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公开(公告)号：EP1014443A4
公开(公告)日：2001-02-07
申请号：EP97940456
申请日：1997-09-22
申请人： TDK CORP
发明人： HAYASHI KATSUHIKO
CPC分类号： H03H7/0115 , H01L23/15 , H01L23/49575 , H01L23/64 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2224/05548 , H01L2224/05573 , H01L2224/16 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/19011 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H03H3/00 , H03H7/1766 , H03H2001/0071 , H03H2001/0078 , H03H2001/0085 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
摘要： Passive electronic parts containing a substrate (1) and a passive circuit (2). The substrate (1) has an inorganic insulating layer (11) composed of a mixture of a ceramic component and glass component. The passive circuit (2) is composed of a conductor pattern in general and provided on one surface (111) of the insulating layer (11). It is preferable to polish the surface (111) of the insulating layer (11) on which the circuit (2) is formed. An electronic part can be designed for a smaller pattern area by making the conductive pattern finer.
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公开(公告)号：EP1130642A4
公开(公告)日：2008-01-09
申请号：EP00946488
申请日：2000-07-25
申请人： TDK CORP
发明人： HAYASHI KATSUHIKO
IPC分类号： H01L21/56 , H01L23/367 , H01L23/433 , H01L23/58 , H01L23/66 , H01L23/34 , H01L23/02 , H01L23/28 , H01L25/00
CPC分类号： H01L21/563 , H01L23/3672 , H01L23/433 , H01L23/585 , H01L23/66 , H01L24/31 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/83951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/15311 , H01L2924/15313 , H01L2924/16152 , H01L2924/19041 , H01L2924/19105 , H01L2924/00 , H01L2924/01031 , H01L2224/05599
摘要： A high frequency module capable of effectively dissipating the heat generated by a semiconductor device. The high frequency module comprises a substrate (11), a semiconductor chip (13) fixed on the substrate (11), a top plate (15) placed in contact with the upper surface (13a) of the semiconductor chip (13), and a cap (16) placed in contact with the upper surface of the top plate (15), wherein the cap (16) comprises a flat plate part (16a) and extending parts (16b) extending downward from both ends of the flat plate part (16a). The extending parts (16b) is in contact with the sides of the substrate (11). Thus, the extending parts (16b) are reliably in contact with the sides of the substrate (11) with a wide contact area even if the height of the semiconductor chip (13) involves some variation or the shape of the cap (16) involves some manufacturing variation. Therefore, the heat generated by the semiconductor chip (13) is effectively dissipated to the substrate (11).
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公开(公告)号：EP0585469A4
公开(公告)日：1995-12-20
申请号：EP93906788
申请日：1993-03-18
申请人： TDK CORP
发明人： HAYASHI KATSUHIKO , IKEDA HIROSHI , AOTANI AKIRA
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公开(公告)号：EP1075004A4
公开(公告)日：2007-05-02
申请号：EP99905215
申请日：1999-02-17
申请人： TDK CORP
发明人： HAYASHI KATSUHIKO
CPC分类号： H01G4/012 , H01G4/33 , H01L27/0805
摘要： An MMIC capacitor; specifically, a capacitor so constructed that the capacity thereof in an area occupied by the patterns thereof can be increased and variations in mass-production level capacity thereof can be minimized, the capacitor comprising a comb-shaped lower-layer electrode (11) formed on a substrate (14), a dielectric layer (13) formed on the lower-layer electrode (11) and a comb-shaped upper-layer electrode (12) formed on the dielectric layer (13), wherein individual element electrodes (16(15)) of one of the lower-layer electrode (11) and the upper-layer electrode (12) are arranged in spaces between individual element electrodes (15(16)) of the other electrode.
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