公开(公告)号：EP0814539A2

公开(公告)日：1997-12-29

申请号：EP97201697

申请日：1997-06-04

Applicant: EASTMAN KODAK CO

Inventor： YOKAJTY JOSEPH E

IPC: H05K1/14 ,  H01R12/62 ,  H05K1/11 ,  H05K3/36 ,  H01R9/07

CPC classification number: H01R12/62 ,  H05K1/117 ,  H05K3/363 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09145

Abstract: A method and device for connecting a flexible circuit to a printed circuit board wherein the device is integral with flexible circuit and the printed circuit board resulting in an improvement in the ease and efficiency of assembly. The printed circuit board includes a cut-out in a side edge thereof to yield an arcuate bearing rim located between a pair of opposing nocks. The printed circuit board includes a plurality of solder pads adjacent the arcuate bearing rim and the arcuate bearing rim has a predetermined length. The flexible circuit includes a pair of opposing notches located one each in a lateral edge of the flexible circuit. The flexible circuit also includes a plurality of solder pads proximate to the pair of opposing notches. The flexible circuit has a predetermined width at across the opposing notches which is substantially equal to the predetermined length of said arcuate bearing rim. The flexible circuit is caused to bow such that it can be inserted into the cut-out so that the notches interlock with the nocks with the flexible circuit engaging the bearing rim to conform to the shape of the bearing rim and automatically align the solder pads of the printed circuit board with the solder pads of the flexible circuit. The electrical and mechanical connection is completed by soldering.

Abstract translation: 一种用于将柔性电路连接到印刷电路板的方法和装置，其中该装置与柔性电路和印刷电路板是一体的，从而提高组装的容易性和效率。 印刷电路板包括在其侧边缘处的切口，以产生位于一对相对的异常之间的弓形轴承边缘。 印刷电路板包括与弧形轴承边缘相邻的多个焊盘，并且弓形轴承边缘具有预定长度。 柔性电路包括一对相对的凹口，每个凹槽位于柔性电路的侧边缘中。 柔性电路还包括靠近该对相对的凹口的多个焊盘。 柔性电路在相对的凹口处具有预定的宽度，其基本上等于所述弓形轴承边缘的预定长度。 使柔性电路弯曲，使得其可以插入切口中，使得凹口与诺克斯互锁，柔性电路与轴承边缘接合以符合轴承边缘的形状并自动对准焊盘的焊盘 印刷电路板与柔性电路的焊盘。 电气和机械连接通过焊接完成。

公开(公告)号：EP0676914A3

公开(公告)日：1997-03-05

申请号：EP95104774.5

申请日：1995-03-31

Applicant: Hughes Aircraft Company

Inventor： Boudreau, Paul

IPC: H05K3/46 ,  H05K3/00

CPC classification number: H05K1/0271 ,  H05K1/0268 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/225 ,  H05K3/4638 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/0264 ,  H05K2203/1383 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4973

Abstract: A method of constructing a printed wiring board comprises the step of creating a printed wiring board panel (10; 82, 84) having a substrate (12) with top and bottom surfaces, having a copper film layer (14, 16) on at least one of the surfaces and having a protective foil layer over the copper film layer (14, 16). Registration holes are formed in the panel (10; 82, 84) including panel registration holes and circuit pattern registration holes with the circuit pattern registration holes being positioned adjacent a printed circuit position. The protective foil layer is removed only around the printed circuit position including the areas of the circuit pattern registration holes. Then a circuit pattern is etched in the circuit pattern position adjacent the circuit pattern registration holes. Then, the protective foil layer is removed from the circuit patterns only on the innerlayer panel so that the innerlayer panel is strengthened by the presence of a portion of the protective foil layer during processing up to the removal step prior to lamination. At an intermediate step, the circuit patterns are inspected and defective patterns are replaced by operative patterns (76) during the stacking process prior to multilayer lamination.

公开(公告)号：EP0746187A2

公开(公告)日：1996-12-04

申请号：EP96303482.2

申请日：1996-05-16

Applicant: GENERAL INSTRUMENT CORPORATION

Inventor： Mittal, Faquir C.

IPC: H05K1/11 ,  H01R9/09

CPC classification number: H05K1/117 ,  H01R12/721 ,  H05K2201/09145 ,  H05K2201/094 ,  H05K2201/10863 ,  Y10S439/951

Abstract: A PC board (5) for mating with a card-edge connector (25) having a selectively configured projecting tab (10) which defines a desired insertion force profile to facilitate engagement. A portion (11) of the projecting tab (10) is notched to delay the initial contact from the internal spring contacts of the mating card-edge connector (25) until a proportional amount of contacts have opened and wiped some of the PC board terminals first, and then to allow the remaining contacts to engage the notched portion. Initial insertion force is relieved in proportion to the PC board edge profile.

Abstract translation: 用于与具有选择性地构造的突出突片（10）的卡缘连接器（25）配合的PC板（5），其限定期望的插入力轮廓以便于接合。 突出突片（10）的一部分（11）被切口以延迟来自匹配卡缘连接器（25）的内部弹簧触点的初始接触，直到触点的比例量打开并擦去一些PC板端子 首先，然后允许剩余的触点接合凹口部分。 初始插入力与PC板边缘轮廓成正比。

公开(公告)号：EP0676914A2

公开(公告)日：1995-10-11

申请号：EP95104774.5

申请日：1995-03-31

Applicant: Hughes Aircraft Company

Inventor： Boudreau, Paul

IPC: H05K3/46 ,  H05K3/00

CPC classification number: H05K1/0271 ,  H05K1/0268 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/225 ,  H05K3/4638 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/0264 ,  H05K2203/1383 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4973

Abstract: A method of constructing a printed wiring board comprises the step of creating a printed wiring board panel (10; 82, 84) having a substrate (12) with top and bottom surfaces, having a copper film layer (14, 16) on at least one of the surfaces and having a protective foil layer over the copper film layer (14, 16). Registration holes are formed in the panel (10; 82, 84) including panel registration holes and circuit pattern registration holes with the circuit pattern registration holes being positioned adjacent a printed circuit position. The protective foil layer is removed only around the printed circuit position including the areas of the circuit pattern registration holes. Then a circuit pattern is etched in the circuit pattern position adjacent the circuit pattern registration holes. Then, the protective foil layer is removed from the circuit patterns only on the innerlayer panel so that the innerlayer panel is strengthened by the presence of a portion of the protective foil layer during processing up to the removal step prior to lamination. At an intermediate step, the circuit patterns are inspected and defective patterns are replaced by operative patterns (76) during the stacking process prior to multilayer lamination.

Abstract translation: 构造的印刷布线板的方法，包括：创建一个印刷线路板面板的步骤;在具有衬底（12）与顶面和底面（10 82，84），具有铜薄膜层（14，16）的至少 所述表面中的一个，并且具有在铜薄膜层（14，16）的保护箔层。 定位孔形成在面板（10; 82，84）包括面板定位孔和电路图案登记孔与电路图案登记孔被定位成邻近印刷电路位置。 的保护箔层仅围绕所述印刷电路位置包括电路图案登记孔的区域中去除。 然后将电路图案在相邻的电路图案登记孔电路图案位置蚀刻。 然后，保护箔层从电路图案仅使内层面板所以也内层面板由保护箔层的一个部分的存在加强了处理多达在层压前去除步骤过程中被除去。 在中间步骤中，将电路图案进行检验和缺陷图案通过在多层层压之前，堆叠过程操作模式（76）代替。

公开(公告)号：EP0367691A1

公开(公告)日：1990-05-09

申请号：EP89420415.5

申请日：1989-10-25

Applicant: MERLIN GERIN

Inventor： Bouchaud, Jean-Louis ,  Chevaleyre, Robert

IPC: G05B19/12 ,  H05K1/11

CPC classification number: H05K1/117 ,  G05B19/12 ,  H05K1/0295 ,  H05K2201/0746 ,  H05K2201/09145 ,  H05K2201/094 ,  H05K2201/09954 ,  H05K2201/10159

Abstract: Une cartouche embrochable (130) contient une mémoire amovible de type EEPROM dans laquelle sont mémorisés les paramètres correspondants à des configurations standards. La sélection, par le clavier (128) de l'unité centrale (110) de l'ensemble de contrôle, d'une configuration standard particulière, provoque le transfert des paramètres correspondants de la mémoire amovible à la mémoire vive (124) de l'unité centrale, effectuant ainsi un paramètrage automatique de l'ensemble. Les paramètres peuvent ultérieurement être modifiés dans la mémoire vive et la configuration modifiée peut être recopiée dans des emplacements vides de la mémoire amovible.

Abstract translation: 可插入盒式存储器（130）包含EEPROM型可拆卸存储器，其中存储与标准配置对应的参数。 通过特定标准配置的控制组的中央单元（110）的键盘（128）的选择使得从可拆卸存储器将相应参数传送到中央单元的随机存取存储器（124） ，从而实现该组的自动参数化。 可随后在随机存取存储器中修改参数，并且修改后的配置可以复制回可拆卸存储器中的空闲位置。

公开(公告)号：EP0233321A3

公开(公告)日：1989-07-19

申请号：EP86114767.6

申请日：1986-10-23

Applicant: VDO Adolf Schindling AG

Inventor： Baeger, Holm, Dr.

IPC: H05K3/30 ,  H05K7/08 ,  H05K3/34

CPC classification number: H05K3/366 ,  H05K1/184 ,  H05K2201/048 ,  H05K2201/09145 ,  H05K2201/09645 ,  H05K2201/10136 ,  H05K2201/10446 ,  H05K2201/10454

Abstract: Bei einer Vorrichtung zur elektrisch leitenden Ver­bindung einer Flüssigkristallzelle mit einer Leiter­platte stehen die Flüssigkristallzelle und die Lei­terplatte im wesentlichen aufeinander senkrecht und weisen zueinander passende Leiterbahnen auf, welche innerhalb eines von ihnen gebildeten Winkels durch Lot miteinander verbunden sind. In der Leiterplatte kann in einem Randbereich ein Schlitz zur Aufnahme eines Randbereichs der Flüssigkristallzelle angeord­net sein.

公开(公告)号：EP0113238B1

公开(公告)日：1988-10-26

申请号：EP83307824.9

申请日：1983-12-21

Applicant: OMRON TATEISI ELECTRONICS CO.

Inventor： Kamada, Koichiro

IPC: H05K7/14 ,  H05K1/02

CPC classification number: H05K11/02 ,  H05K1/02 ,  H05K7/1427 ,  H05K2201/09145

公开(公告)号：EP0033677B1

公开(公告)日：1983-05-18

申请号：EP81400053.5

申请日：1981-01-16

Applicant: THOMSON-BRANDT

Inventor： Dongois, Gérard ,  Pataillot, Georges ,  Hascoet, Max ,  Canon, Louis

IPC: H05K3/36

CPC classification number: H05K1/148 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/10287

公开(公告)号：EP0033677A2

公开(公告)日：1981-08-12

申请号：EP81400053.5

申请日：1981-01-16

Applicant: THOMSON-BRANDT

Inventor： Dongois, Gérard ,  Pataillot, Georges ,  Hascoet, Max ,  Canon, Louis

IPC: H05K3/36

CPC classification number: H05K1/148 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/10287

Abstract: Assemblage d'au moins deux cartes de circuits imprimés connectées l'une à l'autre par une liaison à la fois mécanique et électrique comportant des agrafes chevauchant des bords adjacents des cartes.
La partie centrale (12) de chaque agrafe est disposée au moins partiellement dans un logement (26, 27) formé dans les cartes (1, 2) au voisinage des bords adjacents.
Les logements sont par exemple des encoches (26, 27,) allongées perpendiculairement aux bords adjacents.

Abstract translation: 1.一种组件，包括至少两个印刷电路板，其通过包括夹在印刷电路板的相邻边缘上的夹子的机械电连接相互连接，其特征在于，每个夹子（13）的中心部分（12）被设置 至少部分地形成在其相邻边缘附近的印刷电路板（1,2）中形成的凹部（26,27）中。

公开(公告)号：EP3375256A1

公开(公告)日：2018-09-19

申请号：EP17810491.5

申请日：2017-05-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： KIM, Jung-min ,  SHIN, Ho-seong ,  JANG, Kyoung-hwan

IPC: H05B33/12 ,  H05B33/10 ,  B05C5/02 ,  B05C13/02 ,  H01L33/44

CPC classification number: H05B33/04 ,  H05B33/10 ,  H05B33/12 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/007 ,  H05K3/284 ,  H05K3/288 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: The present disclosure provides a display module and a method for coating the same, which can prevent and/or reduce the occurrence of black seam between display modules that are arranged adjacent to each other. According to an example aspect of the present disclosure, a display module includes a printed circuit board; a plurality of luminous elements arranged at predetermined intervals on the printed circuit board; and a coating layer comprising a coating disposed between the respective luminous elements, disposed around side surfaces of the respective luminous elements positioned at an outermost, and formed to have a height that is substantially equal to a height of the side surfaces of the luminous elements, the coating being configured to block side light of the respective luminous elements.