摘要:
PROBLEM TO BE SOLVED: To provide a power composite distributor which can improve filter characteristics without increasing a circuit scale. SOLUTION: According to this power composite distributor, the first high frequency signal line T101 and the second high frequency signal line T102 of the constituting element of an Wilkinson power composite distributor are electromagnetic field coupled, and a third high frequency line T103 and a fourth high frequency line T104 are electromagnetic field coupled in a reverse direction to one another. Consequently, steep filter characteristics having an attenuation pole B can be realized. COPYRIGHT: (C)2006,JPO&NCIPI
摘要:
PROBLEM TO BE SOLVED: To provide a filter circuit which is excellent in a degree of steepness and a group delay characteristic, and composed by a small kinds of circuit structure elements. SOLUTION: The filter is provided with a total of 8 resonators K1 to K8 between an input terminal 11 and an output terminal 12. The input terminal 11 is connected to the end of the K1 and the end of the K2, their other ends are respectively connected to the resonators K3 and the K4, and other terminals of the K3 and the K4 are grounded. And, an end of the resonators K5 and K7 are connected to the connection node of the K1 and K3, and the end of the resonators K6 and K8 are connected to the connection node of the resonators K2 and K4. Furthermore, other ends of the resonators K5 and K6 are grounded, and other ends of the resonators K7 and K8 are connected to the output terminal 12. COPYRIGHT: (C)2006,JPO&NCIPI
摘要:
PROBLEM TO BE SOLVED: To provide a high frequency front end circuit which enables the antenna diversity in both transmission and reception by suppressing the double harmonic spurious radiation at transmission and allows circuit components to be used in common. SOLUTION: The high frequency front end circuit enables the 5 GHz-band reception (via a diplexer D102 and a receiving filter 109) using a first antenna 101 and the 2.5 GHz-band transmission (via diplexers D102, D103) when a switch 106 connects a terminal 106a to a terminal 106b, with only a fourth switch S104 turned on in a switch part 103. It also enables the 2.5 GHz-band reception (via the diplexer D103 and a receiving filter 108) using a second antenna 102 and the 5 GHz-band transmission (via diplexers D101, D103) when the switch 106 connects the terminal 106a to a terminal 106c, with only a second switch S102 turned on in the switch part 103. COPYRIGHT: (C)2005,JPO&NCIPI
摘要:
PROBLEM TO BE SOLVED: To provide a small-sized balanced amplifier circuit that can perform accurate balance operation in wide bands. SOLUTION: Between an output terminal (drain terminal) of a semiconductor device 105 in a first unit amplifier 111 and an output port 103, a -90 degrees phase-shift circuit 109 is connected, while between an output terminal (drain terminal) of a semiconductor device 106 in a second unit amplifier 112 and the output port 103, a +90 degrees phase-shift circuit 110 is connected. Between first and second ports 101, 102, there is inserted a series circuit made up of first and second inductance components L101, L102 with an almost identical size. Then, to a middle point between the first and second inductance components L101, L102, a bias feed terminal 104 is connected, and between the middle point and a ground, a series circuit made up of a resistance component R101 and a capacitance component C101 is connected. COPYRIGHT: (C)2005,JPO&NCIPI
摘要:
PROBLEM TO BE SOLVED: To provide a reversed power distributor and a reversed power combiner with a small scale that can be united and integrated into a RFIC and enhance the suppression characteristic at the outside of an operating band and to provide a high frequency communication apparatus employing them. SOLUTION: An inductive component L1a is connected between an input port IN and an output port OUT 1, and a capacitive component C1a is connected between the input port IN and an output port OUT 2. A T-shaped circuit (C2a, C3a, R1a) is connected between the output ports OUT 1, OUT 2. A parallel resonance circuit (C4a, L4a) is connected between the input port IN and ground, and the output ports OUT 1, OUT 2 are respectively connected to ground via inductive components L2a, L3a. The inductive components L1a to L4a, and capacitive components C1a to C4a, and the resistive component R1 are set so that a received high frequency signal is distributed into two high frequency signals whose phase are shifted by about 180 degrees with each other and outputted. COPYRIGHT: (C)2005,JPO&NCIPI
摘要:
PROBLEM TO BE SOLVED: To provide a multiband filter circuit which has a simple configuration and is capable of generating many attenuation poles in the vicinity of a plurality of pass bands so as to improve the steepness. SOLUTION: A first mutual inductance (L31a, L41a), which connects an input port IN and the input side of a first band pass filter circuit BPF1a and further connects an output port OUT and the output side of the first band pass filter circuit BPF1a, applies an interlacing magnetic coupling between the input and the output of the first band pass filter circuit BPF1a. A second mutual inductance (L32a, L42a), which connects the input side of the first band pass filter circuit BPF1a and the input side of a second band pass filter circuit BPF2a the center frequency of which is higher than that of the first band pass filter circuit BPF1a and further connects the output side of the first band pass filter circuit BPF1a and the output side of the second band pass filter circuit BPF2a, applies an interlacing magnetic coupling between the input and the output of the second band pass filter circuit BPF2a. COPYRIGHT: (C)2005,JPO&NCIPI
摘要:
PROBLEM TO BE SOLVED: To manufacture a semiconductor module while ensuring to ground an outer package shield and suppressing loads applied to a dicing blade and the outer package shield.SOLUTION: A semiconductor module A includes: a module substrate 1; multiple electronic components 2 mounted on an upper surface of the module substrate 1; a sealing resin layer 3 sealing an upper surface of the module substrate 1 including these electronic components 2; an outer package shield 4 covering an upper surface of the sealing resin layer 3; and a connection part 5 integrally formed with the outer package shield 4.
摘要:
PROBLEM TO BE SOLVED: To provide a high productivity semiconductor module which ensures to connect an exterior shield to ground, prevents short circuits between the exterior shield and signal wiring, and achieves the reduction of the size and the thickness.SOLUTION: A semiconductor module A includes a substrate 1 where an electronic component 2 is mounted on an upper surface, an insulative sealing resin layer 3 sealing the upper surface, a conductive exterior shield 4 covering a surface of the sealing resin layer 3 that is located on the opposite side of the substrate 1, and a connection part 5 which is disposed in the sealing resin layer 3 and electrically connects the exterior shield 4 with a ground terminal 13 included in the substrate 1.
摘要:
PROBLEM TO BE SOLVED: To provide a filter device whose attenuation performance is improved by adding an attenuation pole to a filter component and which can adjust the position of the attenuation pole while minimizing the size of the entire circuit in that case. SOLUTION: In the filter device provided with a filter component being a three-terminal filter, or the like having respective terminals of an input terminal, an output terminal and a ground terminal, and ground connected to the ground terminal, the ground terminal and the ground are connected to each other through a circuit in which an inductance element having prescribed inductance and a capacitance element having prescribed capacitance are mutually connected in parallel. COPYRIGHT: (C)2009,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide a power combiner and a power amplifier capable of processing signals of a plurality of frequency bands largely apart from each other and to provide a multi-band high frequency communication apparatus provided with the power amplifier so as to decrease the number of components. SOLUTION: In the power combiner 106, a switch SW is provided between a connection node P3 of high frequency lines T101, T102 and a connection node P4 of high frequency transmission lines T103, T104 and turned ON/OFF depending on a frequency of an input signal thereby making the impedance values of the high frequency transmission lines T101 to T104 different from a plurality of the frequency bands. COPYRIGHT: (C)2006,JPO&NCIPI