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1.发明公开
公开(公告)号：EP3733594A1
公开(公告)日：2020-11-04
申请号：EP18896498.5
申请日：2018-03-23
发明人： HUANG, Zengbiao
摘要： Provided is a boron nitride agglomerate. The boron nitride agglomerate is of a multi-stage structure formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions through adhesion of an inorganic binder. Further provided is a method for preparing the boron nitride agglomerate. The method comprises: mixing flaky hexagonal boron nitride primary particles with an inorganic binder, and controlling the mass of the inorganic binder to account for 0.02-20% of the mass of the flaky hexagonal boron nitride primary particles, so as to obtain the boron nitride agglomerate. The boron nitride agglomerate provided can be added to thermosetting resin compositions, and resin sheets, resin composite metal foil, prepregs, laminates, metal foil-covered laminates, and printed wiring boards prepared using the same have higher boron nitride addition, high thermal conductivity, and high peel strength.
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公开(公告)号：EP2913354B1
公开(公告)日：2020-10-21
申请号：EP14863038.7
申请日：2014-02-19
发明人： YAN, Shanyin , ZENG, Xianping , XU, Yongjing , YANG, Zhongqiang , SU, Xiaosheng , LUO, Li
IPC分类号： C08J5/24
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公开(公告)号：EP3689969A1
公开(公告)日：2020-08-05
申请号：EP19184689.8
申请日：2019-07-05
发明人： CHEN, Guangbin , LIU, Qianfa , YAN, Shanyin , ZENG, Xianping , DU, Cuiming
摘要： This disclosure provides a thermosetting resin composition, a prepreg, a laminate, and a printed circuit board. The thermosetting resin composition comprises: a thermosetting polyphenylene ether resin; an unsaturated polyolefin resin; a curing agent; and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent, wherein a laminate produced from the thermosetting resin composition may satisfy the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like by a high-frequency electronic circuit substrate.
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公开(公告)号：EP3231829B1
公开(公告)日：2019-10-30
申请号：EP15868567.7
申请日：2015-05-27
发明人： DENG, Huayang , HUANG, Zengbiao , LIU, Qianfa , YANG, Zhongqiang , WANG, Peng
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6.发明公开
公开(公告)号：EP3372642A1
公开(公告)日：2018-09-12
申请号：EP17208581.3
申请日：2017-12-19
发明人： SU, Minshe , LI, Duye , YAN, Shanyin , LIU, Qianfa , YANG, Zhongqiang
CPC分类号： H05K1/0373 , B32B5/26 , B32B17/02 , B32B25/16 , B32B2262/101 , B32B2307/204 , C08J5/08 , H05K1/0237 , H05K1/0366 , H05K2201/0154 , H05K2201/0278 , H05K2201/068
摘要： The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite comprises (1) from 20 to 70 parts by weight of a thermosetting mixture, comprising (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability. The high-frequency circuit substrate made by using the composite has good high frequency dielectric properties and better thermal oxidative aging performance.
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公开(公告)号：EP3219758A4
公开(公告)日：2018-07-11
申请号：EP14906062
申请日：2014-12-02
发明人： LI HUI , FANG KEHONG
CPC分类号： B32B27/38 , B32B27/04 , B32B27/285 , B32B27/302 , B32B2260/046 , B32B2307/306 , B32B2371/00 , B32B2457/08 , C08G59/3218 , C08J5/043 , C08J5/24 , C08J2379/04 , C08J2425/08 , C08J2435/06 , C08J2463/00 , C08J2471/10 , C08L35/06 , C08L63/00 , C08L79/04 , C08L2201/02 , C08L2203/20 , C08L2205/035 , H05K1/03 , H05K1/0373 , H05K2201/012 , C08K3/36 , C08L71/12
摘要： A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.
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公开(公告)号：EP3231829A4
公开(公告)日：2018-07-04
申请号：EP15868567
申请日：2015-05-27
发明人： DENG HUAYANG , HUANG ZENGBIAO , LIU QIANFA , YANG ZHONGQIANG , WANG PENG
CPC分类号： C08G59/66 , B32B15/092 , C08G59/245 , C08G59/504 , C08G59/56 , C08J3/243 , C08J5/043 , C08J5/24 , C08J11/04 , C08J11/16 , C08J11/18 , C08J2363/00 , C08J2363/02 , C08K3/36 , C08L63/00 , Y02P20/143 , Y02W30/70 , Y02W30/702 , Y02W30/705 , Y02W30/706
摘要： Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufaturing the copper clad laminate, and the manufatured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components.
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9.发明公开ORGANIC SILICONE RESIN ALUMINUM BASE COPPER CLAD LAMINATE AND PREPARATION METHOD THEREOF 审中-公开有机硅树脂铝基铜基层压板及其制备方法
公开(公告)号：EP3315559A1
公开(公告)日：2018-05-02
申请号：EP15901587.4
申请日：2015-11-18
发明人： TANG, Guofang , YE, Suwen
CPC分类号： B32B15/08 , B32B15/20 , B32B27/283 , B32B2307/302 , B32B2457/08 , C08K3/22 , H05K1/05
摘要： The present invention relates to an organic silicone resin aluminum base copper clad laminate and preparation method thereof. The aluminum base copper clad laminate comprises sequentially a copper foil layer, an insulation layer and an aluminum plate layer, wherein, the insulation layer is prepared from an organic silicone resin composition, and the organic silicone resin composition comprises the following components in parts by weight: 100 parts of an organic silicone resin, 40-100 parts of a vinyl-terminated silicone oil, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor. By adopting an organic silicone resin as a substrate polymer, the electrical insulation and heat resistance functions of the aluminum base copper clad laminate are improved. Moreover, the vinyl-terminated silicone oil as reactive diluent can effectively reduce brittleness of a silicone resin, improving the toughness of the organic silicone resin composition. The aluminum base copper clad laminate has advantageous electrical insulation, heat-conduction, high-temperature resistance and resistance to long-term aging.
摘要翻译： 本发明涉及一种有机硅树脂铝基覆铜箔层压板及其制备方法。 该铝基覆铜层压板依次包括铜箔层，绝缘层和铝板层，其中，所述绝缘层由有机硅树脂组合物制备而成，所述有机硅树脂组合物包含以下重量份数的组分 ：100份有机硅树脂，40-100份乙烯基封端的硅油，0.0001-0.5份催化剂和0.00001-0.1份抑制剂。 通过采用有机硅树脂作为基材聚合物，改善了铝基覆铜箔层压板的电绝缘和耐热功能。 而且，作为反应性稀释剂的乙烯基封端的硅油可以有效地降低有机硅树脂的脆性，提高有机硅树脂组合物的韧性。 该铝基覆铜箔层压板具有有利的电绝缘性，导热性，耐高温性和抗长期老化性。
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公开(公告)号：EP3115416A4
公开(公告)日：2017-11-08
申请号：EP14884871
申请日：2014-05-21
发明人： CHEN YONG
CPC分类号： C08J5/24 , C08G59/42 , C08G59/4261 , C08J2363/00 , C08J2363/04 , C08J2363/10 , C08L63/00 , C08L2201/02 , C08L2203/20 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , C08L25/04 , C08L25/18
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