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    THROUGH-BODY-VIA ISOLATED COAXIAL CAPACITOR AND TECHNIQUES FOR FORMING SAME
    1.
    发明公开
    THROUGH-BODY-VIA ISOLATED COAXIAL CAPACITOR AND TECHNIQUES FOR FORMING SAME 审中-公开
    KÖRPERDURCHGANGSISOLIERTERKOAXIALER KONDENSATOR UND VERFAHREN ZUR HERSTELLUNG DAVON

    公开(公告)号：EP3087604A4

    公开(公告)日：2017-09-06

    申请号：EP13900035

    申请日：2013-12-23

    Applicant: INTEL CORP

    Inventor： LEE KEVIN J ,  SARASWAT RUCHIR ,  ZILLMANN UWE ,  COWLEY NICHOLAS P ,  SCHAEFER ANDRE ,  JAIN RINKLE ,  DROEGE GUIDO

    IPC: H01L27/108

    CPC classification number: H01L23/5223 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/4875 ,  H01L21/76898 ,  H01L21/8221 ,  H01L23/481 ,  H01L23/492 ,  H01L23/498 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L25/0657 ,  H01L27/0629 ,  H01L28/90 ,  H01L2225/06544 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Techniques are disclosed for forming a through-body-via (TBV) isolated coaxial capacitor in a semiconductor die. In some embodiments, a cylindrical capacitor provided using the disclosed techniques may include, for example, a conductive TBV surrounded by a dielectric material and an outer conductor plate. The TBV and outer plate can be formed, for example, so as to be self-aligned with one another in a coaxial arrangement, in accordance with some embodiments. The disclosed capacitor may extend through the body of a host die such that its terminals are accessible on the upper and/or lower surfaces thereof. Thus, in some cases, the host die can be electrically connected with another die to provide a die stack or other three-dimensional integrated circuit (3D IC), in accordance with some embodiments. In some instances, the disclosed capacitor can be utilized, for example, to provide integrated capacitance in a switched-capacitor voltage regulator (SCVR).

    Abstract translation: 公开了用于在半导体管芯中形成贯穿本体通孔（TBV）的隔离同轴电容器的技术。 在一些实施例中，使用所公开的技术提供的圆柱形电容器可以包括例如由电介质材料和外导体板围绕的导电TBV。 根据一些实施例，TBV和外板可以例如形成为以同轴布置彼此自对准。 所公开的电容器可以延伸穿过主芯片的主体，使得其端子在其上表面和/或下表面可触及。 因此，在一些情况下，根据一些实施例，主芯片可以与另一芯片电连接以提供芯片堆叠或其他三维集成电路（3D IC）。 在一些情况下，所公开的电容器可以用于例如在开关电容器电压调节器（SCVR）中提供集成电容。

    WEARABLE DEVICE WITH POWER STATE CONTROL
    2.
    发明公开
    WEARABLE DEVICE WITH POWER STATE CONTROL 审中-公开

    公开(公告)号：EP3230821A4

    公开(公告)日：2018-06-20

    申请号：EP15867248

    申请日：2015-09-17

    Applicant: INTEL CORP

    Inventor： COWLEY NICHOLAS P ,  SARASWAT RUCHIR ,  GOLDMAN RICHARD J

    IPC: G06F1/26 ,  G06F1/16

    CPC classification number: G06F1/163 ,  G06F1/1635 ,  G06F1/26 ,  G06F1/3206 ,  G06F1/3215 ,  G06F3/0414 ,  H01L41/113 ,  H02N2/181

    Abstract: Embodiments of the present disclosure provide techniques and configurations for a wearable device with power state control. In one instance, the device a functional module to operate in a first power state or in a second power state that is different from the first power state; a power source coupled with the functional module to provide operational power to the functional module; and a power state control module coupled with the functional module, to cause the functional module to transition from the first power state to the second power state in response to an input. The power state control module may comprise a power generating device to generate power responsive to the input, independent of the power source, and in response to the generated power, cause the functional module to transition from the first power state to the second power state. Other embodiments may be described and/or claimed.

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