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1.发明专利
公开(公告)号：JP2013138092A
公开(公告)日：2013-07-11
申请号：JP2011287990
申请日：2011-12-28
Inventor： TAJIMA MORIKAZU , TAKAGI MIKIO , KAWABATA KENICHI , TAKIZAWA SHUICHI
CPC classification number: H01L23/3135 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/181 , H01L2224/81 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide an electronic circuit module component which reduces cracks of a resin having a cavity and contacting with at least a part of an electronic component, and to provide a manufacturing method of the electronic circuit module component.SOLUTION: An electronic circuit module component 1 includes: an electronic component 2; a substrate 3; a first resin 4; and a second resin 9. The electronic component 2 is mounted on the substrate 3. The first resin 4 has a cavity 4H and contacts with at least a part of the electronic component 2. The second resin 9 covers a surface of the first resin 4 and has a void ratio lower than that of the first resin 4. The first resin 4 includes: a stress relaxation layer 42 provided at the second resin 9 side and containing a resin component 9M of the second resin 9; and a porous layer 41 that does not contain the resin component 9M of the second resin 9.
Abstract translation: 要解决的问题：提供一种电子电路模块组件，其减少具有空腔并与至少一部分电子部件接触的树脂的裂纹，并提供电子电路模块部件的制造方法。解决方案：电子 电路模块部件1包括：电子部件2; 基板3; 第一树脂4; 和第二树脂9.电子部件2安装在基板3上。第一树脂4具有空腔4H并与电子部件2的至少一部分接触。第二树脂9覆盖第一树脂4的表面 并且具有比第一树脂4低的空隙率。第一树脂4包括：设置在第二树脂9侧并包含第二树脂9的树脂组分9M的应力松弛层42; 以及不含第二树脂9的树脂成分9M的多孔层41。
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公开(公告)号：JP2013131552A
公开(公告)日：2013-07-04
申请号：JP2011278638
申请日：2011-12-20
Inventor： ASAMI SHIGERU , TAJIMA MORIKAZU , KAWABATA KENICHI
CPC classification number: H01L24/97
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic circuit module component for suppressing resin flow in which the need for a mold according to the shape of an aggregate substrate is eliminated.SOLUTION: The manufacturing method of an electronic circuit module component includes: a wall member arranging step for preparing an aggregate substrate including an electronic circuit module region which includes a plurality of electronic components, and a peripheral region on the outline of the electronic circuit module region, and arranging a resin flow suppression wall member of an elastic body on the surface of the peripheral region of the electronic circuit module region of the aggregate substrate; a resin mounting step for mounting an insulation resin in the electronic circuit module region; and a press step for applying a molding press to the aggregate substrate, the insulation resin and the resin flow suppression wall member.
Abstract translation: 要解决的问题：提供一种用于抑制树脂流动的电子电路模块部件的制造方法，其中消除了根据集合基板的形状的模具的需要。解决方案：电子电路模块部件的制造方法包括 ：用于制备包含多个电子部件的电子电路模块区域的集合基板的壁构件配置工序，以及电子电路模块区域的轮廓的周边区域，配置弹性体的树脂流动抑制壁构件 在集合基板的电子电路模块区域的外围区域的表面上的主体; 树脂安装步骤，用于将绝缘树脂安装在电子电路模块区域中; 以及将模压机施加到聚集基体，绝缘树脂和树脂流动抑制壁构件的压制步骤。
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3.发明专利
公开(公告)号：JP2009289802A
公开(公告)日：2009-12-10
申请号：JP2008137947
申请日：2008-05-27
Inventor： FURUKAWA HIROTADA , KOBAYASHI TOYOTAKA , KAWABATA KENICHI , TAJIMA MORIKAZU , HATTORI YASUYUKI , YAMASHITA YOSHINARI
CPC classification number: H01L24/73 , H01L2224/04105 , H01L2224/19 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , H01L2924/1531 , H01L2924/19106 , H01L2224/32145 , H01L2924/00012 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a module with a built-in electronic part for forming a via hole conductor in a narrow pitch even when the module includes a built-in electronic part having a relative large height. SOLUTION: This module includes: an insulating layer 120 in which electronic parts 131, 132 and an intermediary substrate 140 are embedded and a via hole conductor 182 electrically connected to the intermediary substrate 140 is formed; a wiring layer 161 formed in one side from the insulating layer 120 and electrically-connected to at least electronic parts 131, 132; and a wiring layer 163 formed in another side from the insulating layer 120, wherein the electronic part 131 and the wiring layer 163 are electrically connected via the intermediary substrate 140 and the via hole conductor 182. Since the wiring layers 161, 163 are connected via the intermediary substrate 140, the depth of the via hole conductor 182 is reduced. Thus, the opening diameter of the via hole is reduced. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：为了提供具有内置电子部件的模块，用于以窄的间距形成通孔导体，即使该模块包括具有相对较大高度的内置电子部件。 解决方案：该模块包括：绝缘层120，其中嵌入有电子部件131,132和中间基板140，并且形成电连接到中间基板140的通孔导体182; 在绝缘层120的一侧形成并电连接至电子部件131,132的布线层161; 以及从绝缘层120的另一侧形成的布线层163，其中电子部件131和布线层163经由中间基板140和通孔导体182电连接。由于布线层161,163经由 中间基板140，通孔导体182的深度减小。 因此，通孔的开口直径减小。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2012160572A
公开(公告)日：2012-08-23
申请号：JP2011019190
申请日：2011-01-31
Inventor： TAKIZAWA SHUICHI , TAJIMA MORIKAZU , ASAMI SHIGERU , HARA HIROKI , KOMATSU MASATORA , TAKAGI MIKIO , MUROI MASAYUKI , KAWABATA KENICHI
CPC classification number: H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2224/81
Abstract: PROBLEM TO BE SOLVED: To reduce defects occurring at an electronic circuit module component in the reflow process when the electronic circuit module component, in which a surface of an insulation resin is covered by a shield layer, is mounted on an electronic apparatus.SOLUTION: An electronic circuit module component 1 includes: electronic components 2; a substrate 3 on which the electronic components 2 are mounted; a first resin 4 having a gap and contacting with at least a part of the electronic component 2; a second resin 9 covering the first resin 4 and having a lower void ratio than the first resin 4; a metal layer 5 covering at least the second resin 9 and electrically connecting with a ground 8 of the substrate 3; an opening 5H provided on the metal layer 5 and exposing at least a part of the first resin 4 to the exterior of the metal layer 5; and a sealing part 10 in which the second resin 9 is disposed between the first resin 4 contacting with a side surface 2S of the electronic component 2 and the metal layer 5 provided at a position facing the side surface 2S of the electronic component 2.
Abstract translation: 要解决的问题：为了减少在电绝缘树脂的表面被屏蔽层覆盖的电子电路模块部件安装在电子设备上的回流工艺中在电子电路模块部件处发生的缺陷 。 电子电路模块部件1包括：电子部件2; 安装有电子部件2的基板3; 具有间隙并与电子部件2的至少一部分接触的第一树脂4; 覆盖第一树脂4并且具有比第一树脂4低的空隙率的第二树脂9; 覆盖至少第二树脂9并与基板3的接地8电连接的金属层5; 设置在金属层5上的开口5H，并将至少一部分第一树脂4暴露于金属层5的外部; 以及密封部10，其中第二树脂9设置在与电子部件2的侧面2S接触的第一树脂4和设置在面向电子部件2的侧面2S的位置的金属层5之间。 P>版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP2012074607A
公开(公告)日：2012-04-12
申请号：JP2010219462
申请日：2010-09-29
Inventor： TAJIMA MORIKAZU , HARA HIROKI , ASAMI SHIGERU , KAMEDA MASUMI , TAKIZAWA SHUICHI , KAWABATA KENICHI
CPC classification number: H01L24/97 , H01L23/552 , H01L2224/16225 , H01L2224/97 , H01L2924/14 , H01L2924/15159 , H01L2924/15313 , H01L2924/181 , H01L2924/19105 , H01L2224/81 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To facilitate the ventilation of gas such as moisture vapor occurred in the interior of an electronic circuit module component, in which a surface of a sealing resin is covered with a layer having conductivity, to the exterior by heating the electronic circuit module component.SOLUTION: An electronic circuit module component 1 includes electronic components 2, a substrate 3 which the electronic components 2 are mounted by solder 6, a sealing resin 4 covering the electronic components 2 and the substrate 3, and a porous conductive layer 5 which is a conductive material having multiple cavities, covers at least part of the sealing resin 4, and electrically connects with a ground 8 of the substrate 3.
Abstract translation: 要解决的问题：为了促进在密封树脂的表面被导电层覆盖的电子电路模块部件的内部发生气体例如湿气的通风，通过加热到外部 电子电路模块组件。 解决方案：电子电路模块组件1包括电子部件2，电子部件2通过焊料6安装的基板3，覆盖电子部件2和基板3的密封树脂4和多孔导电层5 其是具有多个空腔的导电材料，覆盖至少部分密封树脂4，并且与衬底3的接地8电连接。版权所有（C）2012，JPO和INPIT
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Patent Agency Ranking6.发明专利
公开(公告)号：JP2011216849A
公开(公告)日：2011-10-27
申请号：JP2010280900
申请日：2010-12-16
Inventor： ASAMI SHIGERU , TAJIMA MORIKAZU , HARA HIROKI , TAKIZAWA SHUICHI , KAMEDA SHINSEI , KAWABATA KENICHI
CPC classification number: H01L23/3135 , H01L23/295 , H01L23/3128 , H01L23/552 , H01L23/564 , H01L24/97 , H01L25/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/14 , H01L2924/181 , Y10T29/49117 , Y10T428/249981 , H01L2224/81 , H01L2924/00 , H01L2224/0401
Abstract: PROBLEM TO BE SOLVED: To allow gas such as steam generated in an electronic circuit module component by heating to easily escape to the outside, in a reflow process in mounting an electronic circuit module component in an electronic apparatus.SOLUTION: The electronic circuit module component 1 includes an electronic component 2, a substrate 3, a first resin 4, a second resin 9, a metal layer 5, and an opening 5H. The electronic component 2 is mounted on the substrate 3. The first resin 4 has pores and is in contact with at least a part of the electronic component 2. The second resin 9 covers a surface of the first resin 4 and has porosity lower than that of the first resin 4. The metal layer 5 covers the first resin 4 and the second resin 9 and is electrically connected to a ground 8 of the substrate 3. The opening 5H is formed in the metal layer 5 and allows a part of the first resin 4 to be exposed at least to the outside of the metal layer 5.
Abstract translation: 要解决的问题：为了允许通过加热在电子电路模块部件中产生的气体容易地逸出到外部，在将电子电路模块部件安装在电子设备中的回流过程中。解决方案：电子电路模块部件 图1包括电子部件2，基板3，第一树脂4，第二树脂9，金属层5和开口5H。 电子部件2安装在基板3上。第一树脂4具有孔并与电子部件2的至少一部分接触。第二树脂9覆盖第一树脂4的表面，并且具有低于 的第一树脂4.金属层5覆盖第一树脂4和第二树脂9，并且电连接到基板3的接地部8.开口5H形成在金属层5中，并且允许第一树脂4的一部分 树脂4至少暴露于金属层5的外部。
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公开(公告)号：JP2011210849A
公开(公告)日：2011-10-20
申请号：JP2010075525
申请日：2010-03-29
Inventor： TAKIZAWA SHUICHI , TAJIMA MORIKAZU , ASAMI SHIGERU , HARA HIROKI , KAWABATA KENICHI
Abstract: PROBLEM TO BE SOLVED: To provide a means of suppressing deformation of electronic circuit module components caused by reflow.SOLUTION: An electronic circuit module component 10 has a substrate 11, an electronic component provided to the substrate 11, a sealing resin member 16 covering the electronic component, and a second plate-like member 17 that sandwiches the sealing resin member 16 with the substrate 11. The substrate 11 is formed by laminating a core material 12 and a prepreg 13 respectively containing a first glass cloth and a resin material. The second plate-like member 17 contains a second glass cloth and a resin material. Here, a vector obtained by combining each vector of a warp fiber contained in a plurality of first glass cloths included in the substrate 11 is defined as a resultant vector. In addition, a vector of the warp fiber contained in the second glass cloth is defined as a second plate-like member vector V7. In an electronic circuit module component 10, an angle formed by the resultant vector and the second plate-like member vector V7 in an XY plane becomes 0° or greater and less than 90°.
Abstract translation: 要解决的问题：提供一种抑制由回流引起的电子电路模块部件的变形的方法。解决方案：电子电路模块部件10具有基板11，设置在基板11上的电子部件，覆盖该基板11的密封树脂部件16 电子部件和将密封树脂部件16与基板11夹持的第二板状部件17.基板11通过层叠芯材12和分别包含第一玻璃布和树脂材料的预浸料13而形成。 第二板状构件17包含第二玻璃布和树脂材料。 这里，将包含在基板11中的多个第一玻璃布中的经纤维的每个矢量组合得到的矢量定义为合成矢量。 此外，包含在第二玻璃布中的经线的矢量被定义为第二板状构件矢量V7。 在电子电路模块部件10中，在XY平面中由合成矢量和第二板状部件矢量V7形成的角度为0°以上且小于90°。
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公开(公告)号：JP2005175098A
公开(公告)日：2005-06-30
申请号：JP2003411139
申请日：2003-12-10
Inventor： TAJIMA MORIKAZU , DOMON TAKAAKI
IPC: H01L23/02
Abstract: PROBLEM TO BE SOLVED: To prevent sparks from being generated when a container is connected to a lid by seam welding.
SOLUTION: A package 1 for housing an electronic part includes the container 10 for housing the electronic part, and the lid 20 connected to the upper surface 10b of the container 10 and made of a metal for blocking an opening 10a. The container 10 has a container body 11 and a metal layer 12. The lid 20 has a lid body 21 and a brazing material layer 22. The lid 20 is connected to the upper surface 10b of the container 10 by seam welding. The package 1 further includes an insulating part 40 formed on the upper surface 10b of the container 10 at the position outside of the outer periphery of the lid 20. The insulating part 40 is interposed between the electrode 30 of a seam welder and the metal layer 12, and holds an interval between the electrode 30 and the metal layer 12 more than a constant value.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：为了防止通过缝焊将容器连接到盖子时产生火花。 解决方案：用于容纳电子部件的包装1包括用于容纳电子部件的容器10和连接到容器10的上表面10b并由用于阻挡开口10a的金属制成的盖20。 容器10具有容器主体11和金属层12.盖20具有盖体21和钎料层22.盖20通过缝焊连接到容器10的上表面10b。 包装1还包括在盖子20的外周边的位置处形成在容器10的上表面10b上的绝缘部分40.绝缘部分40插入到缝焊机的电极30和金属层 并且保持电极30和金属层12之间的间隔超过恒定值。 版权所有（C）2005，JPO＆NCIPI
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9.发明专利
公开(公告)号：JP2011171436A
公开(公告)日：2011-09-01
申请号：JP2010032521
申请日：2010-02-17
Inventor： AZUMA YUKIHIRO , TAJIMA MORIKAZU , ASAMI SHIGERU , HARA HIROKI , TAKIZAWA SHUICHI , KAWABATA KENICHI
CPC classification number: H05K3/284 , H01L23/3135 , H01L23/552 , H01L2224/16225 , H01L2924/19105 , H01L2924/3025 , H05K1/0209 , H05K3/3431 , H05K2201/0116 , H05K2201/0715 , H05K2201/09872 , Y10T29/49144
Abstract: PROBLEM TO BE SOLVED: To prevent movement and scattering of solder, which occur due to melting of the solder in an electronic component built-in module, by heating when the electronic component built-in module is mounted. SOLUTION: The electronic component built-in module 1 includes the electronic component 2, a substrate 3 on which the electronic component 2 is mounted, a first resin 10 covering the electronic component 2 and the substrate 3 and a second resin 4 covering a surface of the first resin 10. The first resin 10 is constituted of resin having a gap. The first resin 10 is constituted in such a way that an area on which the electronic component 2 is not mounted becomes thicker than an area on which the electronic component 2 is mounted on a surface of the substrate 3. Porosity of the second resin 4 is lower than that of the first resin 10. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：为了防止由于电子部件内置模块中的焊料的熔化而发生的焊料的移动和散射，通过在安装电子部件内置模块时的加热。 电子部件内置模块1包括电子部件2，安装有电子部件2的基板3，覆盖电子部件2和基板3的第一树脂10和覆盖电子部件2的第二树脂4 第一树脂10的表面。第一树脂10由具有间隙的树脂构成。 第一树脂10被构造成使得未安装电子部件2的区域比在基板3的表面上安装有电子部件2的区域更厚。第二树脂4的孔隙率为 低于第一树脂10。版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JP2011155223A
公开(公告)日：2011-08-11
申请号：JP2010017265
申请日：2010-01-28
Inventor： HARA HIROKI , TAJIMA MORIKAZU , ASAMI SHIGERU , AZUMA YUKIHIRO , TAKIZAWA SHUICHI , KAWABATA KENICHI
CPC classification number: H01L2924/19105 , H01L2924/3025
Abstract: PROBLEM TO BE SOLVED: To provide a circuit module in which the surface of insulating resin thereof is covered with a shielding layer, moisture infiltrating the insulating resin can be readily drained, and variations in the characteristics of circuit components or a circuit that use the component are suppressed. SOLUTION: The circuit module 1 includes a substrate 3 mounted with a circuit component 2, an insulating resin 4 for covering the circuit component 2, and a shielding layer 5 for covering the surface of the insulating resin 4. In the shielding layer 5, an opening portion H, exposing at least the insulating resin 4, is provided at a portion where the thickness of the insulating resin 4 is ≤200 μm, on an non-substrate mounting side of a circuit component (e.g., coil 2F) having an inductance component or a capacitance component, in the circuit component 2 mounted on the substrate 3. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：为了提供其绝缘树脂的表面被屏蔽层覆盖的电路模块，渗透绝缘树脂的水分可以容易地排出，并且电路部件或电路的特性的变化 使用组件被抑制。 解决方案：电路模块1包括安装有电路部件2的基板3，用于覆盖电路部件2的绝缘树脂4和用于覆盖绝缘树脂4的表面的屏蔽层5.在屏蔽层 如图5所示，在电路部件（例如，线圈2F）的非基板安装侧的绝缘树脂4的厚度≤200μm的部分设置有至少露出绝缘树脂4的开口部H， 具有安装在基板3上的电路部件2中的电感分量或电容分量。（C）2011，JPO＆INPIT
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