公开(公告)号：EP2220678A4

公开(公告)日：2012-04-25

申请号：EP08756454

申请日：2008-05-29

Applicant: OCCAM PORTFOLIO LLC

Inventor： FJELSTAD JOSEPH C

IPC: H05K1/18 ,  H05K1/14

CPC classification number: H05K1/144 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/3025 ,  H05K1/0207 ,  H05K1/185 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/1056 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP2353179A4

公开(公告)日：2012-10-03

申请号：EP09821348

申请日：2009-10-16

Applicant: OCCAM PORTFOLIO LLC

Inventor： FJELSTAD JOSEPH C

IPC: H01L21/60

CPC classification number: H05K1/189 ,  H01L21/568 ,  H01L24/31 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/09481 ,  H05K2203/1316 ,  H05K2203/1469 ,  Y10T156/10 ,  Y10T156/1057 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2208223A4

公开(公告)日：2012-05-30

申请号：EP08781591

申请日：2008-07-10

Applicant: OCCAM PORTFOLIO LLC

Inventor： FJELSTAD JOSEPH C

IPC: H05K1/18 ,  H01L23/538

CPC classification number: H05K1/188 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24195 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H05K1/185 ,  H05K3/06 ,  H05K3/061 ,  H05K3/284 ,  H05K3/323 ,  H05K2201/0355 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49169 ,  Y10T428/24612 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.

Abstract translation: 一种用于制造电子部件和组件的组件的方法，其中电子部件具有部件端子。 提供具有第一侧和第二侧的导电孔。 然后使用各向异性导体将元件端子连接到穹顶的第一侧。 一种模式适用于所述穹隆的第二面。 并且基于图案去除穹隆的部分，使得所述穹形的剩余部分形成将元件端子互连的电路。