公开(公告)号：EP2207244A3

公开(公告)日：2011-09-21

申请号：EP09001669.2

申请日：2009-02-04

Applicant: ERNI Electronics GmbH

Inventor： Lappöhn, Jürgen

IPC: H01R24/12

CPC classification number: H05K1/0219 ,  H01R12/716 ,  H01R12/724 ,  H01R13/6585 ,  H05K1/0237 ,  H05K3/308 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10189 ,  H05K2201/1059

Abstract: Die Erfindung betrifft einen mehrpoliger Steckverbinder (10a, 10b) zur Kontaktierung mit einer Multilayerplatine (40), der Signal-Kontakte (11a, 11b; 12a, 12b) aufweist, denen ein erstes und wenigstens ein zweites Abschirm-Kontaktelement (17a, 17b, 17a', 17b'; 18a, 18b, 18a', 18b') zugeordnet und benachbart zum Signal-Kontakt (11 a, 11 b; 12a, 12b) angeordnet sind. Der Steckverbinder (10a, 10b) zeichnet sich dadurch aus, dass zumindest auf der obersten Schicht (41) der Multilayerplatine (40) Ausnehmungen (54, 54', 54") vorgesehen sind, welche zur Aufnahme und Durchführung von wenigstens zwei Abschirm-Kontaktelementen (17a', 17b'; 18a, 18b) bemessen sind, die benachbarten Signal-Kontakten (11a, 11b; 12a, 12b) zugeordnet sind.

公开(公告)号：EP2330528A2

公开(公告)日：2011-06-08

申请号：EP10172139.7

申请日：2010-08-06

Applicant: NCR Corporation

Inventor： McNicoll, Grant ,  Walker, Ian ,  Harrow, Charles

IPC: G06F21/00

CPC classification number: G06F21/86 ,  G06F21/75 ,  G06Q20/4012 ,  H05K1/0275 ,  H05K1/11 ,  H05K1/185 ,  H05K3/4611 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10689 ,  H05K2203/063

Abstract: A secure circuit board assembly (10) is provided. The secure circuit board assembly (10) comprises: a control board (12) including a cryptographic processor (30); a spacer portion (14) mounted on the control board (12); and a lid (16) mounted on the spacer portion (14). The control board (12), the spacer portion (14), and the lid (16) collectively provide a secure enclosed chamber in which the cryptographic processor (30) is mounted. The spacer portion (14) provides protection against side-on attacks against the cryptographic processor (30).

Abstract translation: 提供可靠的电路板组件（10）。 该安全电路板组件（10）包括：包括密码处理器（30）的控制板（12）; 安装在控制板（12）上的隔离部分（14）; 和安装在隔离部分（14）上的盖子（16）。 控制板（12），隔离部分（14）和盖（16）共同提供安全密封处理器（30）安装在其中的安全封闭室。 间隔部分（14）提供防止对密码处理器（30）的侧面攻击的保护。

公开(公告)号：EP2100783A3

公开(公告)日：2011-05-18

申请号：EP09155248.9

申请日：2009-03-16

Applicant: Guardian Industries Corp.

Inventor： Veerasamy, Vijayen S.

IPC: B60S1/08 ,  B32B17/10 ,  G01D5/24 ,  G01N21/25 ,  H05K1/02

CPC classification number: B60S1/0825 ,  B32B17/10036 ,  B32B17/10174 ,  B32B17/10761 ,  B32B17/10788 ,  B60S1/0822 ,  B60S1/087 ,  G01D5/2405 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09663

Abstract: A system and/or method for sensing the presence of moisture (e.g., rain) and/or other material(s) on a window such as a vehicle window (e.g., vehicle windshield, sunroof or backlite). In certain example embodiments, a plurality of sensing capacitors are supported by a window such as a vehicle windshield, the capacitors each having a different field and/or pattern. A sensing circuit outputs an analog signal that is based on and/or related to the capacitances of one or more of the sensing capacitors. In certain example embodiments, a flexible printed circuit board (PCB) mountable in or on a vehicle window is provided. First and second sensing circuits are formed on opposing sides of the flexible PCB, with each said sensing circuit comprising a plurality of different fractal structures. A ground plane is located between the first and second sensing circuits, with the ground plane being arranged so as to decouple the first and second capacitor arrays and to shield the first capacitor array from fields emanating from the second capacitor array and vice versa. The electronic device is configured to detect moisture on an exterior surface of the vehicle window, humidity on an interior surface of the vehicle window, and EMI.

公开(公告)号：EP2123137B1

公开(公告)日：2011-01-05

申请号：EP08775569.0

申请日：2008-02-18

Applicant: Airbus Operations

Inventor： ORTET, Stéphane ,  REBEYROTTE, Vincent ,  ROUSSET, David

IPC: H05K1/02

CPC classification number: H05K1/0201 ,  H05K1/0209 ,  H05K1/0298 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09709 ,  H05K2201/09781

Abstract: The invention relates to an electronic card that comprises at least two superimposed conducting layers (2') with an insulation layer (3') between said two conducting layers (2'), said two conducting layers each having a utility conducting portion (7') and a conducting portion (6') at the periphery of said utility conducting portion (7') with an insulating portion (8') between said conducting portions (6', 7'), said insulating portion (8') of a first of said two layers (2') being offset relative to the insulating portion (8') of the second of said layers (2'). The aircraft includes a housing (10') in which at least one such card is provided.

公开(公告)号：EP1991040A3

公开(公告)日：2009-09-30

申请号：EP08155950.2

申请日：2008-05-09

Applicant: Nitto Denko Corporation

Inventor： Ishii, Jun ,  Yokai, Takahiko

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K1/0253 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/056 ,  H05K3/4644 ,  H05K2201/09081 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/0969

Abstract: The wired circuit board includes a metal supporting board, a metal foil formed on the metal supporting board, a first insulating layer formed on the metal supporting board so as to cover the metal foil, and a conductive pattern formed on the first insulating layer and having a plurality of wires. The metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction.

公开(公告)号：EP2086297A2

公开(公告)日：2009-08-05

申请号：EP09250033.9

申请日：2009-01-07

Applicant: Nitto Denko Corporation

Inventor： Ishimaru, Yasuto ,  Ebe, Hirofumi

IPC: H05K1/02 ,  H01L23/34

CPC classification number: H05K1/0209 ,  H01L23/3735 ,  H01L23/562 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/189 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10674 ,  Y10T29/49162

Abstract: A mounting region (S) is provided at an approximately center of one surface of an insulating layer (1). A conductive trace (2) is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer (4) is formed in the periphery of the mounting region so as to cover the conductive trace. A terminal (21) of the conductive trace is arranged in the mounting region, and a bump (5a) of an electronic component (5) is bonded to the terminal. A metal layer (3) made of copper, for example, is provided on the other surface of the insulating layer. A slit is formed in the metal layer so as to cross a region being opposite to the electronic component and to divide the metal layer.

Abstract translation: 安装区域（S）设置在绝缘层（1）的一个表面的大致中心处。 导电迹线（2）形成为从安装区域的内部向外延伸。 覆盖绝缘层（4）形成在安装区域的周边以覆盖导电迹线。 导电线路的端子（21）布置在安装区域中，并且电子部件（5）的凸块（5a）结合到端子。 例如由铜制成的金属层（3）设置在绝缘层的另一个表面上。 在金属层中形成狭缝以穿过与电子元件相对的区域并分割金属层。

公开(公告)号：EP1996954A2

公开(公告)日：2008-12-03

申请号：EP07751433.9

申请日：2007-02-22

Applicant: FormFactor, Inc.

Inventor： ELDRIDGE, Benjamin, N.

IPC: G01R31/02

CPC classification number: G01R1/07378 ,  G01R31/2889 ,  H05K1/0216 ,  H05K1/0298 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09672

Abstract: Systems and methods for providing a stack with a guard plane embedded in the stack are disclosed. An electrical apparatus can be made by forming a stack comprising an electrically conductive signal structure, an electrical guard structure, and an electrically insulating structure disposed between the signal structure and the guard structure. The signal structure, insulating structure, and guard structure can be aligned one with another in the stack.

公开(公告)号：EP1991040A2

公开(公告)日：2008-11-12

申请号：EP08155950.2

申请日：2008-05-09

Applicant: Nitto Denko Corporation

Inventor： Ishii, Jun ,  Yokai, Takahiko

IPC: H05K3/00

CPC classification number: H05K1/0253 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/056 ,  H05K3/4644 ,  H05K2201/09081 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/0969

Abstract: The wired circuit board includes a metal supporting board, a metal foil formed on the metal supporting board, a first insulating layer formed on the metal supporting board so as to cover the metal foil, and a conductive pattern formed on the first insulating layer and having a plurality of wires. The metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction.

Abstract translation: 布线电路基板具备金属支承基板，形成在该金属支承基板上的金属箔，以覆盖金属箔的方式形成在金属支承基板上的第一绝缘层，以及形成在第一绝缘层上的导电图案， 多根导线。 金属箔沿着每根电线的长度方向布置，以便不在厚度方向上与电线的一部分相对，并且在厚度方向上与电线的其余部分相对。

公开(公告)号：EP1648206B1

公开(公告)日：2007-09-19

申请号：EP05109146.0

申请日：2005-10-03

Applicant: MAGNETI MARELLI FRANCE

Inventor： Preteseille, Frédéric ,  Grohando, Claude

IPC: H05K1/02

CPC classification number: H05K1/0268 ,  G01R31/31905 ,  H05K1/11 ,  H05K2201/09663

公开(公告)号：EP1793658A1

公开(公告)日：2007-06-06

申请号：EP04799462.9

申请日：2004-11-02

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Fujikawa, Katsuhiko, c/o (A170) Intellectual Property Department ,  Tanaka, Koji, c/o (A170)Intellectual Property Department

IPC: H05K3/34

CPC classification number: H05K1/111 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09663 ,  H05K2201/10075 ,  H05K2201/10727 ,  Y02P70/611

Abstract: A wiring board module (10) includes a multilayer wiring board (11). On the mounting surface (11a) of the multilayer wiring board (11) are mounted, for example, a crystal oscillator (1) and an IC component (2). On the mounting surface (11a) are formed mounting lands (12) for the IC component (2), mounting lands (13) for the crystal oscillator (1), and mounting lands (14) for other surface mount components. Each mounting land (13) for the crystal oscillator (1) is not a conventional single large-area land but is composed of four adjacent land pieces (13a). The four land pieces (13a) are electrically connected via an external terminal (1a) of the crystal oscillator 1, thereby functioning as a mounting land for the external terminal (1a). In other words, each of the plurality of mounting lands (13) provided at positions corresponding to external terminals (1a) of the crystal oscillator (1) is divided into four land pieces (13a).

Abstract translation: 布线板模块（10）包括多层布线板（11）。 在多层布线基板（11）的安装面（11a）上安装有例如晶体振荡器（1）和IC部件（2）。 在安装面（11a）上形成用于IC部件（2）的安装台（12），用于晶体振荡器（1）的安装台（13）和用于其他表面安装部件的安装台面（14）。 用于晶体振荡器（1）的每个安装平台（13）不是传统的单个大面积焊盘，而是由四个相邻的焊盘（13a）组成。 四个接地片（13a）经由晶体振荡器1的外部端子（1a）电连接，从而用作外部端子（1a）的安装平台。 换句话说，设置在与晶体振荡器（1）的外部端子（1a）相对应的位置的多个安装平台（13）中的每一个被分成四个平台（13a）。