公开(公告)号：JP5240890B2

公开(公告)日：2013-07-17

申请号：JP2006214152

申请日：2006-08-07

申请人： 田中電子工業株式会社

发明人： 一誠 牧 ,  有治 中田 ,  昌芳 長尾

IPC分类号： C22C5/02 ,  H01L21/60

CPC分类号： H01L2224/05624 ,  H01L2224/45 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/85201 ,  H01L2224/85375 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01067 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01205 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00012

公开(公告)号：JP5071925B2

公开(公告)日：2012-11-14

申请号：JP2006346047

申请日：2006-12-22

申请人： 田中電子工業株式会社

发明人： 有治 中田 ,  一誠 牧 ,  昌芳 長尾

IPC分类号： H01L21/60

CPC分类号： C22C5/02 ,  H01L2224/05624 ,  H01L2224/45 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2924/01039 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00012

公开(公告)号：JP4793989B2

公开(公告)日：2011-10-12

申请号：JP2006089892

申请日：2006-03-29

申请人： 田中電子工業株式会社

发明人： 有治 中田 ,  一誠 牧 ,  昌芳 長尾

IPC分类号： H01L21/60 ,  C22C5/02

CPC分类号： H01L2224/05624 ,  H01L2224/45 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/01039 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00012

公开(公告)号：JP4641248B2

公开(公告)日：2011-03-02

申请号：JP2005321153

申请日：2005-11-04

申请人： 田中電子工業株式会社

发明人： 有治 中田 ,  一誠 牧 ,  昌芳 長尾

IPC分类号： H01L21/60

CPC分类号： C22C5/02 ,  H01L2224/05624 ,  H01L2224/45 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01065 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/20751 ,  H01L2924/01059 ,  H01L2924/01039 ,  H01L2924/01069 ,  H01L2924/01062 ,  H01L2924/0106 ,  H01L2924/01071 ,  H01L2924/01011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/01006 ,  H01L2924/00012

摘要： PROBLEM TO BE SOLVED: To provide a metal alloy wire for a bonding wire that has excellent bonding properties, linearity, and resin flow resistance properties. SOLUTION: The metal alloy for a bonding wire wire has a component composition in which Ca: 40-80 ppm and Eu:5-40 ppm are contained, Be: 1-10ppm is contained as required, one or two kinds or more of Ba, Sr, Bi, Y, La, Ce, Pr, Nd, Sm, Tb, Ho, Er, Tm, Yb and Lu totaling 5-19 ppm are contained as required, and moreover Ag: 1-10 ppm is contained as required, and the rest is composed of Au and unavoidable impurities, wherein assuming that the 0.2% proof stress of the metal alloy wire for a bonding wire is σ 0.2 , Young's modulus is E, and elongation is E L , then E≥75GPa, (σ 0.2 /E)≥2.2×10 -3 , and 3% L ≤10%. COPYRIGHT: (C)2006,JPO&NCIPI

摘要翻译： 本发明提供一种接合线用金属合金线材，具有优异的接合性，线性和树脂流阻性。 [解决方案]接合线用金属合金具有Ca：40〜80ppm和Eu：5-40ppm的成分组成，Be：根据需要含有1〜10ppm，1〜2种以上 根据需要含有总计5〜19ppm的Ba，Sr，Bi，Y，La，Ce，Pr，Nd，Sm，Tb，Ho，Er，Tm，Yb，Lu，Ag： 其余部分由Au和不可避免的杂质构成，其中假设用于接合线的金属合金线的0.2％屈服应力为0.2，杨氏模量为E，伸长率为EL，E≥75GPa， （＆sgr; 0.2 / E）≥2.2×10-3，3％

公开(公告)号：JP4596467B2

公开(公告)日：2010-12-08

申请号：JP2005173724

申请日：2005-06-14

申请人： 田中電子工業株式会社

发明人： 有治 中田 ,  一誠 牧

IPC分类号： H01L21/60

CPC分类号： C22C5/02 ,  B23K35/3013 ,  H01B1/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05144 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/85 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01205 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/01004 ,  H01L2924/01026 ,  H01L2924/01039 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2924/01006

摘要： There is provided a gold alloy wire for a bonding wire having high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire contains one kind or two kinds of Pt and Pd of 5000 ppm to 2% by mass in total, Ir: 1 to 200 ppm, Ca: 20 to 200 ppm, Eu: 10 to 200 ppm, Be: 0.1 to 30 ppm, if necessary, and La: 10 to 200 ppm, if necessary. At least two kinds of Ca, Eu, Be, and La are in a range of 50 to 250 ppm in total.

公开(公告)号：JP4726206B2

公开(公告)日：2011-07-20

申请号：JP2005173726

申请日：2005-06-14

申请人： 田中電子工業株式会社

发明人： 有治 中田 ,  一誠 牧

IPC分类号： H01L21/60 ,  C22C5/02

CPC分类号： B23K35/3013 ,  C22C5/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2924/00011 ,  H01L2924/01105 ,  H01L2924/01205 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/01063 ,  H01L2924/01077 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01038 ,  H01L2924/01056 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/0102 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/01006

摘要： There are provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance. The gold alloy wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance contains one or more of Pt and Pd of 500 to less than 1000 ppm in total, Ir of 1 to 100 ppm, Ca of more than 30 to 100 ppm, Eu of more than 30 to 100 ppm, Be of 0.1 to 20 ppm, if necessary, one or more of La, Ba, Sr, and Bi of 30 to 100 ppm in total, if necessary, and a balance being Au and inevitable impurities.

公开(公告)号：JP4726205B2

公开(公告)日：2011-07-20

申请号：JP2005173725

申请日：2005-06-14

申请人： 田中電子工業株式会社

发明人： 有治 中田 ,  一誠 牧

IPC分类号： H01L21/60 ,  C22C5/02

CPC分类号： B23K35/3013 ,  C22C5/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01205 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/01004 ,  H01L2924/01202 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2924/01006

摘要： There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm.

公开(公告)号：JP4355637B2

公开(公告)日：2009-11-04

申请号：JP2004266605

申请日：2004-09-14

申请人： 田中電子工業株式会社

发明人： 有治 中田 ,  一誠 牧

IPC分类号： B21C51/00 ,  H01L21/60

CPC分类号： H01L2224/45 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4516 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45171 ,  H01L2224/45184 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/01204 ,  H01L2924/20751 ,  H01L2224/48 ,  H01L2924/01049 ,  H01L2924/01006 ,  H01L2924/00012