가접착 방법 및 박형 웨이퍼의 제조 방법
    2.
    发明公开
    가접착 방법 및 박형 웨이퍼의 제조 방법 审中-实审
    薄晶圆的粘附方法和制造方法

    公开(公告)号:KR1020170042237A

    公开(公告)日:2017-04-18

    申请号:KR1020160128313

    申请日:2016-10-05

    摘要: [과제] 가접착및 박리가용이하여, 박형웨이퍼의생산성을높일수 있는가접착방법을제공한다. [해결수단] 웨이퍼를가접착재를개재해서지지체에가접착시키는방법이며, 가접착재로서, 25℃에있어서의저장탄성률 E'가 1 내지 500㎫, 인장파단강도가 5 내지 50㎫인열가소성수지층 (A)와, 25℃에있어서의경화후의 E'가 1 내지 1000㎫, 인장파단강도가 1 내지 50㎫인열경화성중합체층 (B)를갖는복합가접착재층을구비한것을사용하고, 표면에액상조성물 (A')를사용해서층 (A)를형성한웨이퍼와필름형상수지 (B')를라미네이트함으로써층 (B)를형성한지지체를, 또는표면에조성물 (A')를사용해서층 (A)를형성하고, 해당층 (A) 상에수지 (B')를라미네이트함으로써층 (B)를형성한웨이퍼와지지체를감압하에서가열해서접합하는공정과, 층 (B)를열경화시키는공정을포함하는가접착방법.

    摘要翻译: [问题]提供一种接合方法,其中粘附和剥离容易并且可以增加薄晶片的生产率。 [解决问题的手段]为经由其被粘附到所述载体上的晶片粘​​合剂进入的方法,作为粘接剂,1储能弹性模量E”到500㎫,是热塑性树脂层具有的拉伸断裂5强度50㎫在25℃( 一),在1固化E”至25℃1000㎫后,使用具有bokhapga粘合剂层具有1至50㎫热固性聚合物层(到表面的拉伸断裂强度B),并且所述液体组合物 (B)与使用组合物(A')形成层(A)的晶片或层(A)层合, )形成,树脂(B“),以加热在减压下一个晶片和所述支撑体通过层叠接合以形成层(B)包括步骤和固化yeolgyeong层(B步骤),所述层(A)上 粘合方法。

    무용제형 조성물 및 그의 제조방법
    7.
    发明公开
    무용제형 조성물 및 그의 제조방법 有权
    无溶剂组合物及其制备方法

    公开(公告)号:KR1020120093101A

    公开(公告)日:2012-08-22

    申请号:KR1020120014764

    申请日:2012-02-14

    摘要: PURPOSE: A solvent-free type composition is provided to have excellent process efficiency in film manufacturing process, and to provide a film of uniform thickness, a thick film of uniform thickness, and a film with excellent physical properties like heat resistance, etc. CONSTITUTION: A solvent-free type composition comprises (meth)acrylic acid ester-based monomers as a polymerization unit, (meth)acrylic polymer components having a photoreactive group in a side chain or a terminal, and monomer components with high glass transition temperature. The (meth)acrylic polymer component has low glass transition temperature, and is in a state partially polymerized. The solvent-free type composition provides a cured material with glass transition temperature of (-20) °C or higher after curing.

    摘要翻译: 目的:提供无溶剂型组合物以在膜制造工艺中具有优异的工艺效率,并提供均匀厚度的膜,厚度均匀的厚膜以及具有优异物理性质如耐热性等的膜。构成 :无溶剂型组合物包含作为聚合单元的(甲基)丙烯酸酯系单体,在侧链或末端具有光反应性基团的(甲基)丙烯酸系聚合物成分和玻璃化转变温度高的单体成分。 (甲基)丙烯酸系聚合物成分的玻璃化转变温度低,处于部分聚合状态。 无溶剂型组合物在固化后提供玻璃化转变温度为(-20)℃以上的固化物。

    차체 하부 섀시의 도장면 보호용 테이프
    9.
    发明公开
    차체 하부 섀시의 도장면 보호용 테이프 失效
    用于保护底部底盘涂层表面的胶带

    公开(公告)号:KR1020100062296A

    公开(公告)日:2010-06-10

    申请号:KR1020080120862

    申请日:2008-12-02

    发明人: 권태신 신성기

    IPC分类号: C09J133/08 C09J7/02

    摘要: PURPOSE: A tape for protecting a coated surface of lower chassis in a vehicle body is provided to simplify process by replacing thermosetting property PVC deadener and to improve protection function. CONSTITUTION: A tape for protecting a coated surface of lower chassis in a vehicle body contains a restrict layer(10) and acrylic adhesive layer(20). The restrict layer is formed with polyether polyurethane film having a longitude of 85-90, softening point of 90-100 °C, and tensile strength of 400kg/cm^2 or more. The acrylic adhesive layer contains 38.5-50 weight% of copolymer by 2-ethyl hexyl acrylate monomer, 23.5-35 weight% of butyl acrylate, 0.5-1.5 weight% of acrylic acid, and 15-25 weight% of ethyl acetate.

    摘要翻译: 目的:提供一种用于保护车身底盘涂层表面的胶带,以通过替代热固性PVC消泡剂来简化工艺,并改善保护功能。 构成:用于保护车体中底盘的涂覆表面的胶带包含限制层(10)和丙烯酸粘合剂层(20)。 限制层由经度为85-90度,软化点为90-100℃,拉伸强度为400kg / cm 2以上的聚醚聚氨酯膜形成。 丙烯酸粘合剂层含有丙烯酸2-乙基己酯单体,丙烯酸丁酯23.5-35重量%,丙烯酸0.5-1.5重量%和乙酸乙酯15-25重量%的共聚物38.5-50重量%。

    필름 기재 및 점착 테이프
    10.
    发明公开
    필름 기재 및 점착 테이프 无效
    薄膜基片和压敏胶带

    公开(公告)号:KR1020080059160A

    公开(公告)日:2008-06-26

    申请号:KR1020087006570

    申请日:2006-10-25

    摘要: A film substrate having a satisfactory balance among properties including flexibility, suitability for tearing by hand, heat resistance, and wearing resistance; and a pressure-sensitive adhesive tape employing the film substrate. The film substrate is characterized by comprising 100 parts by mass of an aromatic vinyl elastomer, 10-60 parts by mass of a styrene resin, and 1-50 parts by mass of a styrene copolymer having a Vicat softening point of 100-130°C. The pressure-sensitive adhesive tape comprises the film substrate and a pressure-sensitive adhesive layer formed on one side of the substrate.

    摘要翻译: 具有柔软性,手工撕裂适用性,耐热性和耐磨性等性能均匀的薄膜基材; 以及使用该薄膜基板的压敏粘合带。 膜基材的特征在于,含有100质量份芳香族乙烯基类弹性体,10〜60质量份苯乙烯类树脂,1-50质量份维卡软化点为100〜130℃的苯乙烯共聚物 。 该压敏粘合带包括薄膜基材和形成在基材的一侧上的压敏粘合剂层。