公开(公告)号：EP1830336A4

公开(公告)日：2009-08-05

申请号：EP05719375

申请日：2005-02-22

Applicant: FUJIFILM CORP

Inventor： SATOH TASUKU

IPC: G09F9/30 ,  G02F1/1333 ,  H01L51/00 ,  H05K1/00

CPC classification number: G02F1/133305 ,  G09F9/30 ,  H01L51/0097 ,  H01L51/52 ,  H01L2251/5338 ,  H05K1/0281 ,  H05K2201/09909 ,  H05K2201/2009 ,  Y02E10/549 ,  Y10T428/24355

Abstract: A deformation suppressing structure is formed on a surface of a flexible plate-like member. The deformation suppressing structure includes recesses and ridges formed on the surface of the plate-like material. The recesses and ridges are shaped such that, when the plate-like member is deformed within the region of elastic deformation, ridges adjacent to each other are in contact with each other to suppress further deformation. By this, excessive deformation that may cause permanent deformation is prevented and resistance to stress is enhanced. The flexible substrate can be used for an image display device having flexibility.

公开(公告)号：EP2027758A1

公开(公告)日：2009-02-25

申请号：EP07796115.9

申请日：2007-06-13

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： MAJUMDAR, Diptarka ,  FERGUSON, Saul

IPC: H05K1/16

CPC classification number: H05K1/162 ,  H05K1/092 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/017 ,  H05K2201/0355 ,  H05K2201/09763 ,  H05K2201/09909 ,  Y10T29/435 ,  Y10T29/49155

Abstract: Disclosed is an improved method of embedding capacitors in printed wiring boards (PWB) made from thick film dielectrics and electrodes, the method comprising the steps of : providing a metallic foil; forming a ceramic dielectric over the metallic foil; forming an electrode over most of said dielectric and at least a portion of said metallic foil; firing the capacitor structure under base metal firing conditions; and etching the metallic foil to form a second electrode. Further the method may comprise forming an insulating isolation layer over the metallic foil before forming the ceramic dielectric.

公开(公告)号：EP1926526A1

公开(公告)日：2008-06-04

申请号：EP06814978.0

申请日：2006-09-19

Applicant: Second Sight Medical Products, Inc.

Inventor： GREENBERG, Robert, J. ,  MCMAHON, Matthew, J. ,  LITTLE, James, Singleton ,  MCCLURE, Kelly, H. ,  MECH, Brian, V. ,  TALBOT, Neil, Hamiton ,  NEYSMITH, Jordan, M.

IPC: A61N1/36

CPC classification number: A61N1/0543 ,  A61N1/025 ,  A61N1/36046 ,  A61N1/37229 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/0014 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/09018 ,  H05K2201/09909 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/302

Abstract: Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. By applying the right amount of heat to a completed array, a curve can be induced. With a thermoplastic polymer it may be further advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius. Further, it is advantageous to add material along the edges. It is further advantageous to provide a fold or twist in the flexible circuit array. Additional material may be added inside and outside the fold to promote a good seal with tissue.

Abstract translation: 聚合物材料可用作神经刺激的电极阵列体。 它们特别适用于视网膜刺激以产生人造视觉，耳蜗刺激以产生人造听觉和皮质刺激以及许多相关目的。 通过电极阵列对视网膜或其他神经组织施加的压力至关重要。 太小的压力会导致电阻增加以及电场分散。 太多的压力可能会阻止血液流动。 通常的柔性电路制造技术通常需要使柔性电路电极阵列平坦。 由于神经组织几乎从不平坦，平面阵列必然会施加不均匀的压力。 此外，柔性电路聚合物阵列的边缘可以是尖锐的并切割精细的神经组织。 通过将适量的热应用于完整的阵列，可以诱导曲线。 对于热塑性聚合物，可以进一步有利的是在多个模具中反复加热柔性电路，每个模具具有减小的半径。 此外，沿着边缘添加材料是有利的。 在柔性电路阵列中提供折叠或扭曲是更有利的。 可以在折叠内部和外部添加附加材料以促进与组织的良好密封。

公开(公告)号：EP1830336A1

公开(公告)日：2007-09-05

申请号：EP05719375.7

申请日：2005-02-22

Applicant: FUJIFILM Corporation

Inventor： SATOH, Tasuku, c/o Fuji Film Corporation

IPC: G09F9/30

CPC classification number: G02F1/133305 ,  G09F9/30 ,  H01L51/0097 ,  H01L51/52 ,  H01L2251/5338 ,  H05K1/0281 ,  H05K2201/09909 ,  H05K2201/2009 ,  Y02E10/549 ,  Y10T428/24355

Abstract: An anti-deformation structure is formed on the surface of a flexible plate-shaped part. The anti-deformation structure includes protrusions and depressions formed on the surface of the plate-shaped part. The protrusions and depressions has a shape in which adjacent protrusions become in contact with each other in the state when the plate-shaped part is deformed within a range of elastic deformation, restricting further greater deformation, and thus, preventing excessive deformation leading to permanent deformation and raising the resistance to the stress. The flexible base material can be applied to flexible image-displaying devices.

Abstract translation: 在柔性板状部件的表面上形成抗变形结构。 抗变形结构包括形成在板状部分的表面上的突起和凹陷。 突起和凹陷具有在板状部在弹性变形的范围内变形的状态下相邻的突起彼此接触的形状，限制更大的变形，从而防止过度的变形导致永久变形 并提高对压力的抵抗力。 柔性基材可应用于柔性图像显示装置。

公开(公告)号：EP1791406A1

公开(公告)日：2007-05-30

申请号：EP06077047.6

申请日：2006-11-17

Applicant: Delphi Technologies, Inc.

Inventor： Chan, Su Liang ,  Nah, Chih Kai ,  Pan, Binghua ,  Schofield, Robert A. ,  Cheok, Cheng Gek ,  Chengalva, Mahesh K.

IPC: H05K3/30

CPC classification number: H05K3/303 ,  H05K1/0266 ,  H05K3/3452 ,  H05K2201/09909 ,  H05K2201/09936 ,  H05K2201/10727 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A composite standoff is formed on a circuit board during the processing of the circuit board while an array of electrical circuit traces including contact pads are formed, portions of the electrical circuit traces are covered by a solder mask, and legend ink is applied to the circuit board for locating electronic components on the circuit board without any need for an additional step.

Abstract translation: 在电路板的处理期间在电路板上形成复合间隔，同时形成包括接触焊盘的电路迹线阵列，电路迹线的一部分被焊接掩模覆盖，并且将传说墨施加到电路 用于在电路板上定位电子元件，而无需额外的步骤。

公开(公告)号：EP1755023A1

公开(公告)日：2007-02-21

申请号：EP05743287.4

申请日：2005-05-20

Applicant: NISSHA PRINTING CO., LTD.

Inventor： NISHIKAWA, Kazuhiro, c/o NISSHA PRINTING CO., LTD. ,  KAI, Yoshihiro, c/o NISSHA PRINTING CO., LTD. ,  NAKAMURA, Kazuto, c/o NISSHA PRINTING CO., LTD.

IPC: G06F3/033 ,  H01H9/02 ,  H01H13/70

CPC classification number: G06F3/045 ,  H01H13/785 ,  H01H2201/036 ,  H01H2207/00 ,  H05K1/116 ,  H05K3/4046 ,  H05K3/4069 ,  H05K2201/09909 ,  H05K2201/10416

Abstract: There is provided a touch panel capable of obtaining a stable connection resistance without requiring fitting accuracy at the time of the connection to an external terminal, and a protective panel for a display window of an electronic device using the same. The analog type touch panel includes a touch side substrate 2 and a non-touch side substrate 3 each having resistive films 2a, 3a provided on opposed inner surfaces thereof. Through-holes 4a, 4b, 4c, 4d formed at the periphery of the non-touch side substrate 3. A connecting part 5 for electrically connecting electrodes of the resistive films 2a, 3a to an external terminal, in which a conductive paste is injected into the through-holes and a rivet 14 is inserted into each of the through-holes from the lower surface side so that a head of the rivet 14 forms flat connecting electrodes 15a, 15b for connection to the external terminal on the lower surface of the non-touch side substrate 3.

Abstract translation: 提供了一种能够获得稳定的连接电阻而不需要在与外部端子连接时的配合精度的触摸面板，以及使用该触摸面板的电子设备的显示窗口的保护面板。 模拟型触摸面板包括在其相对的内表面上设置有电阻膜2a，3a的触摸侧基板2和非接触侧基板3。 形成在非接触侧基板3周边的通孔4a，4b，4c，4d。用于将电阻膜2a，3a的电极与外部端子电连接的连接部分5，其中注入导电浆料 并且铆钉14从下表面侧插入到每个通孔中，使得铆钉14的头部形成平坦的连接电极15a，15b，用于连接到外部端子的下表面 非接触侧基板3。

公开(公告)号：EP1194019B1

公开(公告)日：2006-12-13

申请号：EP00308655.0

申请日：2000-10-02

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Taylor, Russell ,  Copeland, Thomas

IPC: H05K3/28 ,  H05K3/34

CPC classification number: H05K3/284 ,  H05K3/325 ,  H05K3/3452 ,  H05K2201/09909

公开(公告)号：EP1198161B1

公开(公告)日：2006-06-21

申请号：EP00308917.4

申请日：2000-10-10

Applicant: MORTON INTERNATIONAL, INC.

Inventor： Carpenter, Richard W.

IPC: H05K3/00 ,  H05K1/16 ,  H01L21/68

CPC classification number: H01L21/6835 ,  H01L2221/68345 ,  H01L2924/19041 ,  H05K1/16 ,  H05K3/007 ,  H05K2201/09909 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/016

公开(公告)号：EP1653528A2

公开(公告)日：2006-05-03

申请号：EP05023648.8

申请日：2005-10-28

Applicant: SEIKO EPSON CORPORATION

Inventor： Sakai, Shinri ,  Hirai, Toshimitsu

IPC: H01L51/40

CPC classification number: H05K3/125 ,  H01L27/3244 ,  H01L51/0004 ,  H01L2924/0002 ,  H05K2201/09727 ,  H05K2201/09909 ,  H05K2203/013 ,  H01L2924/00

Abstract: A thin film pattern substrate, including an area provided to the substrate to form a recess and including a wider section and a linear section connected to the wider section, wherein the wider section having a width greater than the width of the linear section, and a thin film pattern provided on the area, wherein a mean diameter of the wider section is set to be no greater than double the width of the linear section.

Abstract translation: 一种薄膜图形基板，包括设置在基板上以形成凹部并且包括更宽部分的区域和连接到较宽部分的线性部分的区域，其中宽部分具有大于线性部分宽度的宽度，以及 设置在该区域上的薄膜图案，其中较宽部分的平均直径设定为不大于线性部分的宽度的两倍。

公开(公告)号：EP1632354A2

公开(公告)日：2006-03-08

申请号：EP05025554.6

申请日：2003-09-24

Applicant: Brother Kogyo Kabushiki Kaisha

Inventor： Shinkai, Yuji Technology Planning & IP Dept.

IPC: B41J2/14 ,  B41J2/16

CPC classification number: H05K3/363 ,  B41J2/14209 ,  B41J2/1609 ,  B41J2/1623 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14459 ,  B41J2002/14491 ,  B41J2202/20 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10977 ,  H05K2201/2036 ,  Y10T29/42 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49401

Abstract: A surface electrode is provided on a surface of a piezoelectric, element for changing the volume of each pressure chamber in an inkjet head. The surface electrode has a main electrode portion opposed to the pressure chamber and a connecting portion not opposed to the pressure chamber. A land is provided on one end of the connecting portion of the surface electrode. The land is electrically connected to the surface electrode. When the land is connected to a terminal of an FPC, a driving signal can be transmitted to the surface electrode. The land is therefore connected to the terminal using solder and a thermosetting resin covering the surface of the solder, or using only a thermosetting resin.

Abstract translation: 表面电极设置在用于改变喷墨头中的每个压力室的容积的压电元件的表面上。 表面电极具有与压力室相对的主电极部分和不与压力室相对的连接部分。 在表面电极的连接部分的一端上提供焊盘。 焊盘电连接到表面电极。 当焊盘连接到FPC的端子时，驱动信号可以传输到表面电极。 因此，焊盘使用覆盖焊料表面的焊料和热固性树脂或仅使用热固性树脂连接到端子。