公开(公告)号：JP2008047928A

公开(公告)日：2008-02-28

申请号：JP2007231338

申请日：2007-09-06

Applicant: Seiko Epson Corp ,  セイコーエプソン株式会社

Inventor： NAKAYAMA HIROHISA ,  SATO SHIRO ,  SHOJI MASANORI ,  NOSAKA HITOSHI

IPC: H01L21/60 ,  H05K3/26

CPC classification number: H01L2224/16 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which reliability of an external terminal can be improved, and a method of processing an electric connection.
SOLUTION: The method of manufacturing a semiconductor device includes steps of (a) providing a paste containing acid on the electric connection parts 12 and 14 electrically conducting with a semiconductor substrate 20, so that this paste is left for a prescribed time until a reduction of a metal, being a material of the electric connection parts 12 and 14, is finished, (b) eliminating the paste from the electric connection parts 12 and 14 by washing the electric connection parts 12 and 14, and (C) providing a conductive member on the electric connection parts 12 and 14.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 解决的问题：提供一种制造可以提高外部端子的可靠性的半导体器件的制造方法以及处理电连接的方法。 解决方案：制造半导体器件的方法包括以下步骤：（a）在与半导体衬底20导电的电连接部分12和14上提供含酸的糊状物，使得该糊状物留置规定的时间直到 完成作为电连接部件12和14的材料的金属的还原，（b）通过洗涤电连接部件12和14来从电连接部件12和14去除糊料，（C）提供 电连接部件12和14上的导电部件。版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2006202905A

公开(公告)日：2006-08-03

申请号：JP2005011763

申请日：2005-01-19

Applicant: Seiko Epson Corp ,  セイコーエプソン株式会社

Inventor： NAKAYAMA HIROHISA ,  SATO SHIRO ,  SHOJI MASANORI ,  NOSAKA HITOSHI

IPC: H01L23/12 ,  H01L21/60

CPC classification number: H05K3/3489 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/02331 ,  H01L2224/0236 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/0381 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/06131 ,  H01L2224/06155 ,  H01L2224/11 ,  H01L2224/1191 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which reliability of an external terminal can be improved, and a method of processing an electric connection. SOLUTION: The method of manufacturing a semiconductor device 40 includes a step of providing a paste containing acid on the electric connection 14 electrically conducting with a semiconductor substrate 20, eliminating the paste from the electric connection 14 by washing the electric connection 14, and providing a conductive member 60 on the connection 14. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种制造可以提高外部端子的可靠性的半导体器件的制造方法以及一种处理电连接的方法。 解决方案：制造半导体器件40的方法包括在与半导体衬底20导电的电连接14上提供含有酸的步骤，通过洗涤电连接14从电连接14消除糊料， 并在连接14上提供导电构件60.版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005129848A

公开(公告)日：2005-05-19

申请号：JP2003366082

申请日：2003-10-27

Applicant: Seiko Epson Corp ,  セイコーエプソン株式会社

Inventor： SATO SHIRO ,  AOYANAGI TETSUTOSHI

IPC: H01L23/12 ,  H01L21/48 ,  H01L21/68

CPC classification number: H01L21/6835 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method and manufacturing equipment of a semiconductor device which is higher in reliability. SOLUTION: A semiconductor module 100 is prepared which includes a wiring board 10, a plurality of semiconductor chips 20 mounted on a first face 16 of the wiring board 10, a central region 102 overlapped with the semiconductor chips 20, and an end region 104 surrounding the central region 102. The first face 16 of the wiring board 10 is arranged to be confronted with an adhesive tape 40, and the adhesive tape 40 is bonded to the semiconductor module 100 by a roller 50, after which the semiconductor module 100 is cut off from a side of a second face 18 of the wiring board 10. The roller 50 includes a central portion 52 and both ends 54, then the adhesive tape 40 is pressed from an upper part of the central region 102 by the central portion 52. In addition, the adhesive tape 40 is pressed from an upper part of the end region 104 by the both ends 54. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供可靠性更高的半导体器件的制造方法和制造设备。 解决方案：制备半导体模块100，其包括布线板10，安装在布线板10的第一面16上的多个半导体芯片20，与半导体芯片20重叠的中心区域102，以及端部 区域104围绕中心区域102.布线板10的第一面16布置成面对粘合带40，并且粘合带40通过辊50接合到半导体模块100，之后半导体模块 100从布线板10的第二面18的一侧切下。滚子50包括中心部分52和两端54，然后粘合带40从中心区域102的上部被中心部分 另外，粘合带40由端部54从端部区域104的上部按压。版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2009130317A

公开(公告)日：2009-06-11

申请号：JP2007306945

申请日：2007-11-28

Applicant: Seiko Epson Corp ,  セイコーエプソン株式会社

Inventor： SATO SHIRO

IPC: H01L21/60 ,  C09J7/02

CPC classification number: H05K3/323 ,  C09J7/20 ,  C09J2201/20 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/83101 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K2203/066 ,  Y10T428/24331

Abstract: PROBLEM TO BE SOLVED: To provide a film adhesive capable of improving its feeding precision, and to provide a transporting method for the same. SOLUTION: An ACF reel 10 consists of an ACF part 1 and a separator part 3 laid on one face of the ACF part 1. The ACF reel 10 also comprises a perforation hole 5 for feeding the ACF reel 10 in the longitudinal direction. According to such a constitution, it is possible to feed the ACF reel 10 in the longitudinal direction, by inserting a pin into the perforation hole 5 and moving the pin. The positional deviation and slippage of the ACF reel 10 can be prevented, because pin is inserted into the perforation hole 5 during feeding the ACF reel 10. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供能够提高其进给精度的膜粘合剂，并提供其用于其的输送方法。 解决方案：ACF卷轴10由ACF部分1和布置在ACF部分1的一个表面上的分离器部分3组成.ACF卷轴10还包括穿孔5，用于在ACF卷轴10的纵向方向 。 根据这样的结构，可以通过将销插入穿孔5并使销移动而将ACF卷轴10沿纵向进给。 由于在进给ACF卷盘10期间销被插入穿孔5中，所以可以防止ACF卷盘10的位置偏移和滑动。（C）2009，JPO＆INPIT

公开(公告)号：JP2007227608A

公开(公告)日：2007-09-06

申请号：JP2006046459

申请日：2006-02-23

Applicant: Seiko Epson Corp ,  セイコーエプソン株式会社

Inventor： NAKAYAMA HIROHISA ,  SATO SHIRO

IPC: H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To stably seal a semiconductor chip while reducing the warpage of a package.
SOLUTION: A first resin 8 is arranged on a carrier substrate 1 inside a semiconductor chip 5 and the semiconductor chip 5 is facedown-mounted on the carrier substrate 1, thereby fixing the semiconductor chip 5 on the carrier substrate 1 with the first resin 8. Then, a second resin 9 is injected into the vicinity of the first resin 8 below the facedown-mounted semiconductor chip 5, thereby filling the second resin 9 into the vicinity of the first resin 8 below the semiconductor chip 5.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了稳定地密封半导体芯片，同时减少封装的翘曲。 解决方案：第一树脂8布置在半导体芯片5内的载体基板1上，并且半导体芯片5面朝下安装在载体基板1上，从而将半导体芯片5固定在载体基板1上， 然后，将第二树脂9注入面向下的半导体芯片5的下方的第一树脂8附近，从而将第二树脂9填充到半导体芯片5的下方的第一树脂8附近。

版权所有（C）2007，JPO＆INPIT