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    Wiring circuit board and method of manufacturing the same
    2.
    发明专利
    Wiring circuit board and method of manufacturing the same 有权
    接线电路板及其制造方法

    公开(公告)号：JP2009182229A

    公开(公告)日：2009-08-13

    申请号：JP2008021274

    申请日：2008-01-31

    申请人： Nitto Denko Corp ,  日東電工株式会社

    发明人： ISHIMARU YASUTO ,  EBE HIROSHI

    IPC分类号： H01L21/60 ,  H01L23/12 ,  H05K1/02

    CPC分类号： H05K3/303 ,  H01L23/3735 ,  H01L2224/16225 ,  H05K1/0203 ,  H05K1/0269 ,  H05K1/189 ,  H05K2201/0108 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/166 ,  Y02P70/613 ,  Y10T29/49162

    摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board which improves heat dissipation and can easily recognize dislocation of an electronic component, and to provide a method of manufacturing the wiring circuit board. SOLUTION: A rectangular mounting region S is arranged in an almost center of one face of an insulating layer 1. A plurality of conductor patterns 2 are formed so that they extend from an inner side to an external side of the mounting region S. A cover insulating layer 4 is formed to cover a plurality of the conductor patterns 2 at a periphery of the mounting region S. The electronic component 5 is mounted on the insulating layer 1 so that it is overlapped with the mounting region S. A metal layer 3 is arranged on the other face of the insulating layer 1. Rectangular openings 3a to 3f are formed on the metal layer 3 so that they follow a pair of long sides and a pair of short sides of the mounting region S. The openings 3a to 3f face part of a terminal part 21 of each conductor pattern 2 across the insulating layer 1. COPYRIGHT: (C)2009,JPO&INPIT

    摘要翻译： 要解决的问题：提供一种改善散热并且容易识别电子部件的位错的布线电路板，并提供一种制造布线电路板的方法。 解决方案：矩形安装区域S布置在绝缘层1的一个面的几乎中心。多个导体图案2形成为从安装区域S的内侧延伸到外侧 覆盖绝缘层4形成为在安装区域S的周围覆盖多个导体图案2.电子部件5安装在绝缘层1上，使其与安装区域S重叠。金属 层3布置在绝缘层1的另一面上。矩形开口3a至3f形成在金属层3上，使得它们跟随安装区域S的一对长边和一对短边。开口3a 到3f面对绝缘层1上每个导体图案2的端子部分21的一部分。版权所有：（C）2009，JPO＆INPIT

    Wiring circuit board and its manufacturing method
    3.
    发明专利
    Wiring circuit board and its manufacturing method 审中-公开
    接线电路及其制造方法

    公开(公告)号：JP2009182228A

    公开(公告)日：2009-08-13

    申请号：JP2008021273

    申请日：2008-01-31

    申请人： Nitto Denko Corp ,  日東電工株式会社

    发明人： ISHIMARU YASUTO ,  EBE HIROSHI

    IPC分类号： H05K1/02 ,  H01L21/60 ,  H01L23/12 ,  H01L23/36

    CPC分类号： H05K1/0209 ,  H01L23/3735 ,  H01L23/562 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/189 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10674

    摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board which is improved in a heat dissipation property while excellently keeping the connection to an electronic component.
    SOLUTION: On the almost center part of one surface of an insulating layer 1, a mounting region S is provided. A conductor pattern 2 is formed so as to extend from the inner side of the mounting region S to the outer side. Around the mounting region S, a cover insulating layer 4 is formed so as to cover the conductor pattern 2. The terminal part 21 of the conductor pattern 2 is disposed on the mounting region S, and the bump of the electronic component 5 is bonded to the terminal part 21. On the other surface of the insulating layer 1, a metal layer 3 composed of copper, for instance, is provided. On the metal layer 3, a pair of slits 3a is formed so as to clamp a region facing the electronic component 5. The respective slits 3a are formed so as not to divide the metal layer 3 into a plurality of regions.
    COPYRIGHT: (C)2009,JPO&INPIT

    摘要翻译： 要解决的问题：提供一种在良好地保持与电子部件的连接的同时提高散热性的布线电路基板。 解决方案：在绝缘层1的一个表面的几乎中心部分上，设置安装区域S. 导体图案2形成为从安装区域S的内侧延伸到外侧。 在安装区域S的周围形成覆盖绝缘层4以覆盖导体图案2.导体图案2的端子部21设置在安装区域S上，电子部件5的凸块接合到 端子部分21.在绝缘层1的另一个表面上，提供例如由铜构成的金属层3。 在金属层3上形成有一对狭缝3a，以夹持面向电子部件5的区域。各狭缝3a形成为不将金属层3分割成多个区域。 版权所有（C）2009，JPO＆INPIT

    Wiring circuit board, fuel cell, and method for manufacturing wiring circuit board
    4.
    发明专利
    Wiring circuit board, fuel cell, and method for manufacturing wiring circuit board 审中-公开
    接线电路板，燃料电池及制造电路板的方法

    公开(公告)号：JP2012104383A

    公开(公告)日：2012-05-31

    申请号：JP2010252125

    申请日：2010-11-10

    申请人： Nitto Denko Corp ,  日東電工株式会社

    发明人： INOUE SHINICHI ,  HASEGAWA MINEYOSHI ,  EBE HIROSHI

    IPC分类号： H01M8/02 ,  H05K1/09

    CPC分类号： Y02P70/56

    摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board which allows a structure of a fuel cell to be simplified, and to provide a fuel cell and a method for manufacturing the wiring circuit board.SOLUTION: An FPC board 1 comprises a base insulating layer 2 made of a porous material having continuous pores. As a material of the base insulating layer 2, for example, a porous ePTFE (expanded polytetrafluoroethylene) having continuous pores is used. A conductor pattern 3 made of, for example, copper is formed on one surface of the base insulating layer 2 via an adhesive pattern 7. A coating layer 6 made of, for example, silver is formed so as to cover a surface of the conductor pattern 3.

    摘要翻译： 要解决的问题：提供一种简化燃料电池结构的布线电路板，提供一种燃料电池及其制造方法。 解决方案：FPC基板1包括由具有连续孔的多孔材料制成的基底绝缘层2。 作为基底绝缘层2的材料，例如可以使用具有连续孔的多孔ePTFE（发泡聚四氟乙烯）。 由例如铜制成的导体图案3经由粘合剂图案7形成在基底绝缘层2的一个表面上。由例如银制成的涂层6形成为覆盖导体的表面 版权所有。（C）2012，JPO＆INPIT

    Wiring circuit board, fuel battery, and method for manufacturing wiring circuit board
    5.
    发明专利
    Wiring circuit board, fuel battery, and method for manufacturing wiring circuit board 审中-公开
    接线电路板，燃料电池及制造电路板的方法

    公开(公告)号：JP2012004098A

    公开(公告)日：2012-01-05

    申请号：JP2010252124

    申请日：2010-11-10

    申请人： Nitto Denko Corp ,  日東電工株式会社

    发明人： HANAZONO HIROYUKI ,  INOUE SHINICHI ,  HASEGAWA MINEYOSHI ,  OKUMURA KEISUKE ,  EBE HIROSHI

    IPC分类号： H01M8/02 ,  H01M8/10

    CPC分类号： H01M8/0269 ,  H01M8/1011 ,  H01M8/2465 ,  Y02E60/523 ,  Y02P70/56 ,  Y10T29/49155

    摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board, a fuel battery, and a method for manufacturing a wiring circuit board which can simplify the structure of the fuel battery.SOLUTION: An FPC substrate 1, an electrode film 35, and a fuel storage chamber 50 are stored in a casing 40. At the FPC substrate 1, a plurality of power collection portions 3e and 3j are conjoined over a base insulating layer 2 through an adhesive pattern 7. The base insulating layer 2 is made of porous ePTFE and has air permeability. Holes H11 and H12 are formed in the power collection portions 3e and 3j. The adhesive pattern 7 has the same shape as the plurality of power collection portions 3e and 3j. The FPC substrate 1 is sandwiched between an upper surface part 41 and a lower surface part 42 of the casing 40 with the FPC substrate 1 being bent along a bent part B1. The electrode film 35 is provided between the plurality of power collection portions 3e and 3j of the FPC substrate 1. The fuel storage chamber 50 is provided between the FPC substrate 1 and the lower surface part 42 so as to be in contact with the base insulating layer 2. Liquid fuel is supplied to the fuel storage chamber 50.

    摘要翻译： 要解决的问题：提供一种可以简化燃料电池的结构的布线电路板，燃料电池和制造布线电路板的方法。 解决方案：FPC基板1，电极膜35和燃料储存室50存储在壳体40中。在FPC基板1上，多个集电部分3e和3j结合在基底绝缘层 基底绝缘层2由多孔ePTFE制成，具有透气性。 在电力收集部分3e和3j中形成有孔H11和H12。 粘合剂图案7具有与多个集电部3e和3j相同的形状。 FPC基板1被夹在壳体40的上表面部分41和下表面部分42之间，FPC基板1沿弯曲部分B1弯曲。 电极膜35设置在FPC基板1的多个集电部3e和3j之间。燃料存储室50设置在FPC基板1和下表面部42之间，以与基板绝缘 液体燃料供应到燃料储存室50.版权所有（C）2012，JPO＆INPIT

    Wiring circuit board and method of manufacturing the same
    6.
    发明专利
    Wiring circuit board and method of manufacturing the same 有权
    接线电路板及其制造方法

    公开(公告)号：JP2009182227A

    公开(公告)日：2009-08-13

    申请号：JP2008021272

    申请日：2008-01-31

    申请人： Nitto Denko Corp ,  日東電工株式会社

    发明人： ISHIMARU YASUTO ,  EBE HIROSHI

    IPC分类号： H01L21/60 ,  H01L23/12 ,  H05K1/02

    CPC分类号： H05K1/0209 ,  H01L23/3735 ,  H01L23/562 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/189 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10674 ,  Y10T29/49162

    摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board which sufficiently secures heat dissipation and improves connectability with an electronic component, and to provide a method of manufacturing the board. SOLUTION: A mounting region S is arranged in an almost center of one face of an insulating layer 1. A conductor pattern 2 is formed so that it extends from an inner side to an external side of the mounting region S. A cover insulating layer 4 is formed at a periphery of the mounting region S so that the layer covers the conductor pattern 2. Terminal parts 21 of the conductor patterns 2 are disposed on the mounting region S, and bumps of the electronic component 5 are bonded to the terminal parts 21. A metal layer 3 formed of copper, for example, is arranged on the other face of the insulating layer 1. A slit 3a is formed in the metal layer 3 so that it crosses a region confronted with the electronic component 5 and divides the metal layer 3. COPYRIGHT: (C)2009,JPO&INPIT

    摘要翻译： 要解决的问题：提供一种能够充分确保散热并提高与电子部件的连接性的布线电路板，并提供一种制造该基板的方法。

    解决方案：安装区域S布置在绝缘层1的一个面的几乎中心。导体图案2形成为从安装区域S的内侧延伸到外侧。盖 绝缘层4形成在安装区域S的周围，使得该层覆盖导体图案2.导体图案2的端子部分21设置在安装区域S上，并且电子部件5的凸起接合到 端子部分21.例如，由铜形成的金属层3布置在绝缘层1的另一面上。在金属层3中形成狭缝3a，使得它穿过面对电子部件5的区域，并且 划分金属层3.版权所有（C）2009，JPO＆INPIT

    Cof board
    7.
    发明专利
    Cof board 审中-公开
    中粮集团

    公开(公告)号：JP2009094361A

    公开(公告)日：2009-04-30

    申请号：JP2007264797

    申请日：2007-10-10

    申请人： Nitto Denko Corp ,  日東電工株式会社

    发明人： ISHIMARU YASUTO ,  EBE HIROSHI

    IPC分类号： H01L21/60 ,  H01L23/12

    CPC分类号： H05K1/111 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/056 ,  H05K1/189 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/1545 ,  Y02P70/611 ,  H01L2924/00

    摘要： PROBLEM TO BE SOLVED: To provide a COF board which is high in connection reliability while increasing packaging density.
    SOLUTION: A COF board 1 includes a base insulating layer 2; and an inner lead 8 formed on the insulating layer 2, and electrically connected to an IC chip. The inner lead 8 is formed of a first inner lead 12 extended to a longitudinal direction and a second inner lead 13 extended to the longitudinal direction with a longitudinal length L4 shorter than longitudinal length L3 of the first inner lead 12, and a plurality of first inner leads 12 are arranged with intervals in the width direction, and a plurality of second inner leads 13 are arranged so that an overlapped section 14 where the second inner leads 13 are overlapped when the mutually adjacent first inner leads 12 are projected in the width direction and a non-overlapped section 15 in which the second inner leads 13 are not overlapped can be formed between the mutually adjacent first inner leads 12 in the width direction. A dummy lead 16 is formed in the non-overlapped section 15.
    COPYRIGHT: (C)2009,JPO&INPIT

    摘要翻译： 要解决的问题：提供一种在提高包装密度的同时可靠性高的COF板。 解决方案：COF板1包括基底绝缘层2; 以及形成在绝缘层2上并与IC芯片电连接的内引线8。 内引线8由沿纵向方向延伸的第一内引线12和延伸到纵向方向的第二内引线13形成，其纵向长度L4比第一内引线12的纵向长度L3短， 内引线12在宽度方向上间隔设置，并且多个第二内引线13布置成使得当相互相邻的第一内引线12沿宽度方向突出时第二内引线13重叠的重叠部分14 并且可以在相互相邻的第一内引线12之间沿宽度方向形成第二内引线13不重叠的非重叠部15。 在非重叠部分15中形成虚拟引线16.版权所有（C）2009，JPO＆INPIT

    Patch and patch preparation
    8.
    发明专利
    Patch and patch preparation 有权
    配对和配对准备

    公开(公告)号：JP2009029783A

    公开(公告)日：2009-02-12

    申请号：JP2008156856

    申请日：2008-06-16

    申请人： Nitto Denko Corp ,  日東電工株式会社

    发明人： HAMADA MASASHI ,  KASAHARA TAKESHI ,  ISHIKURA JUN ,  FUNABASHI YOSHINORI ,  EBE HIROSHI ,  IMOTO EIICHI ,  HABU TSUYOSHI

    IPC分类号： A61K47/32 ,  A61K9/70 ,  A61K47/06 ,  A61K47/46

    CPC分类号： A61K31/405 ,  A61K9/7053 ,  A61K47/14 ,  A61L31/041 ,  C08L23/20

    摘要： PROBLEM TO BE SOLVED: To provide a patch and a patch preparation that do not require an acrylic polymer and are capable of holding a large amount of an organic liquid component in an adhesive layer.
    SOLUTION: The patch includes a support, and an adhesive layer provided on at least one surface of the support, wherein the adhesive layer contains a polyisobutylene, a liquid rubber component having a crosslinkable functional group in a molecule, and an organic liquid component, and the adhesive layer is crosslinked. The patch preparation further contains a medicine in the adhesive layer of the patch.
    COPYRIGHT: (C)2009,JPO&INPIT

    摘要翻译： 要解决的问题：提供不需要丙烯酸类聚合物并且能够在粘合剂层中保持大量有机液体组分的贴剂和贴剂制剂。 解决方案：贴片包括支撑体和设置在支撑体的至少一个表面上的粘合剂层，其中粘合剂层包含聚异丁烯，在分子中具有可交联官能团的液体橡胶组分和有机液体 组分，并且粘合剂层交联。 贴片制剂还在贴剂的粘合剂层中含有药物。 版权所有（C）2009，JPO＆INPIT

    軟磁性樹脂組成物および軟磁性フィルム
    10.
    发明专利
    軟磁性樹脂組成物および軟磁性フィルム 审中-公开
    软磁性树脂组合物和软磁膜

    公开(公告)号：JP2015005711A

    公开(公告)日：2015-01-08

    申请号：JP2013170630

    申请日：2013-08-20

    申请人： 日東電工株式会社 ,  Nitto Denko Corp

    发明人： MASUDA SHOTARO ,  EBE HIROSHI ,  HABU TSUYOSHI

    IPC分类号： H01F1/26 ,  H01F1/147 ,  H01F1/20

    CPC分类号： H01F1/147 ,  B22F1/0011 ,  C22C2202/02 ,  H01F1/26 ,  H01F1/37

    摘要： 【課題】薄膜化が可能であり、比透磁率が良好な軟磁性フィルムを確実に製造することができる軟磁性樹脂組成物、および、その軟磁性樹脂組成物から得られる軟磁性フィルムを提供すること。【解決手段】軟磁性樹脂組成物は、扁平状の軟磁性粒子および熱硬化性樹脂成分を含有し、軟磁性粒子の平均粒子径が、100μm以上300μm以下であり、軟磁性粒子の平均厚みが、0.5μm以上2.0μm以下であり、軟磁性粒子の含有割合(固形分)が、50体積%以上である。【選択図】なし

    摘要翻译： 要解决的问题：提供：容易从其形成薄膜的软磁性树脂组合物，并且能够毫不费力地制造具有良好相对磁导率的软磁性膜; 和由这种软磁性树脂组合物制成的软磁性膜。解决方案：软磁性树脂组合物包括：扁平软磁性颗粒; 和热固性树脂组分。 软磁性粒子的平均粒径为100〜300μm，平均厚度为0.5〜2.0μm。 软磁性粒子（固体成分）的含量为50体积％以上。