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公开(公告)号：JP4935139B2
公开(公告)日：2012-05-23
申请号：JP2006087566
申请日：2006-03-28
Applicant: 大日本印刷株式会社
IPC: H05K3/46
CPC classification number: H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , H01L2924/15153 , H01L2924/19103 , H01L2224/32145 , H01L2924/00012 , H01L2924/00
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公开(公告)号：JP4574288B2
公开(公告)日：2010-11-04
申请号：JP2004254851
申请日：2004-09-01
Applicant: 大日本印刷株式会社
CPC classification number: H05K3/4691 , H05K3/0052 , H05K3/4614 , H05K3/462 , H05K2201/0187 , H05K2201/0919 , H05K2201/096 , H05K2201/09845 , H05K2203/0169 , H05K2203/061
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公开(公告)号：JP5082321B2
公开(公告)日：2012-11-28
申请号：JP2006205641
申请日：2006-07-28
Applicant: 大日本印刷株式会社
CPC classification number: H05K1/183 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/15153 , H01L2924/15313 , H01L2924/19105 , H01L2924/30107 , H05K1/0298 , H05K1/0306 , H05K3/284 , H05K3/4069 , H05K3/4614 , H05K3/4697 , H05K2201/10515 , H05K2201/10636 , H05K2203/049 , H05K2203/061 , H05K2203/063 , Y02P70/611 , Y10T29/49126 , H01L2924/00 , H01L2224/0401
Abstract: A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality of interlayer connection conductors for electrically connecting the wiring layers through the insulating layers; wherein a cavity is formed through one or more of the insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for the insulating layers.
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Patent Agency Ranking
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公开(公告)号：JP5034289B2
公开(公告)日：2012-09-26
申请号：JP2006087565
申请日：2006-03-28
Applicant: 大日本印刷株式会社
IPC: H05K3/46
CPC classification number: H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , H01L2924/15153 , H01L2924/19103 , H01L2924/00012 , H01L2924/00
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