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公开(公告)号：KR101894125B1
公开(公告)日：2018-08-31
申请号：KR1020147033140
申请日：2012-09-14
申请人： 르네사스 일렉트로닉스 가부시키가이샤
CPC分类号： H01L21/486 , H01L21/561 , H01L21/563 , H01L21/565 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L23/295 , H01L23/3107 , H01L23/3128 , H01L23/3135 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/538 , H01L24/03 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L25/03 , H01L25/065 , H01L25/0657 , H01L25/07 , H01L25/18 , H01L25/50 , H01L2221/68327 , H01L2221/68331 , H01L2224/03002 , H01L2224/0401 , H01L2224/13083 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2224/27312 , H01L2224/27334 , H01L2224/2741 , H01L2224/29006 , H01L2224/29007 , H01L2224/29012 , H01L2224/29015 , H01L2224/2919 , H01L2224/32013 , H01L2224/32014 , H01L2224/32058 , H01L2224/32059 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/753 , H01L2224/75315 , H01L2224/81001 , H01L2224/81191 , H01L2224/81203 , H01L2224/81447 , H01L2224/81815 , H01L2224/81907 , H01L2224/83001 , H01L2224/83192 , H01L2224/83203 , H01L2224/8321 , H01L2224/8385 , H01L2224/83862 , H01L2224/83906 , H01L2224/83907 , H01L2224/92 , H01L2224/9211 , H01L2224/92242 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2225/06565 , H01L2225/06568 , H01L2924/07802 , H01L2924/07811 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/00012 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2224/11 , H01L21/304 , H01L2224/03 , H01L21/78 , H01L2221/68381 , H01L21/4825 , H01L2224/27 , H01L2924/01047
摘要： 배선기판위에, 평면으로보았을때 평면사이즈가다른제1 반도체칩과제2 반도체칩을, 접착재를개재하여각각적층하는반도체장치의제조방법으로서, 상대적으로평면사이즈가작은제1 반도체칩 위에상대적으로평면사이즈가큰 제2 반도체칩을탑재한다. 또한, 제1 및제2 반도체칩을탑재한후, 제1 및제2 반도체칩을수지로밀봉한다. 여기서, 제2 반도체칩과배선기판의간극은, 수지로밀봉하기전에, 제1 및제2 반도체칩을탑재할때 사용한접착재로미리막혀있는것이다.
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公开(公告)号：KR101853165B1
公开(公告)日：2018-04-27
申请号：KR1020147030022
申请日：2013-03-06
申请人： 데쿠세리아루즈 가부시키가이샤
发明人： 모리야마,히로노부
CPC分类号： H01L21/78 , C09J7/00 , C09J7/10 , C09J2201/134 , C09J2201/36 , C09J2203/326 , H01L21/563 , H01L21/6836 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/91 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2224/11002 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16057 , H01L2224/16145 , H01L2224/16225 , H01L2224/27002 , H01L2224/27436 , H01L2224/29005 , H01L2224/29082 , H01L2224/2929 , H01L2224/29386 , H01L2224/29387 , H01L2224/29388 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81204 , H01L2224/81805 , H01L2224/81815 , H01L2224/81855 , H01L2224/83191 , H01L2224/83203 , H01L2224/83204 , H01L2224/83862 , H01L2224/9211 , H01L2224/94 , H01L2225/06513 , H01L2924/01322 , H01L2924/14 , Y10T403/479 , H01L2924/00 , H01L2224/11 , H01L2224/27 , H01L2924/01082 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029 , H01L2924/01051 , H01L2924/0665 , H01L2924/207 , H01L2224/81 , H01L2224/83 , H01L2924/05442 , H01L2924/05341 , H01L2924/0532
摘要： 대향하는전극과의양호한접합을얻을수 있는회로접속재료및 이것을사용한반도체장치의제조방법을제공한다. 반도체칩(10)측에접착되는제1 접착제층(21)과, 제1 접착제층(21)의최저용융점도도달온도보다도높은최저용융점도도달온도를갖는제2 접착제층(22)이적층된회로접속재료(20)를사용한다. 이회로접속재료(20)가부착된반도체칩(10)을회로기판(30)에탑재했을때, 제1 접착제층(21)의두께 Hb1이하기식 (1)을만족하는범위인것에의해, 대향하는전극과의양호한접합을얻을수 있다.
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公开(公告)号：KR101829585B1
公开(公告)日：2018-02-14
申请号：KR1020170079975
申请日：2017-06-23
申请人： 닛토덴코 가부시키가이샤
IPC分类号： H01L21/683 , H01L23/00 , H01L21/78 , H01L21/324
CPC分类号： C09J5/06 , C09J7/22 , C09J7/29 , C09J7/38 , C09J2201/36 , C09J2203/326 , C09J2205/102 , C09J2205/11 , C09J2205/302 , H01L21/563 , H01L21/6836 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2221/68327 , H01L2221/68381 , H01L2223/54433 , H01L2223/54486 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16238 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81911 , H01L2224/83104 , H01L2924/10253 , Y10T428/25 , Y10T428/31504 , H01L2924/00014 , H01L2924/01082 , H01L2924/0103 , H01L2924/01083 , H01L2924/00012 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00
摘要： 본발명은기재층및 점착제층을포함하는점착시트와, 이점착시트의점착제층상에형성된반도체이면용필름을포함하고, 상기점착시트가, 가열에의해상기반도체이면필름과의박리력이저하되는가열박리형점착시트인가열박리시트일체형반도체이면용필름에관한것이다.
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公开(公告)号：KR101821958B1
公开(公告)日：2018-01-25
申请号：KR1020137017614
申请日：2012-02-02
申请人： 도레 엔지니아린구 가부시키가이샤
IPC分类号： H01L21/60
CPC分类号： H01L24/75 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L2224/13017 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16238 , H01L2224/2919 , H01L2224/73204 , H01L2224/75252 , H01L2224/75753 , H01L2224/7592 , H01L2224/81191 , H01L2224/81203 , H01L2224/83192 , H01L2224/83855 , H01L2924/00014 , H01L2924/014
摘要： (과제) 필러범프등의미세한솔더범프가형성된칩을기판에열압착하는실장방법에있어서, 필러범프가기판의전극에양호하게열압착되어있는지여부를판정할수 있는실장방법및 실장장치를제공하는것. (해결수단) 칩을열압착툴에의하여지지하여기판측으로하강시키는공정과, 칩의필러범프가기판의전극에접촉한후에, 칩을지지하는열압착툴의온도를솔더용융온도로승온하는공정과, 미리설정되어있는압입량만큼칩을기판측으로압입하고, 압입이완료되었을때 기판의전극으로부터의반력을측정하는제1반력측정공정과, 필러범프에형성된솔더가용융하였을때의기판의전극으로부터의반력을측정하는제2반력측정공정과, 상기제1반력측정공정의측정결과와, 상기제2반력측정공정의측정결과로부터, 용융된필러범프와전극의얼라인먼트의양부를판정하는반력판정공정을구비하는실장방법및 실장장치를제공한다.
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公开(公告)号：KR101793967B1
公开(公告)日：2017-11-06
申请号：KR1020157033339
申请日：2014-12-24
申请人： 인텔 코포레이션
IPC分类号： H01L25/07 , H01L25/065 , H01L23/48 , H01L23/495 , H01L23/00 , H01L23/488 , H01L49/02
CPC分类号： H01L25/18 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/64 , H01L24/02 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/85 , H01L24/92 , H01L25/0657 , H01L28/10 , H01L28/40 , H01L28/90 , H01L2224/02372 , H01L2224/05548 , H01L2224/13024 , H01L2224/13025 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16146 , H01L2224/16227 , H01L2224/16235 , H01L2224/1703 , H01L2224/17181 , H01L2224/32145 , H01L2224/45147 , H01L2224/48227 , H01L2224/4847 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/81203 , H01L2224/81207 , H01L2224/85207 , H01L2224/92125 , H01L2224/92227 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06568 , H01L2225/06589 , H01L2924/00014 , H01L2924/1421 , H01L2924/1427 , H01L2924/1432 , H01L2924/14335 , H01L2924/1434 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/014 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： 적층형집적회로패키지에서의통합형수동구성요소가기술된다. 일실시예에서, 장치는, 기판, 기판위에서기판에연결된제1 다이 - 제1 다이는기판에연결되어전력을수신하는전력공급회로를포함함 - , 처리코어를가지며, 제1 다이위에서제1 다이에연결되는제2 다이 - 제1 다이는전력공급회로에연결되어처리코어에전력을공급함 - , 및제1 다이에부착되고, 전력공급회로에연결되는수동디바이스를갖는다.
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公开(公告)号：KR101750206B1
公开(公告)日：2017-06-22
申请号：KR1020160092458
申请日：2016-07-21
申请人： 후지쯔 가부시끼가이샤
IPC分类号： H01L23/00 , H01L21/60 , H01L23/488 , H01L25/065 , H01L21/67
CPC分类号： H01L24/75 , H01L24/81 , H01L2224/13082 , H01L2224/13111 , H01L2224/16145 , H01L2224/2919 , H01L2224/73104 , H01L2224/73204 , H01L2224/75252 , H01L2224/75304 , H01L2224/75312 , H01L2224/81193 , H01L2224/81203 , H01L2224/83191 , H01L2924/3511 , H01L2924/014
摘要： 본발명은반도체칩의휘어짐을억제하여, 저하중으로단자끼리의접합을행하는것을목적으로한다. 반도체실장장치의가열헤더는, 제1 재료와, 상기제1 재료에접합되며, 또한, 제1 반도체칩을가압할때에상기제1 반도체칩에접촉하는제2 재료를구비하고, 상기제2 재료에서의상기제1 반도체칩과의접촉면은상기제1 반도체칩측을향해볼록한곡면이며, 상기제1 재료및 상기제2 재료의온도가상기제1 반도체칩의제1 단자와제2 반도체칩의제2 단자사이에형성된땜납의용융온도에도달하면, 상기제2 재료에서의상기제1 반도체칩과의접촉면은평면이된다.
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公开(公告)号：KR1020170036088A
公开(公告)日：2017-03-31
申请号：KR1020177005575
申请日：2015-07-22
申请人： 후아웨이 테크놀러지 컴퍼니 리미티드
CPC分类号： H01L25/16 , H01G2/065 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0345 , H01L2224/03452 , H01L2224/0401 , H01L2224/04042 , H01L2224/05557 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2224/11 , H01L2224/1134 , H01L2224/13023 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13166 , H01L2224/13611 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13664 , H01L2224/16268 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73207 , H01L2224/75744 , H01L2224/75745 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/92125 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/00014 , H01L2924/00012
摘要： 본발명은다이, 수동소자, 및연결편을포함하는칩 집적모듈을제공하며, 상기다이는다이본딩부를구비하고, 상기수동소자는수동소자본딩부를구비하고, 상기다이의다이본딩부및 상기수동소자의수동소자본딩부는서로대향하여배치되고, 상기연결편은상기다이본딩부와상기수동소자본딩부사이에배치되고, 상기다이본딩부와상기수동소자본딩부에연결된다. 본발명의칩 집적모듈은집적이용이하고비용을낮출수 있다. 또한, 다이를수동소자에연결하는경로가더 짧아져, 수동소자의성능을향상시킬수 있다. 본발명은칩 패키지구조및 칩집적방법을더 제공한다.
摘要翻译： 本发明模头，无源元件，并提供了一个芯片上集成模块，包括一个连接件，其中，所述管芯设置芯片接合部分，其中，所述无源元件是无源元件接合，包括，和芯片接合部分和所述模具的无源元件 并且连接件设置在管芯键合部分和无源元件键合部分之间，并连接到管芯键合部分和无源器件键合部分。 本发明的芯片集成模块可以集成并降低成本。 另外，将管芯连接到无源元件的路径进一步缩短，从而可以提高无源元件的性能。 本发明还提供一种芯片封装结构及一种芯片集成方法。
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公开(公告)号：KR101690626B1
公开(公告)日：2016-12-28
申请号：KR1020147023547
申请日：2013-02-22
申请人： 히타치가세이가부시끼가이샤
CPC分类号： H01L23/293 , B23K35/0222 , B23K35/0233 , B23K35/0244 , B23K2201/40 , C08G59/38 , C08K5/09 , C08L63/00 , C09J11/06 , C09J163/00 , C09J163/04 , C09J201/00 , H01L21/563 , H01L23/3157 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2224/0401 , H01L2224/05568 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/06181 , H01L2224/08145 , H01L2224/08225 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16146 , H01L2224/16238 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81192 , H01L2224/81203 , H01L2224/81815 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/9211 , H01L2225/06513 , H01L2225/06517 , H01L2924/00014 , H01L2924/10253 , H01L2224/16225 , H01L2924/00 , H01L2924/00012 , H01L2224/81 , H01L2224/83 , H01L2924/01082 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029 , H01L2224/05552
摘要： 반도체칩 및배선회로기판의각각의접속부가서로전기적으로접속된반도체장치, 또는복수의반도체칩의각각의접속부가서로전기적으로접속된반도체장치의제조방법으로서, 상기접속부중 적어도일부를, 하기식(1)으로표시되는기를가지는화합물을함유하는반도체용접착제를사용하여봉지(封止)하는공정을포함하는, 반도체장치의제조방법. [화학식 1][식중, R은, 전자공여성기를나타낸다.]
摘要翻译： 一种半导体器件的制造方法，其中半导体芯片的连接部分电连接到其中多个半导体芯片的连接部分彼此电连接的布线电路衬底或半导体器件的连接部分，该方法包括 用包含具有由下式（1）表示的基团的化合物的半导体用粘合剂密封连接部分的至少一部分的步骤：其中R1表示给电子基团。
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公开(公告)号：KR101666101B1
公开(公告)日：2016-10-13
申请号：KR1020147023580
申请日：2012-10-01
申请人： 히타치가세이가부시끼가이샤
IPC分类号： C09J163/00 , C09J11/06 , H01L21/52 , H01L21/60 , H01L23/29
CPC分类号： C09J11/06 , B23K35/3613 , B23K35/3618 , B23K35/362 , C08K5/092 , C09J163/00 , H01L21/563 , H01L23/295 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L2224/03825 , H01L2224/0401 , H01L2224/051 , H01L2224/05111 , H01L2224/05116 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05575 , H01L2224/0558 , H01L2224/056 , H01L2224/05611 , H01L2224/05616 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/11825 , H01L2224/13025 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13575 , H01L2224/1358 , H01L2224/136 , H01L2224/13611 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17181 , H01L2224/271 , H01L2224/27416 , H01L2224/27436 , H01L2224/27848 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/73104 , H01L2224/81011 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/81895 , H01L2224/81907 , H01L2224/831 , H01L2224/83191 , H01L2224/83203 , H01L2224/83855 , H01L2224/83862 , H01L2224/9205 , H01L2224/92122 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H05K3/305 , H05K3/3436 , H05K2201/0367 , H05K2201/10977 , Y02P70/613 , H01L2924/00012 , H01L2924/014 , H01L2924/00014 , H01L2224/8385 , H01L2924/00 , C08L63/00 , H01L2224/27 , H01L2924/01047 , H01L2924/01082 , H01L2924/01083 , H01L2924/01029 , H01L2224/11 , H01L2924/0001
摘要： 에폭시수지, 경화제및 하기식(1)으로표시되는기를가지는화합물을함유하는, 반도체용접착제. [화학식 1][식중, R은, 전자공여성기를나타낸다.]
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公开(公告)号：KR1020160113692A
公开(公告)日：2016-09-30
申请号：KR1020167023542
申请日：2014-03-28
申请人： 인텔 코포레이션
IPC分类号： H01L23/48 , H01L23/00 , H01L21/48 , H01L23/538
CPC分类号： H01L24/81 , H01L21/4853 , H01L23/49811 , H01L23/5383 , H01L24/03 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/742 , H01L2224/0214 , H01L2224/0312 , H01L2224/0333 , H01L2224/0381 , H01L2224/0401 , H01L2224/05571 , H01L2224/10175 , H01L2224/11003 , H01L2224/113 , H01L2224/1132 , H01L2224/1147 , H01L2224/13007 , H01L2224/13017 , H01L2224/131 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13184 , H01L2224/1601 , H01L2224/16013 , H01L2224/16014 , H01L2224/16057 , H01L2224/16058 , H01L2224/16059 , H01L2224/16111 , H01L2224/16227 , H01L2224/16237 , H01L2224/16238 , H01L2224/742 , H01L2224/81193 , H01L2224/81203 , H01L2224/81385 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81484 , H01L2224/81815 , H01L2924/15192 , H01L2924/381 , H01L2924/3841 , H01L2924/40102 , H01L2924/00014 , H01L2924/014 , H01L2924/00012 , H01L23/48 , H01L23/5386
摘要： 집적회로(IC)를 IC 패키지기판에부착하기위한방법은, IC 다이의본드패드상에솔더범프를형성하는단계와, IC 패키지기판의본드패드상에솔더웨이팅돌출부를형성하는단계와, IC 패키지기판의솔더웨이팅돌출부에 IC 다이의솔더범프를본딩하는단계를포함한다.
摘要翻译： 一种将集成电路（IC）附着到IC封装基板的方法包括在IC芯片的焊盘上形成焊料凸块，在IC封装基板的焊盘上形成焊料润湿突起，并将焊料凸块 的IC管芯到IC封装衬底的焊料润湿突起。
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