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公开(公告)号：JP2008198940A
公开(公告)日：2008-08-28
申请号：JP2007035280
申请日：2007-02-15
申请人： Fujitsu Ltd , 富士通株式会社
发明人： NISHIMURA TAKAO , NARISAWA YOSHIAKI
CPC分类号： H05K3/305 , H01L21/561 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/743 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/91 , H01L24/97 , H01L25/0655 , H01L25/50 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/2731 , H01L2224/27901 , H01L2224/29014 , H01L2224/29015 , H01L2224/29019 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/29291 , H01L2224/29339 , H01L2224/29355 , H01L2224/3003 , H01L2224/30051 , H01L2224/30131 , H01L2224/30141 , H01L2224/30177 , H01L2224/32055 , H01L2224/32056 , H01L2224/32057 , H01L2224/32225 , H01L2224/3303 , H01L2224/33051 , H01L2224/3313 , H01L2224/3314 , H01L2224/33177 , H01L2224/73204 , H01L2224/75251 , H01L2224/75743 , H01L2224/75841 , H01L2224/81444 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/15311 , H01L2924/15787 , H01L2924/1579 , H05K2201/10674 , H05K2201/10977 , H05K2203/0126 , H05K2203/0545 , Y02P70/613 , H01L2924/07025 , H01L2924/00 , H01L2924/00012 , H01L2924/0695 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a packaging method for electronic components that allows an adhesive to be evenly disposed on a surface of a supporting substrate, such as a wiring substrate, on which electronic components are firmly fixed in response to pneumatic discharged from a semiconductor bonding tool for firmly fixing electronic components on the substrate using the adhesive. SOLUTION: As a method for packaging electronic components onto a supporting substrate 10, the present invention provides an adhesive disposition step for disposing an adhesive 12 to multiple places S1 to S5 on the supporting substrate 10 where electronic components are mounted and an electronic component mounting step for firmly fixing the electronic components by use of a suction tool to the mounting places S1 to 5 in a predetermined order through the adhesive 12. In the above adhesive disposition step, the volume centroid of adhesives 12-2 to 12-5 disposed at mount places S2 to S5 where an electronic component is mounted in the N-th order is made to be inclined in response to a deformed part owing to pneumatic blown off from the suction tool when an electronic component is mounted at the mount place S1 where an electronic component is mounted before the N-1th order. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译： 要解决的问题：提供一种电子部件的包装方法，其允许粘合剂均匀地设置在诸如布线基板的支撑基板的表面上，其中电子部件响应于气动排出而被牢固地固定 从用于使用粘合剂将电子部件牢固地固定在基板上的半导体接合工具。 解决方案：作为将电子部件包装在支撑基板10上的方法，本发明提供一种粘合剂配置步骤，用于将粘合剂12设置在安装有电子部件的支撑基板10上的多个位置S1至S5，并且电子 部件安装步骤，用于通过粘合剂12以预定的顺序通过使用吸引工具将安装位置S1至5牢固地固定到电子部件上。在上述粘合剂配置步骤中，粘合剂12-2至12-5的体积重心 当将电子部件安装在安装位置S1时，设置在安装位置S2至S5处，其中以N阶安装电子部件，以响应于变形部分而被从吸入工具气动吹出而倾斜 其中在N-1次之前安装电子部件。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP5018117B2
公开(公告)日：2012-09-05
申请号：JP2007035280
申请日：2007-02-15
申请人： 富士通セミコンダクター株式会社
CPC分类号： H05K3/305 , H01L21/561 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/743 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/91 , H01L24/97 , H01L25/0655 , H01L25/50 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/2731 , H01L2224/27901 , H01L2224/29014 , H01L2224/29015 , H01L2224/29019 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/29291 , H01L2224/29339 , H01L2224/29355 , H01L2224/3003 , H01L2224/30051 , H01L2224/30131 , H01L2224/30141 , H01L2224/30177 , H01L2224/32055 , H01L2224/32056 , H01L2224/32057 , H01L2224/32225 , H01L2224/3303 , H01L2224/33051 , H01L2224/3313 , H01L2224/3314 , H01L2224/33177 , H01L2224/73204 , H01L2224/75251 , H01L2224/75743 , H01L2224/75841 , H01L2224/81444 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/15311 , H01L2924/15787 , H01L2924/1579 , H05K2201/10674 , H05K2201/10977 , H05K2203/0126 , H05K2203/0545 , Y02P70/613 , H01L2924/07025 , H01L2924/00 , H01L2924/00012 , H01L2924/0695 , H01L2224/0401
摘要： A method for mounting electronic components includes a step of providing an adhesive on each of plural electronic component mounting parts on a wiring board; and a step of fixing one of the electronic components on each of the plural electronic component mounting parts via the adhesive. When the adhesive is provided on each of the plural electronic component mounting parts, the center of gravity of a volume of the adhesive provided on the mounting part where an Nth electronic component is to be mounted is shifted in a direction closer to the mounting part where an (N minus 1 or greater)th electronic component is provided neighboring and adjacent to the mounting part where the Nth electronic component is to be mounted.
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