摘要:
A chamber (102 in Fig. 2) for exposing a workpiece to charged particles (101 in Fig. 2) includes a source, a collimator, a beam digitizer (230 in Fig. 2) downstream of the collimator configured to create a digital beam including groups of at least one charged particle (Fig. 3B and 5) by adjusting longitudinal spacing between the particles along the axis, a deflector (210 in Fig. 6A and 6B) downstream of the beam digitizer including a series of deflection stages disposed longitudinally along the axis to deflect the digital beams, and a workpiece stage downstream of the deflector configured to hold the workpiece.
摘要:
The invention relates to the production or treatment of semiconductor or other solid components, especially to a method for directly nano-structuring amorphous carbonlayers. According to the invention, a local, field-induced reaction is activated in the carbon with an electrically conductive or semiconducting probe. Said probe is positioned at a distance from the amorphous carbon layer or is passed over said amorphous carbon layer at a distance. The distance must be such that the electrical conduction mechanism 'field emission' or 'tunnelling' can still occur. An electrical voltage is applied to said probe in relation to the layer at the points where recesses are to be made in the layer or the layer is to be removed. This process alone produces the desired structure without any further technical steps. The inventive method can be used advantageously in the production of electronic components in the sub-νm and nm areas, and is particularly suitable in those fields for producing nano-structured etching masks whose structures have to be transferred onto layers placed beneath them. The method can also be used advantageously for entering information into amorphous carbon layers for information storage.
摘要:
The invention relates to a method for defect (36) and conductivity engineering of a conducting nanoscaled structure (22) or at least one part of it by generating heat-induced migration, melting, sputtering and/or evaporation of conductive material of the nanoscaled structure by directing a focused electron beam on the nanoscaled structure or an individual portion (36) of it to be engineered and/or by applying one or multiple wires of the conducting nanoscaled structure by applying a current density J D,I whereas the current density J D,I has a value below a critical current density J C which is the current per cross-section area of the wire at which the wire fails due to overheating and electromigration, and not lower than 3 orders of magnitude below J C . The invention further relates to the use of a secondary electron microscope having a filter for detecting back scattered electrons for such a method and a respective secondary electron microscope having such a filter for detecting back scattered electrons.
摘要:
A master disc manufacturing apparatus includes an electron-beam emitting portion (40) for emitting an electron beam, an electron-beam converging portion for converging an electron beam, a retarding voltage applying portion (60) for applying a substrate with a negative potential having a magnitude of decelerating the electron beam, and a vacuum atmosphere producing portion for evacuating a chamber to produce a vacuum atmosphere therein.
摘要:
Ion beam lithography technique wherein a higher amount of radiation energy is deposited to predetermined regions in the bulk if a suitable substrate. By selecting the radiation nature, its energy and the irradiation parameters a structure can be created in the bulk of the material leaving the surface essentially untouched.
摘要:
A master disc manufacturing apparatus includes an electron-beam emitting portion (40) for emitting an electron beam, an electron-beam converging portion for converging an electron beam, a retarding voltage applying portion (60) for applying a substrate with a negative potential having a magnitude of decelerating the electron beam, and a vacuum atmosphere producing portion for evacuating a chamber to produce a vacuum atmosphere therein.
摘要:
The invention relates to a method for producing corpuscular radiation systems (10-10 '', 12-12'), whereby at least one first corpuscular radiation system (10-10 '') is produced on a first substrate (14) by means of computer-controlled, corpuscular radiation-induced deposition, and at least one second corpuscular radiation system (12-12 ') is produced on at least one second substrate (16) by the at least one first corpuscular radiation system (10-10 '') by means of computer-controlled, corpuscular radiation-induced deposition. The inventive method can be used to produce a plurality of corpuscular radiation systems in a relatively short space of time.
摘要:
The invention relates to a method for defect (36) and conductivity engineering of a conducting nanoscaled structure (22) or at least one part of it by generating heat-induced migration, melting, sputtering and/or evaporation of conductive material of the nanoscaled structure by directing a focused electron beam on the nanoscaled structure or an individual portion (36) of it to be engineered and/or by applying one or multiple wires of the conducting nanoscaled structure by applying a current density J D,I whereas the current density J D,I has a value below a critical current density J C which is the current per cross-section area of the wire at which the wire fails due to overheating and electromigration, and not lower than 3 orders of magnitude below J C . The invention further relates to the use of a secondary electron microscope having a filter for detecting back scattered electrons for such a method and a respective secondary electron microscope having such a filter for detecting back scattered electrons.
摘要:
A chamber (102 in Fig. 2) for exposing a workpiece to charged particles (101 in Fig. 2) includes a source, a collimator, a beam digitizer (230 in Fig. 2) downstream of the collimator configured to create a digital beam including groups of at least one charged particle (Fig. 3B and 5) by adjusting longitudinal spacing between the particles along the axis, a deflector (210 in Fig. 6A and 6B) downstream of the beam digitizer including a series of deflection stages disposed longitudinally along the axis to deflect the digital beams, and a workpiece stage downstream of the deflector configured to hold the workpiece.