摘要:
A method for the manufacture of a printing wiring board, which proves particularly useful as a printed coil, is characterized by the fact that in the work in process which has undergone the step for fomation of a conductor circuit and which has not undergone the step for separation of a plating resist, the plating resist and other insulating substratal material are separated for transfer from the surface of the substrate having the conductor circuit formed thereon. Since this method permits formation of an extremely thin insulating layer and a conductor circuit layer thicker than the insulating layer, it enables production of very thin printed wiring board and printed coil (8) having high circuit density in the surfaces of component layers as well as in the direction of superposition of component layers.
摘要:
Die Erfindung betrifft ein Verfahren zur Integration hoch zuverlässiger und kleiner Dickschichtwiderstände in Leiter netzwerke, die mit chemischen oder elektrochemischen Ver fahren hergestellt werden, dadurch gekennzeichnet, daß auf einen Schaltungsträger mit einem Leiternetzwerk nach dem Siebdruckverfahren Widerstandspasten gedruckt und einge brannt beziehungsweise gehärtet werden oder daß ein Schal tungsträger nach einer haftungsverbessernden Vor behandlung zunächst mit dem Widerstandsmuster und zugehörigen Kontaktflecken bedruckt wird und daß nach dem Einbrand beziehungsweise Aushärten der Pasten ein vol ladditiver Leiterbahnaufbau durch selektive chemische Met allabscheidung erfolgt.
摘要:
A process is provided for fabricating metallic patterns such as resonant RF-tuned circuits on a polyolefin film such as polythylene or polypropylene film. The film is processed under conditions such as to maintain its mechanical integrity by being passed through a solvent plasticizing bath, an etch bath to provide attraction sites and adhesion for catalytic metal deposition, a conditioning bath to improve catalyst adhesion and a catalyst bath to deposit a catalytic metal for electroless metal deposition. A negative image is printed on the film and an electroless metal deposit followed by an electrolytic metal plate are applied to the film to produce the desired metallic patterns. Optionally, prior to the printing step, an electroless metal deposit, with or without a thin electrolytic metal plate, can be applied to the total film surface. Thereafter, a negative or positive printed image is coated on the film. When these optional steps are utilized, the electroless metal deposit, thin electrolytic metal plate and printed image are selectively removed to leave the thick electrolytic metal plate on the electroless metal deposit in the form of the desired pattern.
摘要:
A pulse circuit forms part of a radar transmitter in which a pulse forming network is used to generate a high current pulse at relatively low voltage and to feed it via a transformer to a magnetron which operates at typically 30 kV. A number of pulse forming networks are connected in parallel and are discharged by respective thyristors. The outputs of the pulse forming networks are combined so as to provide a low voltage pulse (of the order of 600 volts) having sufficient power to drive a radar transmitter. The pulse forming networks must each be capable of handling very large currents and must have characteristics which are identical to each other. To enable these requirements to be met, each pulse forming network includes an inductor which is formed as a coiled thin conductive layer lying on the surface of an electrically insulating board. It is formed by printed circuit board techniques and a mirror image coil is formed on both sides of a double sided printed circuit board. All pulse forming networks are connected via a common double sided printed circuit board to the primary winding of a pulse transformer.
摘要:
A carrier for microcircuit LSI chips (180) includes stacks (11) of parallel ceramic sheets (14) carrying thin conductive capacitor plates (20) laminated in a ceramic structure, in which the capacitor plates serve as power distribution conductors. Groups of plates provide electrical connection (19,21) beteeen power supply strips (16) and conductor straps (95, 98) which are connected to solder bonds (181) for the chips. This provides capacitance to smooth the power supply to high switching speed VSL1 chips. Stacks (11) of laminated ceramic capacitors serving as power planes are inserted into slots in laminated ceramic sheets. Signal vias (42) are provided about the periphery of the power planes. A highly parallel distribution of current is provided by means of horizontal power conducting straps which reduce voltage fluctuations, electrical resistance, and current per via.
摘要:
Ein elektrisches Netzwerk, das wenigstens einen elektri schen Widerstand enthält, ist aus einer mit Kontaktflächen (3, 6) beschichteten Trägerfolie (1) aufgebaut. Auf eine Wider standsschicht (2) ist eine Kunststoffschicht (4) aufgebracht. und die Trägerfolie (1) ist in einer Zick-Zack-Linie gefaltet. Die Kontaktflächen (3, 6) werden von äußeren Kontaktschichten (7, 8) kontaktiert.