公开(公告)号：JP2012033523A

公开(公告)日：2012-02-16

申请号：JP2010169067

申请日：2010-07-28

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： YAMAMOTO TAKESHI ,  NAKAMURA NAOAKI ,  TAKADA MICHIAKI ,  TSUBONE KENICHIRO ,  KURODA YASUHIDE ,  YAGI HARUMI

IPC: H01L23/40 ,  H05K7/20

CPC classification number: H01L23/36 ,  F28F3/02 ,  F28F2280/00 ,  H01L21/4871 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/73253 ,  Y10T29/49721

Abstract: PROBLEM TO BE SOLVED: To remove a heat sink fitted to heat generating electronic components mounted on a board without causing damage to the electronic components when they are replaced.SOLUTION: A heat sink separation method, in an arrangement where a heat sink 10 is fitted via a thermally conductive adhesion layer 5 to an electronic component 3 mounted on a board 1, involves moving a pressing member 20 which acts upon the electronic component 3 side from the heat sink 10 side to move the heat sink 10 in a crosswise direction of the electronic component 3, so that shearing force is exerted upon the adhesion layer 5 sticking the heat sink 10 and the electronic component 3 together by a movement of the heat sink 10 relative to the electronic component 3, whereby the bonding force of the adhesion layer 5 is reduced, causing the heat sink 10 to be separated from the electronic component 3. For the pressing member 20, a set screw 20 can be used which has a tapered narrow tip 21 which is protruded from the heat sink 10 as the screw is turned, coming in contact with the electronic component 3.

Abstract translation: 要解决的问题：拆卸安装在安装在板上的发热电子部件的散热片，而不会在更换电子部件时损坏电子部件。 解决方案：散热器分离方法，其中通过导热粘合层5将散热器10安装到安装在板1上的电子部件3的布置中，包括移动作用在电子元件上的按压部件20 从散热器10侧的部件3侧沿着电子部件3的横向方向移动散热器10，使得剪切力施加在通过移动将散热器10和电子部件3一起粘附在粘合层5上 相对于电子部件3的散热器10的粘接力减小，从而使散热片10与电子部件3分离。对于按压部件20，固定螺钉20可以 所使用的具有锥形窄尖端21，其随着螺钉转动而从散热器10突出，与电子部件3接触。版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2007225463A

公开(公告)日：2007-09-06

申请号：JP2006047735

申请日：2006-02-24

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： KURODA YASUHIDE ,  TSUBONE KENICHIRO

IPC: G01R27/02

CPC classification number: G01M7/025 ,  G01R31/048 ,  G01R31/2817 ,  H05K2203/162

Abstract: PROBLEM TO BE SOLVED: To measure resistance of samples fluctuating at high speed through vibration tests and impact test and the like, by devising wiring structure for a fraction of sample resistance to a Wheatstone bridge of a dynamic strain measuring device. SOLUTION: Bridge resistance at one side of the Wheatstone bridge circuit 18 forms a circuit, series-connecting a strain gauge (fixed reference resistance) 20 constraining the fluctuations due to environmental conditions to a sample 16 with resistance component ΔR fluctuating due to environmental conditions. A fixed bridge input voltage Ei is applied to the Wheatstone bridge circuit 18 from a constant voltage power supply 32, the bridge output voltage Eo is inputted into a dynamic strain amplifier 30, according to resistance fluctuations of the sample 16, and finally carrier wave signal is outputted with a predetermined frequency. A measured resistance calculating section 34 samples the peak level of carrier wave signal, outputted from the dynamic strain amplifier 30 to detect bridge output voltage Eo, and computes resistance of the sample, based on the bridge output voltage detected. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：通过振动试验和冲击试验等来测量高速波动的样品的电阻，通过对动态应变测量装置的惠斯通电桥的样品电阻的一部分设计布线结构。

解决方案：惠斯登电桥电路18一侧的桥接电阻形成电路，将应变计（固定参考电阻）20串联连接，将应变计（固定参考电阻）20限制为环境条件下的波动，使得电阻分量ΔR由于 环境条件。 固定电桥输入电压Ei由恒压电源32施加到惠斯登电桥电路18，根据样品16的电阻波动将桥输出电压Eo输入动态应变放大器30，最后载波信号 以预定频率输出。 测量电阻计算部分34对从动态应变放大器30输出的载波信号的峰值电平进行采样，以检测电桥输出电压Eo，并且基于检测到的桥输出电压来计算样品的电阻。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006147931A

公开(公告)日：2006-06-08

申请号：JP2004337597

申请日：2004-11-22

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： KURODA YASUHIDE

IPC: H01G4/38

CPC classification number: H01G4/38 ,  H01L27/016 ,  H05K1/0231 ,  H05K1/0237 ,  H05K2201/0382 ,  H05K2201/1028 ,  H05K2201/10484 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/0195 ,  H05K2203/041 ,  Y02P70/611

Abstract: PROBLEM TO BE SOLVED: To provide an electronic circuit including a capacitor for cutting a DC component capable of cutting the DC component while suppressing deterioration of frequency characteristics over a wide band, and to provide its manufacturing method. SOLUTION: The electronic circuit includes a first capacitor 60 for cutting the DC component of a low frequency band when a frequency band is two-divided into the low frequency band and a high frequency band, and a plurality of second capacitors 20 and 30 provided for each of narrow bands for cutting the DC component of each narrow band when the high frequency band is further divided into the narrow bands. The first capacitor 60 and the plurality of second capacitors 20 and 30 are connected respectively in parallel. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 解决的问题：提供一种电子电路，包括用于切断能够切断直流成分的直流分量的电容器，同时抑制宽带上的频率特性的劣化，并提供其制造方法。 解决方案：电子电路包括：第一电容器60，用于当频带被分成低频带和高频带时将用于切割低频带的直流分量;以及多个第二电容器20和 30，当高频带进一步被划分成窄带时，为每个窄带切割每个窄带的DC分量。 第一电容器60和多个第二电容器20和30分别并联连接。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JPH11274349A

公开(公告)日：1999-10-08

申请号：JP7077298

申请日：1998-03-19

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： TOTANI MAKOTO ,  KURODA YASUHIDE ,  ONO MASAKI ,  TANEMURA TAKAYOSHI ,  KIYONAGA TETSUYA

IPC: H01L23/12 ,  H01L25/10 ,  H05K1/14

CPC classification number: H05K1/142 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1005 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/3011 ,  Y10S439/928 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To eliminate impedance mismatching generated at a connection part, to reduce the man-hours, and to reduce size of a module, related to connection between electronic circuit modules.
SOLUTION: In an electronic circuit module 99, two signal drawing seats 91 and 92 are provided on both sides of an electronic circuit module main body 90, the first signal drawing seat 91 is formed above by just the thickness portion corresponding to the second signal drawing seat 92, a signal drawing line 93 of the seat 91 is formed at a lower surface of the seat, and a signal drawing line 94 of the seat 92 is formed at the upper surface of the seat. For mounting the electronic circuit module, a second signal drawing seat 92' of an electronic circuit module adjoining the first signal drawing seat 91 and a first signal drawing seat 91' of an electronic circuit module adjoining the second signal drawing seats 92 are stacked for electrical connection between both the electronic circuit modules.
COPYRIGHT: (C)1999,JPO

Abstract translation: 要解决的问题：消除与电子电路模块之间的连接有关的连接部分产生的阻抗失配，减少工时，减小模块的尺寸。 解决方案：在电子电路模块99中，在电子电路模块主体90的两侧设置有两个信号绘制座91和92，第一信号绘制座91仅在对应于第二信号绘图的厚度部分的上方形成 座椅92的座位91的下表面形成有座位91的信号画线93，座椅的上表面形成有座92的信号描绘线94。 为了安装电子电路模块，邻接第一信号绘图座91的电子电路模块的第二信号绘图座92'和与第二信号绘图座92相邻的电子电路模块的第一信号绘图座91' 两个电子电路模块之间的连接。

公开(公告)号：JP2008227183A

公开(公告)日：2008-09-25

申请号：JP2007064004

申请日：2007-03-13

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： KURODA YASUHIDE ,  ISHIKAWA TETSUJI

IPC: H05K3/34

CPC classification number: H05K3/3442 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: PROBLEM TO BE SOLVED: To provide a printed board unit and a printed circuit board, capable of avoiding occurrence of tombstone phenomenon. SOLUTION: A cream solder 22, for example, is coated on a conductive pad 18. An electronic component 19 is mounted on the cream solder 22. The cream solder 22 melts when heated. A fillet is formed on the cream solder, in other words a molten solder 22. Based on the fillet, a surface tension is generated at the molten solder 22. Based on the surface tension of the molten solder 22 on a body region 18a, the electronic component 19 is pulled toward the outer edge of the body region 18a. In the similar manner, the electronic component 19 is pulled toward a protrusion region 18b based on the surface tension of the molten solder 22 on the protrusion region 18b. The two surface tensions balance with each other. The electronic component 19 is avoided from rising. As a result, occurrence of tombstone phenomenon is avoided. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供能够避免出现墓碑现象的印刷电路板单元和印刷电路板。

解决方案：例如，膏状焊料22涂覆在导电垫18上。电子部件19安装在膏状焊料22上。膏状焊料22在加热时熔化。 在奶油焊料上形成圆角，换句话说是熔融焊料22.基于圆角，在熔融焊料22处产生表面张力。基于体区18a上的熔融焊料22的表面张力， 电子部件19被拉向身体区域18a的外边缘。 以类似的方式，基于突出区域18b上的熔融焊料22的表面张力将电子部件19拉向突出区域18b。 两个表面张力相互平衡。 电子元件19避免上升。 结果，避免了墓碑现象的发生。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007305516A

公开(公告)日：2007-11-22

申请号：JP2006135043

申请日：2006-05-15

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： KURODA YASUHIDE ,  YAGISAWA TAKATOSHI

CPC classification number: H01P5/085 ,  H01R12/63 ,  H01R24/50 ,  H01R2103/00 ,  H05K1/0243 ,  H05K1/189 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: PROBLEM TO BE SOLVED: To provide a coax connector which can be easily fitted to a transmission line having flexibility.
SOLUTION: The coax connector 20 is connected with a flexible printed circuit board 30 with a signal line formed. The connector 20 is provided with an inner conductor 24 so structured to have the signal line connected, and an outer conductor surrounding the periphery of the inner conductor and functioning as a connector main body. A part of the flexible printed circuit board 30 is inserted into a slit 26 provided at the outer conductor 22 to be electrically jointed with it.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种可以容易地装配到具有柔性的传输线的同轴电缆连接器。 解决方案：同轴电缆连接器20与形成有信号线的柔性印刷电路板30连接。 连接器20设置有内部导体24，该内部导体24被构造为具有连接的信号线，以及围绕内部导体的周边并且用作连接器主体的外部导体。 柔性印刷电路板30的一部分插入到设置在外导体22处的狭缝26中以与其电连接。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007109839A

公开(公告)日：2007-04-26

申请号：JP2005298347

申请日：2005-10-13

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： YAGISAWA TAKATOSHI ,  IKEUCHI AKIRA ,  KURODA YASUHIDE ,  CHO SHISEI

IPC: H01F41/04 ,  H01F41/10 ,  H01P1/00

CPC classification number: H01F5/00 ,  H01F27/027 ,  H01F2005/006 ,  H01Q1/36 ,  H01Q19/09 ,  H05K1/0243

Abstract: PROBLEM TO BE SOLVED: To make handling easier and to improve frequency characteristics of a cone shaped coil for high frequency without its deterioration, in a coil package and a bias T package.
SOLUTION: In a cone-shaped coil 10, conductive wire is wound around the perimeter side of the core, and the diameter of the winding becomes small gradually toward the other end from one end, while forming the shape of a cone or polygonal pyramid. A hole 21 is formed so as to make the tip of the cone-shaped coil 10 insert a dielectric substrate 20 for carrying out the electrical connection between the bottom of the hole 21 and the rear face of the dielectric substrate 20 through the via. In the hole 21, the cone-shaped coil 10 is arranged from the small diameter side so as to connect electrically the bottom of the hole 21 and the tip lead wire of the cone-shaped coil 10. The cone-shaped coil 10 and the dielectric substrate 20 are constituted integrally by connecting the electrode 13 by the side of a large diameter of the cone-shaped coil 10 with the electrode 23 of the dielectric substrate 20.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了使处理更容易，并且在线圈封装和偏置T封装中，高频而不改变锥形线圈的频率特性。 解决方案：在锥形线圈10中，导电线围绕芯的周边缠绕，并且绕组的直径从一端向另一端逐渐变小，同时形成锥形或 多边形金字塔。 孔21形成为使得锥形线圈10的尖端插入用于通过通孔在孔21的底部和电介质基板20的背面之间进行电连接的电介质基板20。 在孔21中，锥形线圈10从小直径侧布置成电连接孔21的底部和锥形线圈10的尖端引线。锥形线圈10和 电介质基板20通过将电极13与锥形线圈10的大直径侧的电极13与电介质基板20的电极23连接而构成。版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2004145163A

公开(公告)日：2004-05-20

申请号：JP2002312080

申请日：2002-10-28

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： ICHIHARA YASUHIRO ,  KURODA YASUHIDE

IPC: G02B6/42 ,  H01L31/02 ,  H01S5/02

CPC classification number: H04B10/801 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a receptacle type optical/electrical module capable of attaching and detaching an optical module to and from an electric circuit assembly in a simple manner.
SOLUTION: The receptacle type optical/electrical module 2 includes a first segment 16a, a second segment 16b arranged approximately perpendicularly to the first segment 16a and a printed wiring board 16 having a flexible portion for connecting the first and second segments. The opto-electric module 2 further includes first electric circuit components 18 and 20 packaged onto the first segment, second electric circuit components 22 and 24 packaged onto the second segment, a socket packaged on the rear surface of the second segment and an optical module attachably and detachably attached to the socket, etc. The receptacle type optical signal transmitting or receiving module capable of easily attaching and detaching the optical module to and from the electric circuit assembly can be thereby provided.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2002222907A

公开(公告)日：2002-08-09

申请号：JP2001014900

申请日：2001-01-23

Applicant: FUJITSU LTD

Inventor： KURODA YASUHIDE ,  SHIOTANI TAKASHI

IPC: G02B6/42 ,  H01L23/48 ,  H01L23/50 ,  H01S5/022 ,  H05K1/18

Abstract: PROBLEM TO BE SOLVED: To bend lends of a CAN type optical device without giving adverse influences on glass seals. SOLUTION: A capillary 201 is set to insert a lead 66 of a CAN type optical device 60 therein with the lead 66 retained at the root by a lead clamp 177 of a CAN type LD package clamp mechanism 151, and the capillary 201 is displaced in this condition to bend the lead.

公开(公告)号：JPH06140778A

公开(公告)日：1994-05-20

申请号：JP28485592

申请日：1992-10-23

Applicant: FUJITSU LTD

Inventor： KUMAI TOSHIO ,  KURODA YASUHIDE ,  GOTO SHIGERU

IPC: H01P11/00 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14

Abstract: PURPOSE:To realize excellent heat dissipation and to prevent a module constituent from being damaged by temperature change by forming a main constituent component of ceramics of the same material having high heat conductivity. CONSTITUTION:Ceramic spacers 30-1, 30-2, piece modules 20-1, 20-2, 20-3, a ceramic cap 30-T, and a ceramic edge face board 35 are formed of the same material as ceramic multilayer substrates 21-1, 21-2, 21-3. The ceramic spacer 30-1 is interposed in a side edge of the piece module 20-1 and the piece module 20-2 is laminated and adhered. The ceramic spacer 30-2 is interposed in a side edge of the piece module 20-2 and the piece module 20-3 is laminated and adhered. The ceramic cap 30-T is laminated and adhered outside the piece module 20-3, an outer peripheral surface is assembled to a tube and the ceramic edge face board 35 is adhered to an opening part to constitute a bottomed tubular module. Since a main constituent composition is formed ceramics of the same material having heat conduction, heat dissipation can be improved.