公开(公告)号：JP2011096865A

公开(公告)日：2011-05-12

申请号：JP2009249689

申请日：2009-10-30

申请人： Sharp Corp ,  シャープ株式会社

发明人： KUSHINO MASAHIKO ,  MURAKAMI MASAHIRO ,  TOKUNO SHINICHI

IPC分类号： H05K3/28 ,  H01L21/56 ,  H01L23/12 ,  H01L23/28 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00

CPC分类号： H01L21/565 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/97 ,  H01L2224/83385 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/19041 ,  Y10T428/239 ,  Y10T428/24479 ,  Y10T428/24612

摘要： PROBLEM TO BE SOLVED: To provide a substrate member capable of suppressing filling resin leakage in a gap between the substrate member and the electronic component, as much as possible. SOLUTION: Disclosed is the substrate member which is a manufacturing component of a module including electronic components mounted on the substrate and sealed with resin. The substrate member is substantially a plate-like shape and is used as the substrate later. A manufacturing process of the modules has: a mounting step of mounting the electronic components on a component side of the substrate member; and a sealing step of supplying and flowing the resin on the component side so that the mounted electronic components may be sealed with the resin. The mounting step has mounting a first electronic component having substantially a flat mounting surface in a first mounting region specified on the component side so that a gap may be formed between the mounting surface and the component side. The component side is provided with a first groove for boosting the resin which the gap is filled with, in the sealing step. COPYRIGHT: (C)2011,JPO&INPIT

摘要翻译： 要解决的问题：提供一种能够尽可能地抑制基板部件和电子部件之间的间隙中的填充树脂泄漏的基板部件。 解决方案：公开了作为包括安装在基板上并用树脂密封的电子部件的模块的制造部件的基板部件。 基板部件基本上为板状，稍后用作基板。 模块的制造过程具有：将电子部件安装在基板部件的部件侧的安装步骤; 以及在组件侧供给和流动树脂以使得安装的电子部件可以用树脂密封的密封步骤。 安装步骤在第一安装区域上安装具有基本上平坦的安装表面的第一电子部件，以在组件侧指定的第一安装区域中，从而可以在安装表面和部件侧之间形成间隙。 在密封步骤中，部件侧设置有用于增强填充有间隙的树脂的第一凹槽。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010219367A

公开(公告)日：2010-09-30

申请号：JP2009065545

申请日：2009-03-18

申请人： Sharp Corp ,  シャープ株式会社

发明人： TOKUNO SHINICHI

IPC分类号： H05K3/46 ,  H01L23/12 ,  H05K3/00

CPC分类号： H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00014

摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing an organic printed substrate capable of fabricating a cavity with high accuracy, and improving production yield and production efficiency. SOLUTION: The method for manufacturing an organic printed substrate 50 comprises a laminating step for laminating prepregs 123a on a core base 21, and a cavity forming step for forming a recessed cavity 10 by removing a predetermined part of the prepreg 123a. The laminating step comprises a step for arranging a heat-resistant film 110 between the core base 21 and the prepreg 123a, and the cavity forming step comprises a step for forming a side wall part 11 of the cavity 10 on the prepreg 123a by cutting a part corresponding to the heat-resistant film 110 on the prepreg 123a by using laser, and a step for forming a bottom part 12 of the cavity 10 on a part where the heat-resistant film 110 on the core base 21 was present. COPYRIGHT: (C)2010,JPO&INPIT

摘要翻译： 解决的问题：提供一种能够高精度地制造空腔的有机印刷基板的制造方法，提高生产率和生产效率。 解决方案：有机印刷基板50的制造方法包括将预浸料坯123a层叠在芯基体21上的层叠工序，以及通过除去预定部分预浸料123a来形成凹腔10的空腔形成工序。 层压步骤包括在芯基体21和预浸料坯123a之间布置耐热膜110的步骤，并且腔形成步骤包括通过切割预成型体123a在预浸料坯123a上形成空腔10的侧壁部11的步骤 通过使用激光对应于预浸料坯123a上的耐热膜110的部分，以及在存在核心基材21上的耐热膜110的部分上形成空腔10的底部12的工序。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2005025850A

公开(公告)日：2005-01-27

申请号：JP2003189637

申请日：2003-07-01

申请人： Sharp Corp ,  シャープ株式会社

发明人： TOKUNO SHINICHI

IPC分类号： G11B7/125 ,  G02B27/10 ,  G02B27/14 ,  G11B7/00 ,  G11B7/135 ,  H01S5/022

CPC分类号： G11B7/1263 ,  G11B2007/0006

摘要： PROBLEM TO BE SOLVED: To provide an optical pickup device which can realize a read-out/write-in performance of high quality. SOLUTION: The optical pickup device is provided with a first light source 1, a second light source 2, a beam splitter 6 provided with a wavelength selecting film 5, a front monitor PD7, a collimate lens 8, a rise mirror 9, a reflection mirror D10, a reflection mirror C11, and an objective lens. The wavelength selecting film 5 reflects the light beam from the first light source almost 100%, while the film transmits the light beam from the second light source almost 100%. In the laser beam from the first light source, unnecessary light which is not used for write-in for the optical disk and reproduction (read-out) of signals is reflected by the reflection mirror D10 and made incident on the front monitor PD7. In the laser beam from the second light source, the unnecessary light is reflected by the reflection mirror C11 arranged at the same position as a coupling lens 12 and made incident on the front monitor PD7. COPYRIGHT: (C)2005,JPO&NCIPI

摘要翻译： 要解决的问题：提供一种能够实现高质量的读出/写入性能的光学拾取装置。 解决方案：光学拾取装置设置有第一光源1，第二光源2，设置有波长选择膜5的分束器6，前监视器PD7，准直透镜8，上升反射镜9 反射镜D10，反射镜C11和物镜。 波长选择膜5将来自第一光源的光束几乎100％反射，而膜将来自第二光源的光束几乎100％。 在来自第一光源的激光束中，不用于光盘的写入和再现（读出）信号的不必要的光被反射镜D10反射并入射在前监视器PD7上。 在来自第二光源的激光束中，不必要的光被布置在与耦合透镜12相同位置的反射镜C11反射并入射在前监视器PD7上。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2013222877A

公开(公告)日：2013-10-28

申请号：JP2012094473

申请日：2012-04-18

申请人： Sharp Corp ,  シャープ株式会社

发明人： MURAKAMI MASAHIRO ,  TOKUNO SHINICHI

IPC分类号： H01L23/29 ,  H01L23/31

摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module which avoids deformation of a substrate due to resin sealing during the manufacturing of the semiconductor module and peeling etc. of electronic components due to the deformation.SOLUTION: A dummy pattern 11 is formed at an entire or a part of a dicing line used when dividing and cutting an aggregate substrate 101 on a rear surface of the aggregate substrate 101. Alternatively, a solder resist for reducing irregularities on the rear surface of the aggregate substrate 101 is formed. This structure prevents deformation of the aggregate substrate 101 during resin molding, also prevents bump peeling of an IC and deformation of mounting components, and reduces the residual stress of the aggregate substrate 101.

摘要翻译： 要解决的问题：提供一种半导体模块，其在半导体模块的制造期间由于树脂密封而导致的基板的变形以及由于变形而导致的电子部件的剥离等。解决方案：虚设图案11形成为整体 或者在将集合基板101的背面分割和切割集合基板101时使用的切割线的一部分。或者，形成用于减小集合基板101的背面的凹凸的阻焊剂。 由此，能够防止树脂成形时的集合基板101的变形，并且防止IC的凸起剥离和安装部件的变形，并且降低集合基板101的残留应力。

公开(公告)号：JP2013058513A

公开(公告)日：2013-03-28

申请号：JP2011194540

申请日：2011-09-07

申请人： Sharp Corp ,  シャープ株式会社

发明人： TOKUNO SHINICHI

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L23/02 ,  H01L23/28 ,  H05K3/28 ,  H05K9/00

CPC分类号： H01L24/97 ,  H01L2224/16225 ,  H01L2924/19105

摘要： PROBLEM TO BE SOLVED: To provide a high frequency module capable of suppressing an occurrence of peeling at an interface between a resin layer and a shield layer while a moisture discharge path can be easily confirmed.SOLUTION: The high frequency module 1 includes: a substrate 4 on which an IC 2 and component 3 are mounted; an insulating resin layer 5 sealing the IC 2 and the component 3; and a conductive shield layer 6 provided on a surface of the resin layer 5. In the shield layer 6, an opening 6c reaching the resin layer 5 and having an opening width W1 of 1 μm or more is formed.

摘要翻译： 要解决的问题：提供一种能够抑制在树脂层和屏蔽层之间的界面处的剥离发生的高频模块，同时可以容易地确认湿气排放路径。 解决方案：高频模块1包括：基板4，其上安装有IC 2和部件3; 密封IC2和部件3的绝缘树脂层5; 以及设置在树脂层5的表面上的导电性屏蔽层6.在屏蔽层6中，形成到达树脂层5的开口宽度W1为1μm以上的开口6c。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2004220665A

公开(公告)日：2004-08-05

申请号：JP2003004915

申请日：2003-01-10

申请人： Sharp Corp ,  シャープ株式会社

发明人： TOKUNO SHINICHI

IPC分类号： G02B7/00 ,  G11B7/08 ,  G11B7/125 ,  G11B7/135

摘要： PROBLEM TO BE SOLVED: To provide an optical pickup device capable of surely guiding a light emitted from a light source to an optical recording medium, and surely detecting the light from the light source. SOLUTION: The optical pickup device reads at least information recorded in an optical disk by irradiating the optical disk with a laser light from a laser light source. A first surface 25a is formed to be planar, and a second surface 25b is formed to be projected spherical. The first surface 25a has the nature of reflecting an incident laser light. The device is provided with a rising mirror 25 for reflecting the laser light from the laser light source in the direction of intersecting the optical axis L10 of the laser light and guiding the laser light to an objective lens 26, and a support section 28 having a support surface 28a formed on a curved surface corresponding to the second surface 25b of the rising mirror 25 and supporting the rising mirror 25 to be angularly displaced. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2004118974A

公开(公告)日：2004-04-15

申请号：JP2002283756

申请日：2002-09-27

申请人： Sharp Corp ,  シャープ株式会社

发明人： NAKAMURA MASAHIRO ,  TOKUNO SHINICHI

IPC分类号： G11B7/0045 ,  G11B7/005 ,  G11B7/125 ,  G11B7/135

摘要： PROBLEM TO BE SOLVED: To provide a front monitoring optical pickup device which can adjust the amount of light received by an optical output monitor with a simplified configuration and is excellent in stability for optical output control. SOLUTION: A part of the light irradiating an optical recording medium from a light source is reflected at a light reflection surface 32 for a reflection mirror 24 and reflected light is received by an optical detection means for the optical monitor. The amount of the light received by the optical detection means for the monitor is adjusted by adjusting a reflection angle of the light reflection surface 32 with an adjustment means 27. The adjustment means is a part of housing and constituted with a through-bore 34 formed on the part corresponding to a surface 33 adjacent to the light reflection surface and an adjustment material 35 which is inserted into the through-bore being free to travel back and forth with its edge part 35a contacting an adjacent surface 33. Because the amount of the light received by the optical detection means for the monitor is appropriately adjusted by the adjustment means, the optical output controlled responding to the detection output for the optical detection means for the monitor is enhanced in its stability. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2011035058A

公开(公告)日：2011-02-17

申请号：JP2009177977

申请日：2009-07-30

申请人： Sharp Corp ,  シャープ株式会社

发明人： TOKUNO SHINICHI ,  YAMAMOTO SEIICHI ,  KUSHINO MASAHIKO ,  MURAKAMI MASAHIRO

IPC分类号： H01L23/00 ,  H01L23/12 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L24/97 ,  H01L2924/14 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025

摘要： PROBLEM TO BE SOLVED: To provide a high frequency module that is miniaturized and lowered in a height. SOLUTION: The high frequency module 100 includes a module substrate 10 in which external connection terminals 11 including ground terminals 12 are formed on the lower surface thereof, a plurality of electronic components 20 mounted on the upper surface of the module substrate 10, a sealing member 30 constituted of an insulating resin and formed on the upper surface of the module substrate 10 so as to seal the electronic components 20, and a shield case 40 disposed above the electronic components 20. The shield case 40 includes a top plate 41 and suspension parts 43 extending downward from the top plate 41, and the distal end parts of the suspension parts 43 are positioned in the vicinity of the ground terminals 12. COPYRIGHT: (C)2011,JPO&INPIT

摘要翻译： 要解决的问题：提供在高度上小型化和降低的高频模块。 解决方案：高频模块100包括模块基板10，其中在其下表面上形成有包括接地端子12的外部连接端子11，安装在模块基板10的上表面上的多个电子部件20， 由绝缘树脂构成的密封构件30，形成在模块基板10的上表面上以密封电子部件20;以及屏蔽壳40，其设置在电子部件20的上方。屏蔽壳40包括顶板41 和从顶板41向下延伸的悬挂部43，悬挂部43的前端部位于接地端子12的附近。版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2012256842A

公开(公告)日：2012-12-27

申请号：JP2012029803

申请日：2012-02-14

申请人： Sharp Corp ,  シャープ株式会社

发明人： SAKAI TAKAE ,  MURAKAMI MASAHIRO ,  KUSHINO MASAHIKO ,  AMANO YOSHIHISA ,  TOKUNO SHINICHI

IPC分类号： H01L23/28 ,  H01L23/00 ,  H05K9/00

CPC分类号： H01L23/60 ,  H01L21/563 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01065 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1421 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： PROBLEM TO BE SOLVED: To manufacture a semiconductor module while ensuring to ground an outer package shield and suppressing loads applied to a dicing blade and the outer package shield.SOLUTION: A semiconductor module A includes: a module substrate 1; multiple electronic components 2 mounted on an upper surface of the module substrate 1; a sealing resin layer 3 sealing an upper surface of the module substrate 1 including these electronic components 2; an outer package shield 4 covering an upper surface of the sealing resin layer 3; and a connection part 5 integrally formed with the outer package shield 4.

摘要翻译： 要解决的问题：制造半导体模块同时确保对外部封装屏蔽进行研磨并且抑制施加到切割刀片和外部封装屏蔽层的负载。 解决方案：半导体模块A包括：模块基板1; 安装在模块基板1的上表面上的多个电子部件2; 密封树脂层3，密封包括这些电子部件2的模块基板1的上表面; 覆盖密封树脂层3的上表面的外包装屏蔽件4; 以及与外包装罩4一体形成的连接部5.版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2012151353A

公开(公告)日：2012-08-09

申请号：JP2011009957

申请日：2011-01-20

申请人： Sharp Corp ,  シャープ株式会社

发明人： KUSHINO MASAHIKO ,  MURAKAMI MASAHIRO ,  AMANO YOSHIHISA ,  TOKUNO SHINICHI

IPC分类号： H01L23/29 ,  H01L23/31 ,  H01L25/00

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01005 ,  H01L2924/01033

摘要： PROBLEM TO BE SOLVED: To provide a high productivity semiconductor module which ensures to connect an exterior shield to ground, prevents short circuits between the exterior shield and signal wiring, and achieves the reduction of the size and the thickness.SOLUTION: A semiconductor module A includes a substrate 1 where an electronic component 2 is mounted on an upper surface, an insulative sealing resin layer 3 sealing the upper surface, a conductive exterior shield 4 covering a surface of the sealing resin layer 3 that is located on the opposite side of the substrate 1, and a connection part 5 which is disposed in the sealing resin layer 3 and electrically connects the exterior shield 4 with a ground terminal 13 included in the substrate 1.

摘要翻译： 要解决的问题：为了提供高效率的半导体模块，其确保将外部屏蔽连接到地，防止外部屏蔽和信号布线之间的短路，并且实现尺寸和厚度的减小。 解决方案：半导体模块A包括：电子部件2安装在上表面的基板1，密封上表面的绝缘密封树脂层3，覆盖密封树脂层3的表面的导电性外屏蔽件4 位于基板1的相反侧，连接部5设置在密封树脂层3中，并且将外部屏蔽4与包含在基板1中的接地端子13电连接。版权所有 C）2012，JPO＆INPIT