-
公开(公告)号:EP2803094B1
公开(公告)日:2017-06-14
申请号:EP13706320.2
申请日:2013-01-12
申请人: Robert Bosch GmbH , Chen, Po-Jui , Feyh, Ando , O'Brien, Gary
发明人: CHEN, Po-Jui , FEYH, Ando , O'BRIEN, Gary
IPC分类号: H01L41/047 , H01L41/09 , H01L41/113 , G01L1/16
CPC分类号: H01L41/096 , G01L1/16 , H01L41/047 , H01L41/094 , H01L41/1132 , Y10T29/42
-
公开(公告)号:EP2943799A1
公开(公告)日:2015-11-18
申请号:EP13814290.6
申请日:2013-11-27
申请人: Robert Bosch GmbH , Feyh, Ando , Chen, Po-Jui
发明人: FEYH, Ando , CHEN, Po-Jui
IPC分类号: G01P1/02 , G01P15/125 , G01P15/18 , G01C19/5755 , G01C19/5769 , B81B7/00 , G01P15/08
CPC分类号: G01C19/5712 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/053 , G01C19/5755 , G01C19/5769 , G01C25/00 , G01P15/123 , G01P15/125 , G01P15/18 , G01P2015/0808 , G01P2015/0814 , G01P2015/0848 , G01P2015/0882 , Y10T29/42
摘要: A sensing assembly device includes a substrate, a chamber above the substrate, a first piezoelectric gyroscope sensor positioned within the chamber, and a first accelerometer positioned within the chamber.
摘要翻译: 感测组件装置包括衬底,位于衬底上方的腔室,位于室内的第一压电陀螺仪传感器和位于腔室内的第一加速计。
-
公开(公告)号:EP2803094A1
公开(公告)日:2014-11-19
申请号:EP13706320.2
申请日:2013-01-12
申请人: Robert Bosch GmbH , Chen, Po-Jui , Feyh, Ando , O'Brien, Gary
发明人: CHEN, Po-Jui , FEYH, Ando , O'BRIEN, Gary
IPC分类号: H01L41/047 , H01L41/09 , H01L41/113
CPC分类号: H01L41/096 , G01L1/16 , H01L41/047 , H01L41/094 , H01L41/1132 , Y10T29/42
摘要: In one embodiment, a method of deforming a MEMS structure includes providing a base layer (102), providing a first piezoelectric slab (106, 108, 110, 112) operably connected to a surface of the base layer (102), determining a desired deformation of the base layer, applying a first potential to a first electrode operably connected to the first piezoelectric slab, applying a second potential to a second electrode operably connected to the first piezoelectric slab (106, 108, 110, 112), and deforming the base layer (102) with the first piezoelectric slab (106, 108, 110, 112) using the applied first potential and the applied second potential based upon the determined desired deformation.
-
公开(公告)号:EP2938979A1
公开(公告)日:2015-11-04
申请号:EP13821755.9
申请日:2013-12-20
申请人: Robert Bosch GmbH , Samarao, Ashwin , O'Brien, Gary , Feyh, Ando , Yama, Gary , Purkl, Fabian
发明人: SAMARAO, Ashwin , O'BRIEN, Gary , FEYH, Ando , YAMA, Gary , PURKL, Fabian
CPC分类号: G01J5/0815 , G01J5/025 , G01J5/0806 , G01J5/20 , G01J2005/0077
摘要: A portable thermal imaging system includes a portable housing configured to be carried by a user, a bolometer sensor assembly supported by the housing and including an array of thermal sensor elements and at least one plasmonic lens, a memory including program instructions, and a processor operably connected to the memory and to the sensor, and configured to execute the program instructions to obtain signals from each of a selected set of thermal sensor elements of the array of thermal sensor elements, assign each of the obtained signals with a respective color data associated with a temperature of a sensed object, and render the color data.
-
公开(公告)号:EP3031092A1
公开(公告)日:2016-06-15
申请号:EP14834944.2
申请日:2014-08-08
发明人: SAMARAO, Ashwin, K. , O'BRIEN, Gary , FEYH, Ando
IPC分类号: H01M4/38 , H01M10/0562 , H01M10/0525
CPC分类号: H01M4/366 , C23C16/045 , C23C16/403 , C23C16/45555 , C23C16/52 , H01M4/0428 , H01M4/134 , H01M4/382 , H01M4/386 , H01M10/0525 , H01M10/0562 , H01M10/058 , H01M2004/021 , H01M2220/20 , H01M2220/30 , H01M2300/0071 , H01M2300/0094 , Y02E60/122 , Y02T10/7011
摘要: A Li-ion battery in one embodiment includes a lithium based compound in a cathode, a first porous silicon portion in an anode, and a layer of atomic layer deposited (ALD) alumina coating the first porous silicon portion and contacting the cathode.
摘要翻译: 在一个实施方案中,锂离子电池包括阴极中的锂基化合物,阳极中的第一多孔硅部分和涂覆第一多孔硅部分并接触阴极的原子层沉积(ALD)氧化铝层。
-
公开(公告)号:EP2986959A1
公开(公告)日:2016-02-24
申请号:EP13821342.6
申请日:2013-12-20
申请人: Robert Bosch GmbH , Purkl, Fabian , Yama, Gary , Feyh, Ando , Graham, Andrew , Samarao, Ashwin , O'Brien, Gary
发明人: PURKL, Fabian , YAMA, Gary , FEYH, Ando , GRAHAM, Andrew , SAMARAO, Ashwin , O'BRIEN, Gary
CPC分类号: H01L31/0203 , G01J5/045 , G01J5/20 , H01L31/09 , H01L31/18
摘要: A method of fabricating a bolometer infrared sensor includes depositing a first sacrificial layer on a surface of a substrate over a sensor region, and forming an absorber structure for the infrared sensor on top of the first sacrificial layer. A second sacrificial layer is deposited on top of the absorber structure. An encapsulating thin film is then deposited on top of the second sacrificial layer. Vent holes are formed in the encapsulating thin film. The first and the second sacrificial layers are removed below the encapsulating thin film to release the absorber structure and form a cavity above the sensing region that extends down to the substrate in which the absorber structure is located via the vent holes. The vent holes are then closed in a vacuum environment to seal the absorber structure within the cavity.
-
公开(公告)号:EP2943765A1
公开(公告)日:2015-11-18
申请号:EP13811679.3
申请日:2013-11-27
申请人: Robert Bosch GmbH , O'Brien, Gary , Feyh, Ando , Graham, Andrew
发明人: O' BRIEN, Gary , FEYH, Ando , GRAHAM, Andrew
CPC分类号: G01L9/14 , G01L1/142 , G01L9/0073 , G01L9/12 , G01L19/069
摘要: A pressure sensor assembly includes a pressure sensor die and a circuit die. The pressure sensor die includes a MEMS pressure sensor and an electromagnetic shield layer. The circuit die includes an ASIC configured to generate an electrical output corresponding to a pressure sensed by the MEMS pressure sensor. The ASIC is electrically connected to the pressure sensor die. The electromagnetic shield is configured to shield the MEMS pressure sensor and the ASIC from electromagnetic radiation.
-
公开(公告)号:EP2912426B1
公开(公告)日:2019-08-07
申请号:EP13788852.5
申请日:2013-10-25
-
公开(公告)号:EP2984474A1
公开(公告)日:2016-02-17
申请号:EP13821548.8
申请日:2013-12-17
申请人: Robert Bosch GmbH , Feyh, Ando , Graham, Andrew , Samarao, Ashwin , Yama, Gary , O'Brien, Gary
发明人: FEYH, Ando , GRAHAM, Andrew , SAMARAO, Ashwin , YAMA, Gary , O'BRIEN, Gary
IPC分类号: G01N27/12
CPC分类号: G01N27/121
摘要: A semiconductor device includes a substrate, an insulating film provided on a surface of the substrate, and a sensing film formed of a conductive material deposited on top of the insulating film. The sensing film defines at least one conductive path between a first position and a second position on the insulating film. A first circuit connection is electrically connected to the sensing film at the first position on the insulating layer, and a second circuit connection is electrically connected to the sensing film at the second position. A control circuit is operatively connected to the first circuit connection and the second circuit connection for measuring an electrical resistance of the sensing film. The sensing film has a thickness that enables a resistivity of the sensing film to be altered predictably in a manner that is dependent on ambient moisture content.
摘要翻译: 半导体器件包括衬底,设置在衬底的表面上的绝缘膜和由沉积在绝缘膜的顶部上的导电材料形成的感测膜。 感测膜限定绝缘膜上的第一位置和第二位置之间的至少一个导电路径。 第一电路连接在绝缘层上的第一位置电连接到感测膜,并且第二电路连接在第二位置电连接到感测膜。 控制电路可操作地连接到第一电路连接和用于测量感测膜的电阻的第二电路连接。 感测膜具有能够以取决于环境水分含量的方式预测地改变感测膜的电阻率的厚度。
-
公开(公告)号:EP2974046A1
公开(公告)日:2016-01-20
申请号:EP14769253.7
申请日:2014-03-07
申请人: Robert Bosch GmbH , Feyh, Ando, Lars , O'Brien, Gary , Yama, Gary
发明人: FEYH, Ando , O'BRIEN, Gary , YAMA, Gary
IPC分类号: H04B1/40
CPC分类号: G01J5/505 , G01J5/0265 , G01J5/0859 , G01J5/089 , G01J5/20 , G01J2005/0077
摘要: A hand-held device having a housing and a processor disposed within the housing, includes a camera and a temperature sensing element having an adjustable field of view. The camera is configured to generate an image of an object and to permit the user to frame the image at a portion of the object to determine the temperature of the framed portion. The temperature sensing element includes a plurality of temperature sensors and the processor is configured to select ones of the plurality of sensors to produce a field of view (FOV) of the temperature sensing element that is less than or equal to the frame in the image. The selected sensors are activated to generate signals corresponding to the temperature of the object in the FOV and the processor is configured to determine a sensed temperature based on the sensor signals.
-
-
-
-
-
-
-
-
-