts as a barrier which retards the formation of the intermetallic compound so as to leave enough time to permit wetting of the lands of a printed circuit board or electrodes of an electronic part.

公开(公告)号：EP1946626A1

公开(公告)日：2008-07-23

申请号：EP06832782.4

申请日：2006-11-10

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： SAKAI, Tadahiko c/o Matsushita Electric Industrial Co., Ltd. ,  MAEDA, Tadashi c/o Matsushita Electric Industrial Co., Ltd. ,  OZONO, Mitsuru c/o Matsushita Electric Industrial Co., Ltd.

IPC: H05K3/34 ,  B23K35/02

CPC classification number: H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

Abstract: In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder (8) is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder (8) has a flake or dendrite shape including a core segment (8a) of the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment (8b) of the metal with good-wettability for the molten solder and to be solid-solved in the core segment (8a) molten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles (18) . Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

公开(公告)号：EP1541654A4

公开(公告)日：2008-07-09

申请号：EP02765410

申请日：2002-09-04

Applicant: NAMICS CORP ,  SUGANUMA KATSUAKI

Inventor： KOMAGATA MICHINORI ,  SHIRAI YUKIO ,  SUZUKI KENICHI ,  SUGANUMA KATSUAKI

IPC: C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K3/32

CPC classification number: H01B1/22 ,  C08K3/08 ,  C09J9/02 ,  C09J2205/102 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: The present invention provides a conductive adhesive comprising conductive particles and a resin wherein 30% by weight or more of the conductive particles substantially comprise silver and tin, and a molar ratio of silver and tin in the metal components of the conductive adhesive is in the range of 77.5 : 22.5 to 0 : 100; and a circuit connected by using the conductive adhesive.