ROTARY SILICON WAFER CLEANING APPARATUS
    84.
    发明公开
    ROTARY SILICON WAFER CLEANING APPARATUS 审中-公开
    转角的-SILIZIUMWAFER-REINIGUNGSVORRICHTUNG

    公开(公告)号:EP1544902A1

    公开(公告)日:2005-06-22

    申请号:EP03808884.5

    申请日:2003-09-11

    IPC分类号: H01L21/304

    CPC分类号: H01L21/67034 H01L21/02052

    摘要: A rotary silicon wafer cleaning apparatus capable of enhancing the stability of silicon wafer through perfecting of the hydrogen termination for silicon wafer having undergone cleaning operation with the use of chemicals and pure water. The rotary silicon wafer cleaning apparatus comprises a silicon wafer drying equipment, the silicon wafer drying equipment composed of a mixed gas heating unit for heating a mixed gas consisting of a hydrogen gas, the hydrogen gas containing gaseous hydrogen in an amount of 0.05 vol.% or more, and an inert gas and a hydrogen radical generating unit provided with a platinum coating film capable of forming hydrogen radicals at portion in contact with the heated mixed gas, wherein a mixed gas containing hydrogen radicals generated by the hydrogen radical generating unit is jetted on a rotating silicon wafer after cleaning operation so that the drying and hydrogen termination treatment of the external surface of silicon wafer are simultaneously carried out.

    摘要翻译: 一种旋转硅晶片清洁装置,其能够通过使用化学品和纯水完成已进行清洁操作的硅晶片的氢终端,从而提高硅晶片的稳定性。 旋转硅晶片清洁装置包括硅晶片干燥设备,硅晶片干燥设备由用于加热由氢气组成的混合气体的混合气体加热单元,含有0.05体积%的气态氢气的氢气, 以上的惰性气体和氢游离基发生单元,其具有能够与加热的混合气体接触的部分形成氢自由基的铂涂膜,其中喷射含有由氢自由基产生单元产生的氢自由基的混合气体 在清洁操作之后的旋转硅晶片上,从而同时进行硅晶片的外表面的干燥和氢终止处理。