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    TEXTILE MOTHERBOARD, HAVING A MODULAR AND INTERCHANGEABLE DESIGN, FOR MONITORING, REPORTING AND CONTROLLING
    72.
    发明公开
    TEXTILE MOTHERBOARD, HAVING A MODULAR AND INTERCHANGEABLE DESIGN, FOR MONITORING, REPORTING AND CONTROLLING 审中-公开

    公开(公告)号：EP3117848A4

    公开(公告)日：2018-03-14

    申请号：EP14885683

    申请日：2014-07-14

    Applicant: VACAS JACQUES PAULINO

    Inventor： VACAS JACQUES PAULINO

    IPC: A61B5/00 ,  G06F1/16 ,  H05K1/03

    CPC classification number: G06F1/163 ,  A41B1/08 ,  A41D1/005 ,  A61B5/6805 ,  G06F3/015 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/115 ,  H05K1/118 ,  H05K1/18 ,  H05K2201/0281 ,  H05K2201/10053

    Abstract: The invention relates to a textile motherboard (TMT) that can be used in, inter alia, clothing, coats, and dressings gowns, and which includes at least one central processing unit (CPU) or a peripheral or a combination of both, for monitoring, reporting and controlling parameters of the wearer. The clothing can be used or worn by a human or non-human user. The textile of the clothing serves as a substrate for forming the TMT. The TMT can have multi-layer structures and VIAs (vertical interconnect access). The traces of the TMT are formed of textile material that can transmit signals between the CPU and information storage means, or the combination with the peripheral(s). The layers, traces and VIAs are incorporated using known textile-handling techniques such as weaving, stamping, or same can be printed onto the textiles. Each component is modular and interchangeable, and is connected to the TMT using textile connectors that can be clips, hooks or similar elements. The TMT, the CPU and the peripherals are washable. The CPU and each peripheral can be mounted on rigid or flexible textile boards or PCBs (printed circuit board), using discrete electronic or photonic elements. The CPU includes a micro-controller, a micro-processor or a comparable element. The peripherals include photonic transducers or electronic transducers, or a combination of both, such as, inter alia, capacitive sensors, pulse meters, humidity sensors, thermometers, accelerometers, gyroscopes. The peripherals also include: screens; modules for serial communication via radio frequency (including, inter alia, Bluetooth, Zigbee technology), Wi-Fi; and similar elements.

    TEXTILE MOTHERBOARD, HAVING A MODULAR AND INTERCHANGEABLE DESIGN, FOR MONITORING, REPORTING AND CONTROLLING
    73.
    发明公开
    TEXTILE MOTHERBOARD, HAVING A MODULAR AND INTERCHANGEABLE DESIGN, FOR MONITORING, REPORTING AND CONTROLLING 审中-公开

    公开(公告)号：EP3118724A4

    公开(公告)日：2017-11-01

    申请号：EP15761852

    申请日：2015-03-10

    Applicant: VACAS JACQUES PAULINO

    Inventor： VACAS JACQUES PAULINO

    IPC: H01H13/703 ,  A61B5/00 ,  G06F1/16 ,  G06F3/01 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

    CPC classification number: G06F1/163 ,  A41B1/08 ,  A41D1/005 ,  A61B5/6805 ,  G06F3/015 ,  H01H13/703 ,  H01H2203/0085 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/115 ,  H05K1/118 ,  H05K1/18 ,  H05K2201/0281 ,  H05K2201/10053

    Abstract: The invention relates to a textile motherboard (TMT) that can be used in, inter alia, clothing, coats, and dressings gowns, and which includes at least one central processing unit (CPU) or a peripheral or a combination of both, for monitoring, reporting and controlling parameters of the wearer. The clothing can be used or worn by a human or non-human user. The textile of the clothing serves as a substrate for forming the TMT. The TMT can have multi-layer structures and VIAs (vertical interconnect access). The traces of the TMT are formed of textile material that can transmit signals between the CPU and information storage means, or the combination with the peripheral(s). The layers, traces and VIAs are incorporated using known textile-handling techniques such as weaving, stamping, or same can be printed onto the textiles. Each component is modular and interchangeable, and is connected to the TMT using textile connectors that can be clips, hooks or similar elements. The TMT, the CPU and the peripherals are washable. The CPU and each peripheral can be mounted on rigid or flexible textile boards or PCBs (printed circuit board), using discrete electronic or photonic elements. The CPU includes a micro-controller, a micro-processor or a comparable element. The peripherals include photonic transducers or electronic transducers, or a combination of both, such as, inter alia, capacitive sensors, pulse meters, humidity sensors, thermometers, accelerometers, gyroscopes. The peripherals also include: screens; modules for serial communication via radio frequency (including, inter alia, Bluetooth, Zigbee technology), Wi-Fi; and similar elements

    ELECTRONIC TEXTILE AND METHOD OF MANUFACTURING AN ELECTRONIC TEXTILE
    77.
    发明公开
    ELECTRONIC TEXTILE AND METHOD OF MANUFACTURING AN ELECTRONIC TEXTILE 审中-公开
    ELEKTRONISCHE TEXTILIE UND VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN TEXTILIE

    公开(公告)号：EP2620042A1

    公开(公告)日：2013-07-31

    申请号：EP11764320.5

    申请日：2011-09-06

    Applicant: Koninklijke Philips Electronics N.V.

    Inventor： ZHOU, Guofu ,  RADEMAKERS, Johannes, Adrianus, Maria ,  SNOEIJEN, Petrus, Antonius, Henricus ,  BAX, Josephus, Henricus, Gerardus ,  VAN ABEELEN, Frank, Anton ,  VAN PIETERSON, Liesbeth

    IPC: H05K1/18 ,  H05K1/03

    CPC classification number: H05K1/0283 ,  F21K9/20 ,  F21V21/00 ,  H05K1/0277 ,  H05K1/038 ,  H05K1/111 ,  H05K1/181 ,  H05K1/189 ,  H05K3/303 ,  H05K3/321 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2203/0152 ,  Y10T29/4913

    Abstract: A method of manufacturing an electronic textile (1) comprising the steps of: providing a textile carrier (2) comprising a plurality of conductor lines (6a-b); releasably attaching (101) the textile carrier (2) to a rigid support plate (20); providing (102) a conductive substance on the textile carrier (2) in a pattern forming a plurality of sets of connection pads (5a-b) on the textile carrier (2), each set of connection pads defining a component placement position for placement of an electronic component (3), and each set of connection pads (5a-b) comprising a connection pad overlapping one of the conductor lines, the connection pad having a connection pad length (Lcp) in a direction parallel to the conductor line and a connection pad width (Wcp) in a direction perpendicular to the conductor line, wherein the connection pad width (Wcp) is at least one percent of an extension (Wtc) of the textile carrier (2) in the direction perpendicular to the conductor line; automatically placing (103) electronic components (3) at the component placement positions; curing (104) the conductive substance to attach the electronic components (3) to the textile carrier (2), thereby forming the electronic textile (1) and removing (105) the electronic textile from the rigid support plate.

    Abstract translation: 一种制造电子织物的方法，包括以下步骤：提供包括多根导体线（6a-b）的织物载体（2）; 将所述织物载体（2）可释放地连接（101）到刚性支撑板（20）上; 在织物载体（2）上以形成多组连接垫（5a-b）的图案在纺织品载体（2）上提供（102）导电物质，每组连接垫限定用于放置的部件放置位置 和每组连接焊盘（5a-b），其包括与导线之一重叠的连接焊盘，所述连接焊盘在与导线平行的方向上具有连接焊盘长度（Lcp），并且 在垂直于导体线的方向上的连接焊盘宽度（Wcp），其中连接焊盘宽度（Wcp）在纺织品载体（2）的垂直于导体线的方向上的延伸部分（Wtc）的至少百分之一 ; 自动将电子部件（103）放置在部件放置位置; 固化（104）导电物质以将电子部件（3）附接到纺织品载体（2），从而形成电子织物（1）并从电子织物移除​​（105）电子织物。

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