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    Photoelectric hybrid substrate
    8.
    发明专利
    Photoelectric hybrid substrate 有权
    光电混合基板

    公开(公告)号：JP2014095782A

    公开(公告)日：2014-05-22

    申请号：JP2012246593

    申请日：2012-11-08

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： MASUDA SHOTARO ,  BABA TOSHIKAZU ,  ISHIMARU YASUTO

    IPC: G02B6/122 ,  H05K1/02

    CPC classification number: G02B6/12002 ,  G02B6/138 ,  H05K1/0274 ,  H05K1/028 ,  H05K2201/09236 ,  H05K2201/09909 ,  H05K2201/09972 ,  H05K2203/1572

    Abstract: PROBLEM TO BE SOLVED: To provide a photoelectric hybrid substrate capable of greatly reducing stress applied to a bent portion.SOLUTION: A photoelectric hybrid substrate includes: an electric circuit substrate E in which pieces of electric wiring 2 and insulating coverlays 3 for covering and protecting the pieces of electric wiring 2 are formed on a front surface of an insulation layer 1; and an optical waveguide W in which cores 7 are formed on a surface of a first cladding layer 6 by pattern formation, and the cores 7 are covered with a second cladding layer 8. In the photoelectric hybrid substrate, the electric circuit substrate E and the optical waveguide W are laminated in a state of the first cladding layer 6 being in contact with a rear surface of the insulation layer 1. A part of the photoelectric hybrid substrate is set as a planned bent portion, and the coverlays 3 are disposed so as not to overlap the optical waveguide W in the planned bent portion.

    Abstract translation: 要解决的问题：提供能够大大降低施加到弯曲部分的应力的光电复合基板。解决方案：光电复合基板包括：电路基板E，其中电线2和绝缘覆盖层3用于覆盖和保护 电气布线2形成在绝缘层1的前表面上; 以及通过图案形成在第一包层6的表面上形成有芯7的光波导路W，并且芯7被第二包层8覆盖。在光电混合基板中，电路基板E和 在第一包层6与绝缘层1的背面接触的状态下层叠光波导W.将光电复合基板的一部分设定为规划的弯曲部，将覆盖层3配置为 不与计划弯曲部分中的光波导W重叠。

    Mounting substrate
    10.
    发明专利
    Mounting substrate 有权
    安装基板

    公开(公告)号：JP2013038430A

    公开(公告)日：2013-02-21

    申请号：JP2012193505

    申请日：2012-09-03

    Applicant: Panasonic Corp ,  パナソニック株式会社

    Inventor： OMURA TAKASHI ,  MOTOIE ATSUSHI ,  MANABE YOSHIO

    IPC: H01L33/62 ,  F21S2/00 ,  F21V19/00 ,  F21V23/00 ,  F21V29/00 ,  H01L23/12

    CPC classification number: H01L33/62 ,  F21K9/232 ,  F21K9/238 ,  F21V23/00 ,  F21V23/006 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H05K1/0256 ,  H05K3/0061 ,  H05K2201/09036 ,  H05K2201/09909 ,  H05K2201/10106 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a mounting substrate, a light-emitting device and a lamp, which can effectively inhibit creeping discharge.SOLUTION: A substrate 10 comprises: a plurality of LEDs 20; conductive members electrically connected to the plurality of LEDs 20; an attachment part 11 to which a metallic object 105 is attached; and discharge suppression parts 12 each having a surface inclined with respect to a surface of the substrate 10 thereby to increase a creepage distance between the conductive members and the attachment part 11. The discharge suppression part 12 is formed by a groove 12b that is provided in a shape recessed from the surface of a substrate for mounting. The conductive member includes a wiring 18 connected with the plurality of LEDs 20 and two electrodes 15 connected to the wiring 18, and also connected to an external power source. Each of the two electrodes 15 is arranged at a periphery outer than the wiring 18. The discharge suppression parts 12 include individual first charge suppression parts provided so as to surround the plurality of LEDs 20, respectively, and individual second charge suppression parts provided so as to surround the two electrodes 15, respectively.

    Abstract translation: 要解决的问题：提供可以有效地抑制蠕变放电的安装基板，发光装置和灯。 解决方案：基板10包括：多个LED 20; 电连接到多个LED 20的导电构件; 附着有金属物体105的安装部11; 和具有相对于基板10的表面倾斜的表面的放电抑制部分12，从而增加导电部件和安装部分11之间的爬电距离。放电抑制部分12由凹槽12b形成，凹槽12b设置在 从用于安装的基板的表面凹陷的形状。 导电构件包括与多个LED 20连接的布线18和连接到布线18的两个电极15，并且还连接到外部电源。 两个电极15中的每一个布置在比布线18外侧的周边。放电抑制部分12包括分别设置成围绕多个LED 20设置的各个第一电荷抑制部分，以及分别设置为 以分别围绕两个电极15。 版权所有（C）2013，JPO＆INPIT

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