公开(公告)号：EP1556949A2

公开(公告)日：2005-07-27

申请号：EP03769489.0

申请日：2003-09-18

Applicant: International Business Machines Corporation ,  Compagnie IBM France

Inventor： CHINTHAKINDI, Anil, K. ,  GROVES, Robert, A. ,  STEIN, Kenneth, J. ,  SUBBANNA, Seshadri ,  VOLANT, Richard, P.

IPC: H03J3/18 ,  B81B3/00 ,  H01G5/16

CPC classification number: H01G5/18 ,  B81B2201/01 ,  H01G5/011 ,  Y10S257/924

Abstract: A three-dimensional micro-electromechanical (MEM) varactor is described wherein a movable beam (50) and fixed electrodes (51) are respectively fabricated on separate substrates coupled to each other. The movable beam with comb-drive electrodes are fabricated on the 'chip side' while the fixed bottom electrode is fabricated on a separated substrate 'carrier side'. Upon fabrication of the device on both surfaces of the substrate, the chip side device is diced and 'flipped over', aligned and joined to the 'carrier' substrate to form the final device. Comb-drive (fins) electrodes are used for actuation while the motion of the electrode provides changes in capacitance. Due to the constant driving forces involved, a large capacitance tuning range can be obtained. The three dimensional aspect of the device avails large surface area. When large aspect ratio features are provided, a lower actuation voltage can be used. Upon fabrication, the MEMS device is completely encapsulated, requiring no additional packaging of the device. Further, since alignment and bonding can be done on a wafer scale (wafer scale MEMS packaging), an improved device yield can be obtained at a lower cost.

公开(公告)号：EP2633541A2

公开(公告)日：2013-09-04

申请号：EP11837245.7

申请日：2011-10-29

Applicant: The Regents of The University of California

Inventor： BACHMAN, Mark ,  LI, Guann-Pyng ,  ZHANG, Yang ,  WANG, Minfeng ,  KIM, Sunjung

IPC: H01H59/00 ,  B81B3/00

CPC classification number: H01H50/005 ,  B81B2201/01 ,  B81B2203/0109 ,  H01G5/18 ,  H01H59/0009 ,  H01H2050/007 ,  Y10T29/49002

Abstract: Magnetically actuated micro-electro-mechanical capacitor switches in laminate are disclosed. According to one embodiment, an apparatus comprises a first layer comprising a coil and magnetic element, the magnetic element made from one of nickel and iron; a second layer comprising a flexible member, wherein a permanent magnet is attached to the flexible member; a conductive plate having an insulating dielectric coating, the conductive plate attached to one of the flexible member or a magnet; and a third layer comprising a transmission line and magnetic material, wherein the transmission line comprises one or more of a signal conductor and one or more ground conductors in near proximity

公开(公告)号：EP3257083A1

公开(公告)日：2017-12-20

申请号：EP16703498.2

申请日：2016-02-03

Applicant: Koninklijke Philips N.V.

Inventor： VAN DELFT, Peter ,  VAN DEN BIGGELAAR, Theodorus, Johannes, Petrus ,  RADERMACHER, Harald, Josef, Guenther ,  THEUNISSEN, Bob, Bernardus, Anthonius

IPC: H01L27/15 ,  H01L33/36 ,  H01H1/00

CPC classification number: H01L33/36 ,  B81B2201/01 ,  H01H1/0036 ,  H01L27/15 ,  H01L33/005

Abstract: The invention provides an LED chip having an integrated electrostatic switch for electromechanical control of the LED. A suspended beam switch floats above a conductive control electrode, and by a charging of the electrode may be attracted downward to make connection between an LED structure and an external electrode. Components are mounted on a common substrate so that a fully integrated LED with MEMS switch is formed. Methods for producing the LED chip are further provided, in which production of the switching mechanism is fully integrated with the production of the LED structure.

公开(公告)号：EP3038974A1

公开(公告)日：2016-07-06

申请号：EP14839979.3

申请日：2014-08-26

Applicant: Silex Microsystems AB

Inventor： KÄLVESTEN, Edvard ,  EBEFORS, Thorbjörn ,  SVEDIN, Niklas

IPC: B81B7/00 ,  B81C1/00 ,  H01L21/50 ,  H01L23/48

CPC classification number: B81B7/007 ,  B81B2201/01 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2207/095 ,  B81C1/00301 ,  B81C2201/0153 ,  B81C2201/036 ,  B81C2203/0109 ,  B81C2203/0145 ,  H01L21/50 ,  H01L23/08 ,  H01L24/94 ,  H01L2924/16235

Abstract: The invention relates to a device comprising a base substrate(700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from said component (702). It also comprises spacer members (706) which also can act as conducting structures for routing signals vertically. There is a capping structure (708) of a glass material, provided above the base substrate (700), bonded via said spacer members (706), preferably by eutectic bonding, wherein the capping structure (708) comprises vias (710) comprising metal for providing electrical connection through said capping structure. The vias can be made by a stamping/pressing method entailing pressing needles under heating to soften the glass and applying pressure, to a predetermined depth in the glass. However, other methods are possible, e-g- drilling, etching, blasting.

Abstract translation: 一种装置包括具有附接到其上的微组件（702）的基底（700）。 适当地，它设置有用于向组件（702）传导信号和从组件（702）传出信号的路由元件（704）。 它还包括间隔件（706），其也可以用作垂直路线信号的导电结构。 存在玻璃材料的覆盖结构（708），其设置在基底基板（700）上方，优选地通过共晶接合通过间隔件（706）接合，其中封盖结构（708）包括通孔（710），包括金属 用于通过封盖结构提供电连接。 通孔可以通过加压的冲压/压制方法制成，以使玻璃软化并施加压力至玻璃中的预定深度。 然而，其他方法是可能的，例如钻孔，蚀刻，爆破。

公开(公告)号：EP3378086A1

公开(公告)日：2018-09-26

申请号：EP16804969.0

申请日：2016-11-14

Applicant: Cavendish Kinetics, Inc.

Inventor： VAN KAMPEN, Robertus Petrus ,  KNIPE, Richard L.

IPC: H01H59/00 ,  H01G5/16 ,  H01G5/38 ,  H01H1/00 ,  B81B7/00

CPC classification number: H01H59/0009 ,  B81B7/00 ,  B81B7/0006 ,  B81B2201/01 ,  B81B2203/0307 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00166 ,  H01G5/16 ,  H01G5/38 ,  H01H2001/0084 ,  H01H2203/026

Abstract: The present invention generally relates to a mechanism for making the anchor of the MEMS switch more robust for current handling.

公开(公告)号：EP3038974A4

公开(公告)日：2017-07-26

申请号：EP14839979

申请日：2014-08-26

Applicant: SILEX MICROSYSTEMS AB

Inventor： KÄLVESTEN EDVARD ,  EBEFORS THORBJÖRN ,  SVEDIN NIKLAS

IPC: B81B7/00 ,  B81C1/00 ,  H01L21/50 ,  H01L23/00 ,  H01L23/08 ,  H01L23/48

CPC classification number: B81B7/007 ,  B81B2201/01 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2207/095 ,  B81C1/00301 ,  B81C2201/0153 ,  B81C2201/036 ,  B81C2203/0109 ,  B81C2203/0145 ,  H01L21/50 ,  H01L23/08 ,  H01L24/94 ,  H01L2924/16235

公开(公告)号：EP2838199A1

公开(公告)日：2015-02-18

申请号：EP14180654.7

申请日：2014-08-12

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： Fanet, Hervé ,  Belleville, Marc

IPC: H03K19/00

CPC classification number: H03K19/0019 ,  B81B7/02 ,  B81B2201/01

Abstract: Circuit logique adiabatique présentant une première et une deuxième entrées (A, Ab), une première et une deuxième sorties (S, Sb) et au moins une entrée d'alimentation et de synchronisation (Phi), ce circuit comportant :
-un premier dispositif logique comprenant au moins premier un interrupteur microélectromécanique nanoélectromécanique (T1), dit premier interrupteur mécanique, piloté par la première entrée et relié à la première sortie et à l'entrée d'alimentation et de synchronisation (Phi),
- un deuxième dispositif logique inverse du premier dispositif logique comprenant au moins un deuxième interrupteur microélectromécanique ou nanoélectromécanique (T2), dit deuxième interrupteur mécanique, au piloté par la deuxième entrée et relié à la deuxième sortie et à l'entrée d'alimentation et de synchronisation (Phi),
- des premier (D) et deuxième (Db) dispositifs de décharge partielle reliés respectivement entre la première sortie (S) et l'entrée d'alimentation et de synchronisation (Phi) et entre la deuxième sortie (Sb) et l'entrée d'alimentation et de synchronisation (Phi).

Abstract translation: 具有第一和第二输入的绝热逻辑电路，第一和第二输出以及至少一个电源和同步输入（Phi），该电路包括：第一逻辑器件，包括至少一个第一微机电和/或纳米机电开关， 被称为第一机械开关，由第一输入端控制并连接到第一输出端和供电和同步输入端;与第一逻辑器件相对的第二逻辑器件，包括至少一个第二微机电或纳米机电开关，称为第二机械 开关，由第二输入控制并连接到第二输出端和供电和同步输入端，用于部分放电的第一和第二装置分别连接在第一输出与供电同步输入之间以及第二输出与供电和同步之间 输入。

公开(公告)号：EP3344574A1

公开(公告)日：2018-07-11

申请号：EP16829011.2

申请日：2016-07-13

Applicant: General Electric Company

Inventor： BREWER, Joleyn Eileen ,  KEIMEL, Christopher Fred ,  AIMI, Marco Francesco ,  MINNICK, Andrew James ,  RUFFALO, Renner Stephen

IPC: B81B3/00

CPC classification number: B81B3/0027 ,  B81B3/0075 ,  B81B7/0003 ,  B81B7/008 ,  B81B2201/01 ,  B81B2201/014 ,  B81B2201/0228 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/053 ,  B81B2207/015 ,  B81B2207/115 ,  B81C1/00134 ,  B81C1/0015 ,  B81C1/00158 ,  B81C1/00182 ,  B81C1/00373 ,  B81C2201/0107 ,  G01L9/0042 ,  G01L9/0044

Abstract: A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.

公开(公告)号：EP3092879A1

公开(公告)日：2016-11-16

申请号：EP15705209.3

申请日：2015-01-07

Applicant: Safran Electronics & Defense

Inventor： RIOU, Jean-Christophe

IPC: H05K7/20 ,  H01L23/44

CPC classification number: H01L23/44 ,  B81B7/0093 ,  B81B2201/01 ,  H01L23/06 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/49541 ,  H01L23/49568 ,  H01L24/48 ,  H01L24/73 ,  H01L25/074 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/19107 ,  H05K7/20236 ,  H05K7/20927 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: The invention relates to an electronic device comprising at least one electronic component mounted on a support and surrounded by a deformable envelope containing a thermally conductive and electrically insulating liquid, said device comprising a heat dissipation plate which is substantially parallel to the support and at a distance therefrom, and means for heat transfer by conduction between the envelope and the plate, the thermally conductive and electrically insulating liquid being selected and the envelope being arranged such that a thermal expansion of the oil generates a force pressing the envelope against the means for heat exchange by conduction.

Abstract translation: 本申请人最初提交的标题和摘要的翻译。 没有考虑到PCT当局可能随后根据职权作出的任何变更，例如 根据PCT细则37.2,38.2和/或48.3。

公开(公告)号：EP2845232A4

公开(公告)日：2016-03-09

申请号：EP13785065

申请日：2013-04-30

Applicant: WISPRY INC

Inventor： MORRIS ARTHUR S

IPC: H01L29/00 ,  H01L23/522 ,  H01L27/06 ,  H01L49/02

CPC classification number: H03J5/0209 ,  B81B7/008 ,  B81B2201/01 ,  B81B2207/053 ,  B81C1/00238 ,  B81C2203/0785 ,  H01L23/5223 ,  H01L27/0688 ,  H01L28/40 ,  H01L28/60 ,  H01L2924/0002 ,  H03J2200/10 ,  Y10T29/49105 ,  H01L2924/00

Abstract: The present subject matter relates to systems and methods for arranging and controlling programmable combinations of tuning elements in which more than one form of switching technology is combined in a single array. Specifically, such an array can include one or more first switchable elements including a first switching technology (e.g., one or more solid-state-controlled devices) and one or more second switchable elements including a second switching technology that is different than the first switching technology (e.g., one or more micro-electro-mechanical capacitors). The one or more first switchable elements and the one or more second switchable elements can be configured, however, to deliver a combined variable reactance.

Abstract translation: 本主题涉及用于布置和控制调谐元件的可编程组合的系统和方法，其中多个形式的开关技术组合在单个阵列中。 具体地，这样的阵列可以包括一个或多个第一可切换元件，包括第一切换技术（例如，一个或多个固态控制设备）和一个或多个第二可切换元件，其包括与第一开关不同的第二开关技术 技术（例如，一个或多个微电机电容器）。 然而，可以配置一个或多个第一可切换元件和一个或多个第二可切换元件以递送组合的可变电抗。