-
公开(公告)号：EP2803094B1
公开(公告)日：2017-06-14
申请号：EP13706320.2
申请日：2013-01-12
申请人： Robert Bosch GmbH , Chen, Po-Jui , Feyh, Ando , O'Brien, Gary
发明人： CHEN, Po-Jui , FEYH, Ando , O'BRIEN, Gary
IPC分类号： H01L41/047 , H01L41/09 , H01L41/113 , G01L1/16
CPC分类号： H01L41/096 , G01L1/16 , H01L41/047 , H01L41/094 , H01L41/1132 , Y10T29/42
-
公开(公告)号：EP2943799A1
公开(公告)日：2015-11-18
申请号：EP13814290.6
申请日：2013-11-27
申请人： Robert Bosch GmbH , Feyh, Ando , Chen, Po-Jui
发明人： FEYH, Ando , CHEN, Po-Jui
IPC分类号： G01P1/02 , G01P15/125 , G01P15/18 , G01C19/5755 , G01C19/5769 , B81B7/00 , G01P15/08
CPC分类号： G01C19/5712 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/053 , G01C19/5755 , G01C19/5769 , G01C25/00 , G01P15/123 , G01P15/125 , G01P15/18 , G01P2015/0808 , G01P2015/0814 , G01P2015/0848 , G01P2015/0882 , Y10T29/42
摘要： A sensing assembly device includes a substrate, a chamber above the substrate, a first piezoelectric gyroscope sensor positioned within the chamber, and a first accelerometer positioned within the chamber.
摘要翻译： 感测组件装置包括衬底，位于衬底上方的腔室，位于室内的第一压电陀螺仪传感器和位于腔室内的第一加速计。
-
公开(公告)号：EP2909591A1
公开(公告)日：2015-08-26
申请号：EP13786040.9
申请日：2013-10-16
申请人： Robert Bosch GmbH , Feyh, Ando, Lars , Chen, Po-Jui , Purkl, Fabian , Yama, Gary , O'Brien, Gary
发明人： FEYH, Ando Lars , CHEN, Po-Jui , PURKL, Fabian , YAMA, Gary , O'BRIEN, Gary
摘要： A semiconductor device includes a substrate, suspension structures extending from the upper surface of the substrate, and an absorber stack attached to the substrate by the suspension structures. The suspension structures suspend the absorber stack over the substrate such that a gap is defined between the absorber stack and the substrate. The absorber stack includes a plurality of metallization layers interleaved with a plurality of insulating layers. At least one of the metallization layers has a thickness of approximately 10nm or less.
-
公开(公告)号：EP2803094A1
公开(公告)日：2014-11-19
申请号：EP13706320.2
申请日：2013-01-12
申请人： Robert Bosch GmbH , Chen, Po-Jui , Feyh, Ando , O'Brien, Gary
发明人： CHEN, Po-Jui , FEYH, Ando , O'BRIEN, Gary
IPC分类号： H01L41/047 , H01L41/09 , H01L41/113
CPC分类号： H01L41/096 , G01L1/16 , H01L41/047 , H01L41/094 , H01L41/1132 , Y10T29/42
摘要： In one embodiment, a method of deforming a MEMS structure includes providing a base layer (102), providing a first piezoelectric slab (106, 108, 110, 112) operably connected to a surface of the base layer (102), determining a desired deformation of the base layer, applying a first potential to a first electrode operably connected to the first piezoelectric slab, applying a second potential to a second electrode operably connected to the first piezoelectric slab (106, 108, 110, 112), and deforming the base layer (102) with the first piezoelectric slab (106, 108, 110, 112) using the applied first potential and the applied second potential based upon the determined desired deformation.
-
公开(公告)号：EP2879988B1
公开(公告)日：2018-04-04
申请号：EP13829083.8
申请日：2013-07-31
申请人： Robert Bosch GmbH , Chen, Po-Jui , Yama, Gary , Liger, Matthieu , Graham, Andrew
发明人： CHEN, Po-Jui , YAMA, Gary , LIGER, Matthieu , GRAHAM, Andrew
IPC分类号： B81B7/02 , B81C1/00 , G01P15/08 , G01P15/18 , G01C19/5783
CPC分类号： H01L29/84 , B81B2201/0235 , B81B2201/0242 , B81B2207/015 , B81C1/0023 , B81C2201/0197 , B81C2203/0136 , B81C2203/0771 , G01C19/5783 , G01P15/0802 , G01P15/18 , H01L29/66007
摘要： A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the second functional layer including a second device portion, and a second encapsulating layer encapsulating the second functional layer.
-
公开(公告)号：EP2879988A2
公开(公告)日：2015-06-10
申请号：EP13829083.8
申请日：2013-07-31
申请人： Robert Bosch GmbH , Chen, Po-Jui , Yama, Gary , Liger, Matthieu , Graham, Andrew
发明人： CHEN, Po-Jui , YAMA, Gary , LIGER, Matthieu , GRAHAM, Andrew
CPC分类号： H01L29/84 , B81B2201/0235 , B81B2201/0242 , B81B2207/015 , B81C1/0023 , B81C2201/0197 , B81C2203/0136 , B81C2203/0771 , G01C19/5783 , G01P15/0802 , G01P15/18 , H01L29/66007
摘要： A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the second functional layer including a second device portion, and a second encapsulating layer encapsulating the second functional layer.
摘要翻译： 具有多个封装功能层的器件包括衬底，位于衬底顶表面上方的第一功能层，功能层包括第一器件部分，封装第一功能层的第一封装层，以及位于第一功能层上方的第二功能层 第一封装层，第二功能层包括第二器件部分和封装第二功能层的第二封装层。
-
7.发明公开SENSOR DEVICE COMPRISING INERTIAL SENSOR MODULES USING MOVING-GATE TRANSDUCERS AND A D OF MANUFACTURING SUCH INERTIAL SENSOR MODULES 审中-公开与MOVING GATE转换器和用于制备这种惯性传感器模块惯性传感器模块传感器装置
公开(公告)号：EP2965094A1
公开(公告)日：2016-01-13
申请号：EP13814297.1
申请日：2013-12-02
申请人： Robert Bosch GmbH , Feyh, Ando
发明人： FEYH, Ando , CHEN, Po-Jui
CPC分类号： G01P15/08 , B81B7/02 , B81B2201/0235 , B81B2207/015 , G01C19/5783 , G01P15/0802 , G01P15/105 , G01P15/124 , G01P15/18 , G01P2015/0865
摘要： A sensor device includes a first CMOS chip and a second CMOS chip with a first moving-gate transducer formed in the first CMOS chip for implementing a first 3-axis inertial sensor and a second moving-gate transducer formed in the second CMOS chip for implementing a second 3-axis inertial sensor. An ASIC for evaluating the outputs of the first 3-axis inertial sensor and the second 3-axis inertial sensor is distributed between the first CMOS chip and the second CMOS chip.
-
公开(公告)号：EP2965094B1
公开(公告)日：2019-02-20
申请号：EP13814297.1
申请日：2013-12-02
申请人： Robert Bosch GmbH
发明人： FEYH, Ando , CHEN, Po-Jui
IPC分类号： G01P15/12 , G01P15/18 , G01P15/105 , G01P15/08 , B81B7/02 , G01C19/5783
-
公开(公告)号：EP2943799B1
公开(公告)日：2019-02-20
申请号：EP13814290.6
申请日：2013-11-27
申请人： Robert Bosch GmbH
发明人： FEYH, Ando , CHEN, Po-Jui
IPC分类号： G01C19/5755 , G01P15/125 , G01P15/18 , G01C19/5769 , B81B7/02 , G01P15/08 , G01P15/12
-
-
-
-
-
-
-
-
搜索结果
9 条记录 (耗时 0.014 秒)
