摘要:
A resonator body has an inversion gate, an accumulation gate, and a center region. The resonator body also has a source contact coupled to the center region and a drain contact coupled to the center region. The resonator body further has a first dielectric layer coupled between the inversion gate and the center region. The resonator body also has a second dielectric layer coupled between the accumulation gate and the center region. A resonant body transistor is also disclosed. The resonant body transistor has an inversion gate electrode, an accumulation gate electrode, a source electrode, a drain electrode, and a plurality of anchor beams. The resonant body transistor also has a resonator body coupled-to and suspended-from the inversion gate electrode, the accumulation gate electrode, the source electrode, and the drain electrode by the plurality of anchor beams. A resonant body oscillator is also disclosed.
摘要:
An electron transfer device is implemented in a structure which is readily capable of achieving charge transfer cycle frequencies in the range of several hundred MHz or more and which can be formed by conventional semiconductor integrated circuit manufacturing processes. The device includes a substrate having a horizontal extent and a pillar on the substrate extending from the substrate vertically with respect to the horizontal extent of the substrate. The pillar is formed to vibrate laterally with respect to the vertical length of the pillar at a resonant frequency which can be several hundred MHz. Drain and source electrodes extend from the substrate vertically with respect to the horizontal extent of the substrate, and have innermost ends on opposite sides of the pillar. The pillar is free to vibrate laterally back and forth between the innermost ends of the drain and source electrodes to transfer charge between the electrodes.
摘要:
An electron transfer device is implemented in a structure which is readily capable of achieving charge transfer cycle frequencies in the range of several hundred MHz or more and which can be formed by conventional semiconductor integrated circuit manufacturing processes. The device includes a substrate having a horizontal extent and a pillar on the substrate extending from the substrate vertically with respect to the horizontal extent of the substrate. The pillar is formed to vibrate laterally with respect to the vertical length of the pillar at a resonant frequency which can be several hundred MHz. Drain and source electrodes extend from the substrate vertically with respect to the horizontal extent of the substrate, and have innermost ends on opposite sides of the pillar. The pillar is free to vibrate laterally back and forth between the innermost ends of the drain and source electrodes to transfer charge between the electrodes.
摘要:
Le résonateur MEMS à transistor comprend : - un caisson dans lequel est formé un élément de conduction constitué par une région de source (308), une région de drain (309), et une région semi-conductrice formant un canal reliant la région de source et la région de drain ; - une structure vibrante (310) solidaire d'un substrat tout en étant libre de vibrer ; - une structure fixe (330) portée par le substrat, un espace (ou gap) étant aménagé entre la structure fixe et la structure vibrante ;
le caisson étant intégré soit dans la structure vibrante, soit dans la structure fixe (330), de telle façon que le canal s'étende en regard du dit espace, et ledit espace renferme une microstructure (328) en un matériau piézoélectrique prévue pour assurer un couplage électromécanique entre la structure vibrante (310) et le canal de manière à permettre de moduler la conductibilité de l'élément de conduction à la fréquence de vibration de la structure vibrante.
摘要:
Procédé de réalisation d'un dispositif microélectronique comprenant, au moins un composant électro-mécanique (C) doté d'une structure mobile, le procédé comprenant les étapes consistant à : - former dans au moins une fine couche mince semi-conductrice (102) reposant sur une couche de support (101), d'au moins un barreau (104) rattaché à un bloc (102b), ledit barreau étant destiné à former une structure mobile d'un composant électro-mécanique, - retrait d'une portion de la couche de support (101) sous ledit barreau (104), - formation d'au moins une couche de passivation (107) à base de matériau diélectrique autour dudit barreau, - formation d'une couche d'encapsulation (110) autour du barreau et recouvrant ladite couche de passivation,
le procédé comprenant en outre des étapes de : - réalisation de zones métalliques (141, 142, 143, 150 1 , ..., 150 p ) de contact et/ou d'interconnexion, puis - suppression de la couche d'encapsulation (110) autour dudit barreau.
摘要:
Provided are three-dimensional (3D) nanodevices including 3D nanostructures. The 3D nanodevice includes at least one nanostructure, each nanostructure including an oscillation portion floating over a substrate and support portions for supporting both lengthwise end portions of the oscillation portion, supports disposed on the substrate to support the support portions of each of the nanostructures, at least one controller disposed at an upper portion of the substrate, a lower portion of the substrate, or both the upper and lower portions of the substrate to control each of the nanostructures, and a sensing unit disposed on each of the oscillation portions to sense an externally supplied adsorption material. Thus, unlike in a typical planar device, generation of impurities between a nanodevice and a substrate can be reduced, and mechanical vibration can be caused. In particular, since 3D nanostructures have mechanical and electrical characteristics, 3D nanodevices including new 3D nanostructures can be provided using nano-electro-mechanical systems (NEMS). Also, a single electron device, a spin device, or a single electron transistor (SET)-field effect transistor (FET) hybrid device can be formed using a simple process unlike in planar devices.
摘要:
An electron transfer device is implemented in a structure which is readily capable of achieving charge transfer cycle frequencies in the range of several hundred MHz or more and which can be formed by conventional semiconductor integrated circuit manufacturing processes. The device includes a substrate having a horizontal extent and a pillar on the substrate extending from the substrate vertically with respect to the horizontal extent of the substrate. The pillar is formed to vibrate laterally with respect to the vertical length of the pillar at a resonant frequency which can be several hundred MHz. Drain and source electrodes extend from the substrate vertically with respect to the horizontal extent of the substrate, and have innermost ends on opposite sides of the pillar. The pillar is free to vibrate laterally back and forth between the innermost ends of the drain and source electrodes to transfer charge between the electrodes.