公开(公告)号：EP2843697A3

公开(公告)日：2015-05-06

申请号：EP14179605.2

申请日：2014-08-01

申请人： Ubotic Company Limited

发明人： Fan, Chun Ho

IPC分类号： H01L23/047 ,  H01L23/10 ,  H01L21/50

CPC分类号： H01L23/49503 ,  H01L21/4825 ,  H01L21/50 ,  H01L21/565 ,  H01L21/78 ,  H01L23/047 ,  H01L23/10 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15747 ,  H01L2924/16251 ,  H01L2924/165 ,  H01L2924/1659 ,  H01L2924/167 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A cavity package is disclosed comprising a metal leadframe, a metal ring connected to the metal leadframe, a plastic body molded to the metal leadframe forming a substrate cavity including an exposed die attach pad of the leadframe for affixing a semiconductor device, exposed lead fingers of the leadframe for wire bonding to the semiconductor device and an external circuit, and an exposed top surface of the metal ring, and a metal cap for closing and encapsulating the substrate cavity. The metal ring is integrated into the pre-molded cavity leadframe for providing an electrical ground path from the metal cap to the die attach pad and permitting attachment of the metal cap to the pre-molded leadframe using solder reflow.

公开(公告)号：EP2843698A3

公开(公告)日：2015-04-01

申请号：EP14182490.4

申请日：2014-08-27

申请人： Ubotic Company Limited

发明人： Fan, Chun Ho

IPC分类号： H01L23/047 ,  H01L23/10 ,  H01L23/043 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L21/4828 ,  H01L21/4817 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/4839 ,  H01L21/52 ,  H01L23/04 ,  H01L23/047 ,  H01L23/10 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49582 ,  H01L23/49861 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00012

摘要： A cavity package is set forth along with a method of manufacturing thereof. The method comprises applying a selective plating resist to a metallic substrate in a pattern to expose portions for a ring, tie bars, die attach pad and input/output wire bonding pads; elective depositing of metal plating using the selective plating resist; removing the selective metal plating resist; applying a selective etching resist to the substrate; selectively etching portions of the substrate not covered by the selective etching resist; stripping away the selective etching resist; pre-molding a leadframe to the substrate so as to surround the die attach pad portion; etching the tie bars away from the bottom surface of the substrate; attaching a semiconductor device die to the die attach pad; wire bonding the semiconductor device to the input/output wire bonding pads; and attaching a cap to the ring portion of the substrate and the die attach pad to protect the wire bonded semiconductor device die and permit electrical grounding.

摘要翻译： 阐述了一种空腔封装及其制造方法。 该方法包括将选择性抗镀层以图案施加到金属衬底上以暴露环，连接条，管芯附着焊盘和输入/输出导线焊盘的部分; 使用选择性抗镀剂选择性沉积金属镀层; 去除选择性金属电镀抗蚀剂; 将选择性抗蚀剂涂覆到基板上; 选择性地蚀刻未被选择性抗蚀剂覆盖的基板部分; 剥去选择性抗蚀剂; 将引线框架预先模制到衬底以便围绕管芯附接垫部分; 将连接条从基底的底表面上蚀刻掉; 将半导体器件管芯附接到管芯附连焊盘; 将半导体器件引线键合到输入/输出引线键合焊盘; 以及将帽附接到衬底的环形部分和管芯附连垫以保护引线接合的半导体器件管芯并允许电接地。

公开(公告)号：EP4099383A1

公开(公告)日：2022-12-07

申请号：EP22176372.5

申请日：2022-05-31

申请人： Ubotic Company Limited

发明人： TAM, Ming-Wa ,  KWAN, Kenneth

IPC分类号： H01L23/552 ,  H01L21/50 ,  H01L23/047 ,  H01L23/10 ,  H01L23/495 ,  H01L23/498 ,  H01L23/00

摘要： A Faraday cage cavity package, having: a leadframe; a plastic body molded onto the leadframe to form a cavity exposing top surfaces of a die attach paddle, tie bars and lead fingers of the leadframe within the cavity; and a lid attached onto the top of the leadframe to protect a die attached to the die attach pad from electromagnetic fields, wherein the Faraday cage cavity package is manufactured in a matrix format and then separated into a plurality of individual Faraday cage cavity package units.

公开(公告)号：EP2843698A2

公开(公告)日：2015-03-04

申请号：EP14182490.4

申请日：2014-08-27

申请人： Ubotic Company Limited

发明人： Fan, Chun Ho

IPC分类号： H01L23/047 ,  H01L23/10

CPC分类号： H01L21/4828 ,  H01L21/4817 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/4839 ,  H01L21/52 ,  H01L23/04 ,  H01L23/047 ,  H01L23/10 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49582 ,  H01L23/49861 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00012

摘要： A cavity package is set forth along with a method of manufacturing thereof. The method comprises applying a selective plating resist to a metallic substrate in a pattern to expose portions for a ring, tie bars, die attach pad and input/output wire bonding pads; elective depositing of metal plating using the selective plating resist; removing the selective metal plating resist; applying a selective etching resist to the substrate; selectively etching portions of the substrate not covered by the selective etching resist; stripping away the selective etching resist; pre-molding a leadframe to the substrate so as to surround the die attach pad portion; etching the tie bars away from the bottom surface of the substrate; attaching a semiconductor device die to the die attach pad; wire bonding the semiconductor device to the input/output wire bonding pads; and attaching a cap to the ring portion of the substrate and the die attach pad to protect the wire bonded semiconductor device die and permit electrical grounding.

摘要翻译： 与其制造方法一起阐述了空腔包装。 该方法包括以图案向金属基底施加选择性电镀抗蚀剂，以露出用于环，连接条，管芯附着垫和输入/输出引线接合焊盘的部分; 使用选择性电镀抗蚀剂选择性沉积金属电镀; 去除选择性金属电镀抗蚀剂; 向所述基底施加选择性抗蚀剂; 选择性地蚀刻未被选择性蚀刻抗蚀剂覆盖的衬底的部分; 剥离选择性抗蚀剂; 将引线框预先模制到基板以围绕芯片附接焊盘部分; 将连接条蚀刻离开基板的底表面; 将半导体器件管芯附接到管芯附接焊盘; 将半导体器件引线接合到输入/输出引线接合焊盘; 并且将盖附接到基板的环部分和管芯附接垫以保护引线接合半导体器件管芯并允许电接地。

公开(公告)号：EP2843697A2

公开(公告)日：2015-03-04

申请号：EP14179605.2

申请日：2014-08-01

申请人： Ubotic Company Limited

发明人： Fan, Chun Ho

IPC分类号： H01L23/047 ,  H01L23/10 ,  H01L21/50

CPC分类号： H01L23/49503 ,  H01L21/4825 ,  H01L21/50 ,  H01L21/565 ,  H01L21/78 ,  H01L23/047 ,  H01L23/10 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15747 ,  H01L2924/16251 ,  H01L2924/165 ,  H01L2924/1659 ,  H01L2924/167 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A cavity package is disclosed comprising a metal leadframe, a metal ring connected to the metal leadframe, a plastic body molded to the metal leadframe forming a substrate cavity including an exposed die attach pad of the leadframe for affixing a semiconductor device, exposed lead fingers of the leadframe for wire bonding to the semiconductor device and an external circuit, and an exposed top surface of the metal ring, and a metal cap for closing and encapsulating the substrate cavity. The metal ring is integrated into the pre-molded cavity leadframe for providing an electrical ground path from the metal cap to the die attach pad and permitting attachment of the metal cap to the pre-molded leadframe using solder reflow.

摘要翻译： 公开了一种空腔封装，其包括金属引线框架，连接到金属引线框架的金属环，模制到金属引线框架的塑料体，形成衬底腔体，该衬底腔体包括用于固定半导体器件的引线框架的暴露管芯附接焊盘，暴露的引线指 用于引线结合到半导体器件的引线框架和外部电路以及金属环的暴露的顶表面，以及用于封闭和封装衬底腔的金属帽。 金属环集成到预成型腔引线框架中，用于提供从金属盖到管芯附接垫的电接地路径，并允许使用回流焊将金属帽附接到预成型的引线框架上。