LIGHT-EMITTING DIODE, METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE LAMP AND ILLUMINATION DEVICE
    4.
    发明公开
    LIGHT-EMITTING DIODE, METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE LAMP AND ILLUMINATION DEVICE 审中-公开
    发光二极管,一种用于生产发光二极管,发光二极管灯和照明装置

    公开(公告)号:EP2772951A4

    公开(公告)日:2015-07-15

    申请号:EP12844259

    申请日:2012-10-02

    申请人: SHOWA DENKO KK

    摘要: A light-emitting diode with reduced light absorption, a method of manufacturing the same, a lamp and an illumination device are provided. A light-emitting diode (100) is provided with: a compound semiconductor layer (10) including a light-emitting layer (24) provided on a substrate (1); an ohmic contact electrode (7) provided between the substrate (1) and the compound semiconductor layer (10); an ohmic electrode (11) provided on the side of the compound semiconductor layer (10) opposite to the substrate (1); a surface electrode (12) including a branch section (12b) provided so as to cover the surface of the ohmic electrode (11) and a pad section (12a) coupled to the branch section (12b); and a current-blocking portion (13) provided between an under-pad light-emitting layer (24a) arranged in an area of the light-emitting layer (24) that overlaps the pad section (12a) in a planar view and a light-emitting layer (24) arranged in an area except the area that overlaps the pad section (12a) in a planar view, to prevent the current supplied to the under-pad light-emitting layer (24a).

    摘要翻译: 本发明提供一种发光二极管的光的光吸收减少,其制造,灯和照明装置的方法。 一种发光二极管(100)设置有:包含设置在基板上的发光层(24)的化合物半导体层(10)(1); 在欧姆接触电极(7)设置在基板(1)和化合物半导体层(10)之间; 在设置在所述化合物半导体层(10)的侧欧姆电极(11)相对的基板(1); 的表面电极(12)包括一个分支部分(12B)设置成覆盖所述欧姆电极(11)和焊盘部(12a)的表面耦合到所述分支部分(12B); 和之间下焊盘上布置发光的发光层(24)那样的区域层(24a)的重叠在平面视图和光焊盘部(12)提供的电流 - 阻挡部分(13) 布置在区域以外的区域-emitting层(24)做了重叠在平面视图中的焊盘部(12A),以防止被送入到下焊盘发光层(24A)的电流。

    Method of fabricating semiconductor devices on a group iv substrate with controlled interface properties and diffusion tails
    9.
    发明公开
    Method of fabricating semiconductor devices on a group iv substrate with controlled interface properties and diffusion tails 审中-公开
    一种用于具有受控界面性质和扩散山麓IV族衬底上制造半导体器件的方法

    公开(公告)号:EP2428981A1

    公开(公告)日:2012-03-14

    申请号:EP11192479.1

    申请日:2007-07-19

    摘要: An opto-electronic device, such as a solar cell or a light emitting diode, is fabricated by forming a nucleating layer (22) on a p-type group IV layer (20). The nucleating layer (22) includes a III-V compound selected from the group consisting of AlAs, AlSb, AIN, Bas, BSb, GaN, GaSB, and InAs. A first III-V compound layer (24) is formed on the nucleating layer (22) and includes as group III element, at least one of gallium, indium, and aluminium, and as a group V element, phosphorus. The p-type group IV layer, which may be a p-type silicon layer, includes phosphorus atoms diffused from the first III-V compound layer, the concentration of the phosphorus atoms therein being a function of the thickness of the nucleating layer. The first III-V compound layer includes group IV atoms diffused from the p-type group IV layer, the concentration of the group IV atoms therein being a function of the thickness of the nucleating layer.

    摘要翻译: 一种光电器件,检查作为太阳能电池或发光二极管中,通过形成p型IV族层(20)上的成核层(22)制成。 该成核层(22)包括选自的AlAs,的AlSb,AlN,BAS,BSb的,氮化镓,GaSb和InAs构成中选择的III-V族化合物。 第一III-V族化合物层(24)形成在成核层(22)上,并且包括作为III族元素,镓中的至少一种,铟和铝,以及作为V族元素,磷。 在p型基IV层,其可以是p型硅层,包括从所述第一III-V族化合物层扩散磷原子,磷原子。其中是所述成核层的厚度的函数的浓度。 在第一III-V族化合物层包括从p型IV族层扩散IV族原子,IV族原子。其中是所述成核层的厚度的函数的浓度。