-
公开(公告)号：EP1995439B1
公开(公告)日：2016-05-11
申请号：EP08009258.8
申请日：2008-05-20
申请人： Hitachi, Ltd.
CPC分类号： F02D41/20 , F02D41/3005 , F02D2041/2006 , F02D2400/18 , H01L25/162 , H01L25/165 , H01L2924/0002 , H01L2924/00
-
公开(公告)号：EP1931183A3
公开(公告)日：2009-09-30
申请号：EP07023165.9
申请日：2007-11-29
申请人： Hitachi, Ltd.
CPC分类号： H05K1/144 , H01L2924/0002 , H05K1/056 , H05K3/328 , H05K3/3447 , H05K3/368 , H05K3/4015 , H05K2201/042 , H05K2201/0979 , H05K2201/1028 , H05K2201/10303 , H05K2201/10318 , H05K2201/10856 , H05K2201/10924 , H05K2203/0285 , H01L2924/00
摘要： An electronic device of the present invention has a pair of joint pieces 2a, 2b formed on one end of its body and extending to both sides of the body. Both of these joint pieces 2a, 2b are connected to one substrates 5, 7 to improve the joining strength between a lead frame connector 1 and the substrate and ensure the reliability of electrical connection between the lead frame connector 1 and the substrate 5,7.
-
公开(公告)号：EP2101552B1
公开(公告)日：2014-05-07
申请号：EP08017982.3
申请日：2008-10-14
申请人： Hitachi Ltd.
IPC分类号： H05K3/30
CPC分类号： H05K1/119 , H05K1/0366 , H05K1/056 , H05K1/141 , H05K3/308 , H05K3/42 , H05K2201/09827 , H05K2201/09854 , H05K2201/10189 , H05K2201/10446 , H05K2201/1059 , H05K2201/10803 , Y10S439/941
-
公开(公告)号：EP2043416A3
公开(公告)日：2010-09-15
申请号：EP08014302.7
申请日：2008-08-11
申请人： Hitachi Ltd.
发明人： Tsuyuno, Nobutake , Yoshinari, Hideto , Hozoji, Hiroshi , Asano, Masahiko , Harada, Masahide , Kawakita, Shinya
IPC分类号： H05K7/20
CPC分类号： H05K7/20454 , H05K1/0203 , H05K1/141 , H05K7/20854 , H05K2201/10015 , H05K2201/1003 , H05K2201/10189 , H05K2201/10303 , H05K2201/1056 , Y10T29/49147
摘要： In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil (9) and a capacitor (8), the parts are installed on a support (1) that has a wiring (2), a terminal structure (3) and mechanically fixing portions (4); the leads of the above parts are respectively inserted in and electrically connected to holes (5) formed in the wiring portion of the support; the parts and the support are fixed to each other with an adhesion material (7) for fixation; the upper surfaces of the parts are attached to a metallic chasis (17) with a thermally conductive material (19) of a low elasticity modulus interposed in between; the mechanically fixing portions of the support are fixed to the metallic chasis; and the terminal structure of the support is electrically connected to a circuit board (14) that mounts at least a controlling element (15).
-
5.发明公开
公开(公告)号：EP1921911A1
公开(公告)日：2008-05-14
申请号：EP07021503.3
申请日：2007-11-05
申请人： Hitachi, Ltd.
IPC分类号： H05K7/20 , H01L23/433
CPC分类号： H05K7/209 , H01L23/3735 , H01L23/4334 , H01L23/49531 , H01L23/49811 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/16 , H01L2224/37099 , H01L2224/371 , H01L2224/37147 , H01L2224/3718 , H01L2224/37184 , H01L2224/37599 , H01L2224/40091 , H01L2224/40225 , H01L2224/45124 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01078 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A power module comprises a heat radiation layer (13) having the first main surface and the second main surface of reverse side opposed to the first main surface, an insulation layer (12) disposed on the first main surface of a radiation layer, a wiring potion for current circuit (11) disposed on the insulation layer and a plurality of switching elements (10) disposed on the insulation layer and electrically connected to the wiring portion of current circuit. A plurality of external terminals (20) are electrically connected to the wiring portions of current circuit. Furthermore, the module has a resin (2) sealing all of the insulation layer, a wiring portion for current circuit, switching elements and the first main surface of the radiation layer, and a resin sealing a portion of the second main surface of the radiation layer with the resin.
摘要翻译： 功率模块包括具有与第一主表面相对的第一主表面和反向第二主表面的散热层（13），设置在辐射层的第一主表面上的绝缘层（12），布线 设置在绝缘层上的电流电路（11）的药液和设置在绝缘层上并电连接到电流回路的配线部分的多个开关元件（10）。 多个外部端子（20）电连接到电流电路的布线部分。 此外，模块具有密封绝缘层全部的树脂（2），电流电路用配线部，开关元件以及辐射层的第一主面，树脂密封辐射的第二主面的一部分 层与树脂。
-
公开(公告)号：EP2107864B1
公开(公告)日：2016-07-27
申请号：EP09001970.4
申请日：2009-02-12
申请人： Hitachi, Ltd.
CPC分类号： H05K7/026 , H05K7/20854
-
公开(公告)号：EP2101552B8
公开(公告)日：2014-10-08
申请号：EP08017982.3
申请日：2008-10-14
申请人： Hitachi, Ltd.
IPC分类号： H05K3/30
CPC分类号： H05K1/119 , H05K1/0366 , H05K1/056 , H05K1/141 , H05K3/308 , H05K3/42 , H05K2201/09827 , H05K2201/09854 , H05K2201/10189 , H05K2201/10446 , H05K2201/1059 , H05K2201/10803 , Y10S439/941
-
公开(公告)号：EP2101552A3
公开(公告)日：2012-10-17
申请号：EP08017982.3
申请日：2008-10-14
申请人： Hitachi Ltd.
IPC分类号： H05K3/30
CPC分类号： H05K1/119 , H05K1/0366 , H05K1/056 , H05K1/141 , H05K3/308 , H05K3/42 , H05K2201/09827 , H05K2201/09854 , H05K2201/10189 , H05K2201/10446 , H05K2201/1059 , H05K2201/10803 , Y10S439/941
摘要： In a module, press-fit connection using a pin terminal (1) including a connection part (2) separated into two parts and a flat plane (2a) parallel to the lengthwise direction in the separation part and perpendicular to the separation direction of the pin terminal (1) is performed. A through-hole of a board is structured so that (1) an inner diameter of the through-hole at a middle part in the thickness direction of the board is smaller than that at obverse and reverse surfaces of the board (4) and (2) the length of the middle part of the through-hole connected to the pin terminal (1) is shorter than the length of the flat plane (2a) of the pin terminal (1).
-
公开(公告)号：EP1931183B1
公开(公告)日：2013-11-06
申请号：EP07023165.9
申请日：2007-11-29
申请人： Hitachi, Ltd.
CPC分类号： H05K1/144 , H01L2924/0002 , H05K1/056 , H05K3/328 , H05K3/3447 , H05K3/368 , H05K3/4015 , H05K2201/042 , H05K2201/0979 , H05K2201/1028 , H05K2201/10303 , H05K2201/10318 , H05K2201/10856 , H05K2201/10924 , H05K2203/0285 , H01L2924/00
-
公开(公告)号：EP2043416B1
公开(公告)日：2013-10-16
申请号：EP08014302.7
申请日：2008-08-11
申请人： Hitachi, Ltd.
发明人： Tsuyuno, Nobutake , Yoshinari, Hideto , Hozoji, Hiroshi , Asano, Masahiko , Harada, Masahide , Kawakita, Shinya
IPC分类号： H05K7/20
CPC分类号： H05K7/20454 , H05K1/0203 , H05K1/141 , H05K7/20854 , H05K2201/10015 , H05K2201/1003 , H05K2201/10189 , H05K2201/10303 , H05K2201/1056 , Y10T29/49147
-
-
-
-
-
-
-
-
-
搜索结果
17 条记录 (耗时 0.011 秒)
