公开(公告)号：EP1261016A4

公开(公告)日：2007-06-27

申请号：EP01980965

申请日：2001-11-02

申请人： EBARA CORP

发明人： NAKASUJI MAMORU ,  NOJI NOBUHARU ,  SATAKE TOHRU ,  HAMASHIMA MUNEKI ,  HATAKEYAMA MASAHIRO ,  WATANABE KENJI ,  KATO TAKAO ,  SOBUKAWA HIROSI ,  KARIMATA TSUTOMU ,  YOSHIKAWA SHOJI ,  KIMBA TOSHIFUMI ,  OOWADA SHIN ,  SAITO MUTSUMI

IPC分类号： G01N23/225 ,  H01J37/06 ,  H01J37/063 ,  H01J37/073 ,  H01J37/18 ,  H01J37/20 ,  H01J37/22 ,  H01J37/244 ,  H01J37/28 ,  H01J37/29 ,  H01L21/027 ,  H01L21/66

CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G01N23/225 ,  H01J37/06 ,  H01J37/063 ,  H01J37/073 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/244 ,  H01J37/28 ,  H01J37/3174 ,  H01J2237/0435 ,  H01J2237/0635 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/2446 ,  H01J2237/24485 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

摘要： An electron beam device for applying a primary electron beam onto a sample, and detecting a secondary electron beam produced from a sample surface by the irradiation to evaluate the sample surface, characterized in that the cathode of an electron gun for emitting primary electron beam have a plurality of emitters disposed at intervals on one circle centered on the optical axis of a primary electron optical system and emitting a primary electron beam, and the plurality of emitters are disposed so that points projected on a line parallel to the scanning direction of the primary electron beam are arranged at equal intervals.

公开(公告)号：EP1635374A4

公开(公告)日：2010-02-24

申请号：EP04729530

申请日：2004-04-26

申请人： EBARA CORP

发明人： NOJI NOBUHARU ,  SATAKE TOHRU ,  SOBUKAWA HIROSI ,  KIMBA TOSHIFUMI ,  HATAKEYAMA MASAHIRO ,  YOSHIKAWA SHOJI ,  MURAKAMI TAKESHI ,  WATANABE KENJI ,  KARIMATA TSUTOMU ,  SUEMATSU KENICHI ,  TABE YUTAKA ,  TAJIMA RYO ,  TOHYAMA KEIICHI

IPC分类号： G01B15/00 ,  G01N23/225 ,  G01N23/20 ,  H01J37/05 ,  H01J37/06 ,  H01J37/09 ,  H01J37/12 ,  H01J37/147 ,  H01J37/153 ,  H01J37/16 ,  H01J37/18 ,  H01J37/20 ,  H01J37/22 ,  H01J37/244 ,  H01J37/28 ,  H01J37/29 ,  H01L21/66

CPC分类号： G01N23/225 ,  H01J37/05 ,  H01J37/28 ,  H01J2237/2441 ,  H01J2237/2446 ,  H01J2237/2817

摘要： A system for further enhancing speed, i.e. improving throughput in a SEM-type inspection apparatus is provided. An inspection apparatus for inspecting a surface of a substrate produces a crossover from electrons emitted from an electron beam source 25·1, then forms an image under a desired magnification in the direction of a sample W to produce a crossover. When the crossover is passed, electrons as noises are removed from the crossover with an aperture, an adjustment is made so that the crossover becomes a parallel electron beam to irradiate the substrate in a desired sectional form. The electron beam is produced such that the unevenness of illuminance is 10% or less. Electrons emitted from the sample W are detected by a detector 25·11.

公开(公告)号：EP1914787A4

公开(公告)日：2009-11-25

申请号：EP06782616

申请日：2006-08-10

申请人： EBARA CORP

发明人： HATAKEYAMA MASAHIRO ,  YOSHIKAWA SHOJI ,  SUEMATSU KENICHI ,  KARIMATA TSUTOMU ,  NOJI NOBUHARU

IPC分类号： H01J37/244 ,  G01R31/302 ,  H01J37/29 ,  H01L21/66

CPC分类号： H01J37/261 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/2441 ,  H01J2237/2446

公开(公告)号：EP0757291A3

公开(公告)日：1998-11-18

申请号：EP96112285

申请日：1996-07-30

申请人： EBARA CORP

发明人： HATAKEYAMA MASAHIRO ,  TAKATOU CHIKAKO

IPC分类号： G21K1/00 ,  B23K15/00 ,  B23K17/00 ,  C23F4/00 ,  G03F7/20 ,  H01L21/302 ,  H05H3/02

CPC分类号： G03F7/2065

摘要： There are disclosed a processing method and a processing apparatus using a fast atom beam to process a micro-sized structure on a desired face and portion of a workpiece having a complex shape. In this invention, an electron beam and/or a focused ion beam is applied to a surface of a workpiece to produce a masking film layer on the workpiece. After that, a fast atom beam is applied to the workpiece remove the surface layer of the workpiece where the masking film layer is not formed.

公开(公告)号：EP1296352A4

公开(公告)日：2007-04-18

申请号：EP01945627

申请日：2001-06-27

申请人： EBARA CORP ,  TOSHIBA KK

发明人： NAKASUJI MAMORU ,  NOJI NOBUHARU ,  SATAKE TOHRU ,  HATAKEYAMA MASAHIRO ,  KIMBA TOSHIFUMI ,  SOBUKAWA HIROSI ,  YOSHIKAWA SHOJI ,  MURAKAMI TAKESHI ,  WATANABE KENJI ,  KARIMATA TSUTOMU ,  OOWADA SHIN ,  SAITO MUTSUMI ,  YAMAZAKI YUICHIRO ,  NAGAI TAKAMITSU ,  NAGAHAMA ICHIROTA

IPC分类号： G01N23/225 ,  H01J37/06 ,  H01J37/073 ,  H01J37/18 ,  H01J37/20 ,  H01J37/22 ,  H01J37/244 ,  H01J37/28 ,  H01J37/29 ,  G01B15/00 ,  H01L21/66

CPC分类号： H01J29/70 ,  G01N23/225 ,  G01N23/2251 ,  G01N23/227 ,  H01J37/06 ,  H01J37/073 ,  H01J37/141 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/244 ,  H01J37/266 ,  H01J37/28 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817 ,  H01L21/6719 ,  H01L21/67213

摘要： An electron beam inspection apparatus comprising an electrooptical unit (70) comprising an electrooptical system for irradiating an object with a primary electron beam from an electron source and projecting the image of secondary electrons emitted from the object and a detector for detecting the image of secondary electrons projected from the electrooptical system, a stage unit (50) for moving the object relatively to the electrooptical system while holding it a mini-environment unit (20) for blocking adhesion of dust to the object by supplying cleaning gas thereto, a working chamber (31) containing the stage unit and controllable to vacuum atmosphere, at least two loading chambers (41, 42) disposed between the mini-environment unit and the working chamber and controllable independently to vacuum atmosphere, and a loader (60) for feeding the object to the stage unit through the loading chambers.

公开(公告)号：EP1220272A4

公开(公告)日：2007-04-11

申请号：EP00946335

申请日：2000-07-14

申请人： EBARA CORP

发明人： HATAKEYAMA MASAHIRO ,  ICHIKI KATSUNORI ,  WATANABE KENJI ,  SATAKE TOHRU

IPC分类号： H01J27/16 ,  G21G4/02 ,  H01J37/08 ,  H01J37/32 ,  H05H3/00

CPC分类号： H01J37/32192 ,  H01J27/16 ,  H01J37/08 ,  H01J37/321 ,  H05H3/00

摘要： The invention provides an efficient beam source that produces a directional, high-density energy beam having a relatively large size. The beam source comprises three electrodes, i.e., an upstream electrode (23) located downstream from a gas entrance port (12) in a discharge tube (11) and having a large number of holes through gas passes, a meshed intermediate electrode (24), and a downstream electrode (14) having a large number of holes through which beams pass. Plasma means (20) for producing plasma is provided outside the discharge tube between the upstream and intermediate electrodes.

摘要翻译： 本发明提供了一种有效的光束源，其产生具有相对较大尺寸的定向的高密度能量束。 该束源包括三个电极，即位于放电管（11）中的气体入口（12）下游且具有通过气体通过的大量孔的上游电极（23），网状中间电极（24） 以及具有许多光束穿过的孔的下游电极（14）。 在上游电极和中间电极之间的放电管外部提供用于产生等离子体的等离子体装置（20）。

公开(公告)号：EP1703539A4

公开(公告)日：2009-07-08

申请号：EP04821103

申请日：2004-11-25

申请人： EBARA CORP

发明人： WATANABE KENJI ,  SATAKE TOHRU ,  NAKASUJI MAMORU ,  MURAKAMI TAKESHI ,  KARIMATA TSUTOMU ,  NOJI NOBUHARU ,  TOHYAMA KEIICHI ,  HATAKEYAMA MASAHIRO

IPC分类号： H01J37/29 ,  H01L21/66 ,  H01J37/073 ,  H01J37/12 ,  H01J37/147 ,  H01J37/26 ,  H01J37/28

CPC分类号： H01J37/261 ,  H01J37/28 ,  H01J2237/06341 ,  H01J2237/2446 ,  H01J2237/24592 ,  H01J2237/2538

摘要： An electron device capable of evaluating a sample at high throughput and high S/N. An electron beam emitted from an electron gun is irradiated, through an electrostatic lens (4-1), an objective lens (11-1), etc., in a diagonal direction on a sample (W) placed on an X-Y-theta stage (9-1), and secondary electrons or reflected electrons are discharged from the sample (W). The incident angle of the primary electron beam is set to about not less than 35º and less than 90º by controlling a polarizer (8-1). The electrons discharged from the sample (W) are guided in the vertical direction to form an image on a detector.

摘要翻译： 一种能够以高吞吐量和高信噪比评估样品的电子器件。 从电子枪发射的电子束通过静电透镜（4-1），物镜（11-1）等在对角线方向上放置在放置在XY-θ台上的样品（W）上 （9-1），从样品（W）排出二次电子或反射电子。 通过控制偏振器（8-1），一次电子束的入射角设定为不小于35°且小于90°。 从样品（W）排出的电子在垂直方向上被引导以在检测器上形成图像。

公开(公告)号：EP1495312A4

公开(公告)日：2008-12-17

申请号：EP03720920

申请日：2003-04-17

申请人： EBARA CORP

发明人： HATAKEYAMA MASAHIRO ,  WATANABE KENJI ,  MURAKAMI TAKESHI ,  SATAKE TOHRU ,  NOJI NOBUHARU

IPC分类号： G01N23/225 ,  G03F7/16 ,  H01L21/66 ,  G01N23/227 ,  H01J37/28

CPC分类号： G03F7/162 ,  G01N23/225 ,  H01J37/285 ,  H01J2237/204 ,  H01J2237/2812 ,  H01J2237/2814 ,  H01J2237/2855 ,  H01J2237/2857

摘要： The present invention provides a surface inspection method and apparatus for inspecting a surface of a sample, in which a resistive film is coated on the surface, and a beam is irradiated to the surface having the resistive film coated thereon, to thereby conduct inspection of the surface of the sample. In the surface inspection method of the present invention, a resistive film having an arbitrarily determined thickness t1 is first coated on a surface of a sample. Thereafter, a part of the resistive film having the arbitrarily determined thickness t1 is dissolved in a solvent, to thereby reduce the thickness of the resistive film to a desired level. This enables precise control of a value of resistance of the resistive film and suppresses distortion of an image to be detected.

公开(公告)号：EP1273907A4

公开(公告)日：2006-08-30

申请号：EP01980963

申请日：2001-11-02

申请人： EBARA CORP

发明人： NAKASUJI MAMORU ,  NOJI NOBUHARU ,  SATAKE TOHRU ,  HAMASHIMA MUNEKI ,  KIMBA TOSHIFUMI ,  HATAKEYAMA MASAHIRO ,  WATANABE KENJI ,  SOBUKAWA HIROSI ,  KARIMATA TSUTOMU ,  YOSHIKAWA SHOJI ,  OOWADA SHIN ,  SAITO MUTSUMI

IPC分类号： G01N23/225 ,  H01J37/06 ,  H01J37/073 ,  H01J37/18 ,  H01J37/20 ,  H01J37/22 ,  H01J37/244 ,  H01J37/28

CPC分类号： G01N23/225 ,  H01J37/06 ,  H01J37/073 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

摘要： A wafer inspecting instrument for inspecting a pattern formed on a wafer by irradiating the wafer with a charged particle beams. The wafer inspecting instrument comprises a charged particle beam generating means, a primary optical system including a means for irradiating a multi-aperture plate having a plurality of apertures with a charged particle beam generated from the beam generating means and for focusing a plurality of charged particle beams having passed through the apertures in the wafer surface, a secondary optical system which secondary charged particle beams radiated from the wafer enter, an electron beam apparatus including a detection system for detecting the secondary charged particle beam to output an electric signal and a processing control system for processing and evaluating the electric signal, a stage apparatus for holding and moving the wafer, and a working chamber which can be controlled to a desired atmosphere.

公开(公告)号：EP1271604A4

公开(公告)日：2005-05-25

申请号：EP01978999

申请日：2001-11-02

申请人： EBARA CORP ,  TOSHIBA KK

发明人： YAMAZAKI YUICHIRO ,  WATANABE KENJI ,  SOBUKAWA HIROSI ,  NOJI NOBUHARU ,  SATAKE TOHRU ,  YOSHIKAWA SHOJI ,  KARIMATA TSUTOMU ,  NAKASUJI MAMORU ,  HATAKEYAMA MASAHIRO ,  MURAKAMI TAKESHI ,  NAGAHAMA ICHIROTA ,  NAGAI TAKAMITSU ,  SUGIHARA KAZUYOSHI

IPC分类号： H01J37/22 ,  H01J37/244 ,  H01J37/28 ,  G01N23/225

CPC分类号： H01J37/28 ,  H01J37/224 ,  H01J37/244 ,  H01J2237/006 ,  H01J2237/20221 ,  H01J2237/2445 ,  H01J2237/2817

摘要： An electron beam inspecting apparatus is a map projection type and comprises a primary electro-optical system which molds an electron beam emitted from an electron gun into a rectangular form and irradiates the surface of a sample to be inspected with the molded electron beam, a secondary electro-optical system which converges secondary electrons emitted from the sample, a detector which converts the converged secondary electrons into an optical image via a fluorescent plate to focus them to a line sensor, and a controller which controls the charge transfer time to transfer a line image captured by a pixel array provided in the line sensor by interlocking with the transfer speed of stage which moves the sample.

摘要翻译： 图像投影类型的电子束检查系统包括：用于从在电子枪发射成矩形构型的电子束成形和施加成形电子束至试样表面待检查一次电子光学系统。 的二次电子光学系统会聚从样品发射的二次电子。 检测器通过荧光屏融合二次电子转换成光学图像上，并且所述图像聚焦到行传感器。 控制器控制在哪的拾取线图像中的每对线传感器设置相关联地用于移动样品的阶段的移动速度的相邻像素行的之间传送的线传感器的电荷转移时间。