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    Mounting board and electric element with lead
    91.
    发明专利
    Mounting board and electric element with lead 有权
    安装板和电气元件与领导

    公开(公告)号：JP2008244234A

    公开(公告)日：2008-10-09

    申请号：JP2007084112

    申请日：2007-03-28

    Applicant: Sanyo Electric Co Ltd ,  Sanyo Energy Tottori Co Ltd ,  三洋エナジー鳥取株式会社 ,  三洋電機株式会社

    Inventor： YAMASHITA TETSUYA ,  OZAKI HIROTOSHI ,  MORIMOTO AKIKO

    IPC: H01R12/51 ,  H05K1/18 ,  H01M2/10 ,  H01M2/30

    CPC classification number: H01R12/7082 ,  H05K1/182 ,  H05K3/3421 ,  H05K2201/09836 ,  H05K2201/10037 ,  H05K2201/10484 ,  H05K2201/10651 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/082

    Abstract: PROBLEM TO BE SOLVED: To solve the problem wherein solder is hidden behind an electrical element in a conventional flat electric element, it is difficult to detach a defective element and rework is difficult as a result, while the defective element is sometimes detached by manual work using a soldering iron, in order to detach a defective mounted element from a printed board and exchange it, after mounting the printed board.
    SOLUTION: A coin-shaped battery 20 with leads is provided with bend parts 22a and 23a by bending the respective two leads 22 and 23 in a direction of crossing main surfaces 21a and 21b, in a region farther inside than the edge of the main surfaces 21a and 21b of a coin-shaped battery 21.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题为了解决在传统的扁平电气元件中将电极隐藏在电气元件后面的问题，难以拆卸有缺陷的元件，结果难以进行返工，而有缺陷的元件有时被分离 通过使用烙铁进行人工操作，以便在安装印刷电路板之后，从印刷电路板上拆下有缺陷的安装元件并进行更换。 解决方案：具有引线的硬币形电池20通过在与主表面21a和21b交叉的方向上相对于两个引线22和23的方向在相对于第二引线22和23的边缘 硬币形电池21的主表面21a和21b。版权所有（C）2009，JPO＆INPIT

    Led light module assembly
    92.
    发明专利
    Led light module assembly 审中-公开
    空值

    公开(公告)号：JP2008530822A

    公开(公告)日：2008-08-07

    申请号：JP2007556292

    申请日：2006-02-16

    Applicant: フェデラル−モーグル コーポレイション

    Inventor： バークホルダー，グレッグ・ユージーン

    IPC: H01L33/00 ,  F21K99/00

    CPC classification number: H05K1/0206 ,  F21K9/00 ,  F21K9/20 ,  F21S43/14 ,  F21S43/19 ,  F21S45/47 ,  F21S45/49 ,  F21S48/328 ,  F21V29/004 ,  F21V29/74 ,  F21V29/75 ,  F21V29/763 ,  F21Y2115/10 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/42 ,  H05K2201/10106 ,  H05K2201/10651 ,  Y10S362/80

    Abstract: 高電力、高光出力のＬＥＤを使用するためのＬＥＤ光モジュールアセンブリは、表面実装ＬＥＤを有する柔軟性のある薄い回路基板と、熱伝導性エポキシ接着剤のような熱伝導性接着剤の層を用いて金属ヒートシンクに取り付けられた他の電子部品とを含んでいる。 伝導経路は、ＬＥＤを柔軟性のある回路基板へ接合するために用いられる取付パッドの領域にある１つまたはそれ以上の熱伝導性のビアを柔軟性のある回路基板に内蔵することによって、ＬＥＤ担体から柔軟性のある回路基板を通るように提供される。 これらのビアはＬＥＤ担体の背面から回路基板を通って熱伝導性接着剤およびヒートシンクまでの伝導経路を提供する。 ＬＥＤ光モジュールアセンブリは、約１２５℃の最大ＬＥＤ接合温度を超えることなく、約１０〜１４Ｗの間の電力を発散させる能力を有している。

    Abstract translation: 一种用于大功率，高光输出LED的LED灯组件包括一个薄表面安装的LED和其他电子元件的柔性电路板，该电子元件使用一层导热粘合剂 导电环氧胶粘剂。 通过在用于将LED结合到柔性电路板的附接垫的区域中结合一个或多个导热通孔，通过柔性电路板从LED载体提供导电路径。 这些通孔提供从LED载体的背面通过电路板到导热粘合剂和散热器的导电路径。 LED灯模块组件具有在大约10-14W的功率之间消散的能力，而不超过约125℃的最大LED结温。

    Connection member, electric board, optical scanning device, and image forming device
    95.
    发明专利
    Connection member, electric board, optical scanning device, and image forming device 有权
    连接构件，电子板，光学扫描装置和图像形成装置

    公开(公告)号：JP2008097920A

    公开(公告)日：2008-04-24

    申请号：JP2006276365

    申请日：2006-10-10

    Applicant: Fuji Xerox Co Ltd ,  富士ゼロックス株式会社

    Inventor： SATO KEIICHI ,  YOSHIDA YASUO

    IPC: H01R33/74 ,  G02B26/10 ,  H01S5/022

    CPC classification number: H01R33/09 ,  B41J2/473 ,  G02B26/123 ,  H01R12/7082 ,  H01R12/716 ,  H05K3/301 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10484 ,  H05K2201/10651

    Abstract: PROBLEM TO BE SOLVED: To more facilitate connection work for connecting a light source to an electric board. SOLUTION: When the electric board 48 is slid in the direction of an arrow Y2, pins 61a, 61b, 61c hit the vertexes 109 of cross-sectional semicircles of connection pins 108A, 108B, 108C, the pins 61a, 61b, 61c are inserted into the connection pins 108A, 108B, 108C, and the tip parts of the connection pins 108A, 108B, 108C advance along the vertexes 109 and folded. Then, the solder H is made to flow-in from the other end parts of the connection pins 108A, 108B, 108C, and the connection pins 108A, 108B, 108C and the pins 61a, 61b, 61c are fixed to each other by the solder H. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：为了更方便连接光源到电路板的连接工作。 解决方案：当电路板48沿着箭头Y2的方向滑动时，销61a，61b，61c撞击连接销108A，108B，108C的横截面半圆顶点109，销61a，61b， 61c插入到连接销108A，108B，108C中，并且连接销108A，108B，108C的尖端部分沿着顶点109前进并折叠。 然后，使焊料H从连接销108A，108B，108C的另一端部流入，并且连接销108A，108B，108C和销61a，61b，61c彼此固定在一起 焊接H.版权所有（C）2008，JPO＆INPIT

    Resin molded part with metallic plate
    96.
    发明专利
    Resin molded part with metallic plate 有权
    树脂模制件与金属板

    公开(公告)号：JP2008001225A

    公开(公告)日：2008-01-10

    申请号：JP2006172601

    申请日：2006-06-22

    Applicant: Sumitomo Wiring Syst Ltd ,  住友電装株式会社

    Inventor： MAEKAWA AKITO ,  NAGASHIMA NOBUYOSHI

    IPC: B60R16/02

    CPC classification number: H05K3/202 ,  B29C45/14655 ,  B29C45/1671 ,  B29C2045/0027 ,  H05K1/056 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/10651

    Abstract: PROBLEM TO BE SOLVED: To retain electronic parts in a normal posture by performing riveting at a bus bar. SOLUTION: A sensor unit 1 has a metallic plate 10, a resin molded part 20, and an oil temperature sensor 2. The metallic bus bar 4 is disposed in the resin molding portion 20. An exposed edge portion 4A of the bus bar 4 is insert-molded, gripped by a pair of molding dies, therefore, a distance between the exposed edge portion 4A and a placement surface 10A can be retained accurately constant. Besides, a gate dent 5D of the oil temperature sensor 2 is housed in a recess portion 10B of the placement surface 10A, and the oil temperature sensor 2 can be retained in a normal posture, positioned in a vertical direction by engaging an engagement groove 9 with an engagement projection portion 26A. Therefore, the exposed edge portion 4A of the bus bar 4 and a terminal 8 of the oil temperature sensor 2 are riveted, thus retaining the oil temperature sensor 2 placed on the placement surface 10A. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：通过在母线上进行铆接来将电子部件保持在正常姿势。 传感器单元1具有金属板10，树脂模制部20和油温传感器2.金属汇流条4设置在树脂模制部20中。总线的暴露边缘部分4A 棒4被嵌入成型，由一对成型模具夹持，因此，露出的边缘部分4A和放置表面10A之间的距离可被精确地保持恒定。 此外，油温传感器2的闸口凹部5D被容纳在放置面10A的凹部10B中，并且油温传感器2能够通过接合卡合槽9而保持在垂直方向上的正常姿势 具有接合突出部26A。 因此，母线4的露出边缘部4A和油温传感器2的端子8被铆接，从而保持放置在放置面10A上的油温传感器2。 版权所有（C）2008，JPO＆INPIT

    Ceramic capacitor and mounting structure thereof
    97.
    发明专利
    Ceramic capacitor and mounting structure thereof 审中-公开
    陶瓷电容器及其安装结构

    公开(公告)号：JP2007220751A

    公开(公告)日：2007-08-30

    申请号：JP2006037026

    申请日：2006-02-14

    Applicant: Tdk Corp ,  Tdk株式会社

    Inventor： TOGASHI MASAAKI ,  SHIODA KENTARO

    IPC: H01G4/228 ,  H01G2/06

    CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3426 ,  H05K2201/10469 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613

    Abstract: PROBLEM TO BE SOLVED: To provide a mounting structure of a ceramic capacitor capable of reducing singing noise originated from a substrate, and to provide the ceramic capacitor, without adding a new restriction when the substrate is designed for mounting the capacitor. SOLUTION: A ceramic capacitor C1 comprises a ceramic sintered body 10, and terminal electrodes 2 and 3 formed in the surface outside the ceramic sintered body 10. The terminal electrodes 2 and 3 are electrically connected with lands A1 and B1 formed on a substrate S, via metal terminals 30 and 40. The metal terminals 30 and 40 comprises: capacitor connections 31 and 41 which are mechanically connected respectively to the terminal electrodes 2 and 3; terminals 32 and 42 which are mechanically connected to the lands; and intermediate portions 33 and 43 which connect electrically the capacitor connections 31 and 41 and the terminals 32 and 42. The capacitor connections 31 and 41 of the metal terminals 30 and 40 are parallel to the substrate S. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种陶瓷电容器的安装结构，其能够降低源自基板的声音噪声，并提供陶瓷电容器，而在基板被设计用于安装电容器时不增加新的限制。 解决方案：陶瓷电容器C1包括陶瓷烧结体10和形成在陶瓷烧结体10的外表面的端电极2和3。端电极2和3与形成在陶瓷烧结体10上的焊盘A1和B1电连接 金属端子30和40包括：电容器连接31和41，其分别机械地连接到端子电极2和3; 端子32和42机械连接到焊盘; 以及中间部分33和43，它们电连接电容器连接件31和41以及端子32和42.金属端子30和40的电容器连接件31和41平行于基板S.版权所有（C） 2007年，日本特许厅和INPIT

    Printed circuit board and soldering structure of electronic part
    99.
    发明专利
    Printed circuit board and soldering structure of electronic part 有权

    公开(公告)号：JP2004055798A

    公开(公告)日：2004-02-19

    申请号：JP2002210791

    申请日：2002-07-19

    Applicant: Orion Denki Kk ,  オリオン電機株式会社

    Inventor： TORII SATOSHI

    IPC: H05K1/18 ,  H05K3/30 ,  H05K3/34

    CPC classification number: H05K3/306 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K2203/1178

    Abstract: PROBLEM TO BE SOLVED: To provide a printed board in which wiring patterns are disposed on both faces, a large electrolytic capacitor and a connection terminal such as crystal are fitted by soldering, which can securely extract air and gas in soldering, and to which terminals of an electronic part engaged with terminal holes are rigidly soldered.
    SOLUTION: The wiring patterns 6, resist layers 7 preventing solder from being attached to the wiring patterns 6, and a silk printing layer 3 displaying a position to which the electronic part 8 is fitted, are formed on a substrate 5. The terminal holes 2a and 2b to which the terminals 9 and 9 of the electronic part 8 are engaged are made through center parts of the silk printing layer 3. An extraction pattern 4 is formed so that a surface of the substrate 5 is exposed by leaving a part of the silk printing layer 3. Conductive layers 10a and 10b are disposed on inner peripheral faces of the terminal holes 2a and 2b.
    COPYRIGHT: (C)2004,JPO

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