公开(公告)号：US09573205B2

公开(公告)日：2017-02-21

申请号：US14365189

申请日：2012-02-28

申请人： Akihiko Nakamura ,  Kazuhiro Hanaki ,  Mahito Nakamura ,  Hiroshi Uchida ,  Narihiro Minami

发明人： Akihiko Nakamura ,  Kazuhiro Hanaki ,  Mahito Nakamura ,  Hiroshi Uchida ,  Narihiro Minami

IPC分类号： B23D21/14 ,  B23D21/00 ,  B23D35/00

CPC分类号： B23D21/00 ,  B23D21/14 ,  B23D35/001 ,  Y10T83/0596 ,  Y10T83/384

摘要： A rotary cutting apparatus includes a pair of cutting tools each having a cutting blade along a tip end of its outer peripheral portion having a mountain-shaped cross section, and cuts a cylindrical material into pieces with a predetermined width by sandwiching the cylindrical material between the cutting blades so the cutting blades are respectively placed on inner and outer peripheries of the cylindrical material, and relatively rotating and moving the pair of cutting tools along an entire circumference of the cylindrical material. A second imaginary line connecting an axial center of the cylindrical material and an axial center of the inner peripheral-side cutting tool is shifted in a circumferential direction of the cylindrical material about the axial center of the cylindrical material with respect to a first imaginary line connecting the axial center of the cylindrical material and an axial center of the outer peripheral-side cutting tool.

摘要翻译： 旋转切割装置包括一对切割工具，每个切割工具具有沿着其外周部分的顶端具有山形横截面的切割刀片，并且通过将圆柱形材料夹在两者之间将圆柱形材料切割成具有预定宽度的片材 切割刀片，使得切割刀片分别放置在圆柱形材料的内周和外周，并且沿着圆柱形材料的整个圆周相对旋转并移动一对切割工具。 连接圆柱形材料的轴向中心和内周侧切削工具的轴向中心的第二假想线相对于连接第一假想线的圆柱形材料的轴向中心在圆柱形材料的圆周方向上移动 圆柱形材料的轴向中心和外周侧切削工具的轴向中心。

公开(公告)号：US08449945B2

公开(公告)日：2013-05-28

申请号：US13364739

申请日：2012-02-02

申请人： Seiji Ohishi ,  Akihiko Nakamura

发明人： Seiji Ohishi ,  Akihiko Nakamura

IPC分类号： B05D3/12

CPC分类号： H01L21/6715 ,  B05D1/002 ,  B05D1/42 ,  Y10S134/902

摘要： A coating method, which uses a coating apparatus including a rotatable tray having a recessed portion for accommodating a substrate and rotatable together with the substrate, a nozzle for supplying a coating liquid, and an applicator for spreading the coating liquid, includes the steps of placing a substrate into the recessed portion of the tray, positioning the nozzle over a non-recessed portion of the upper surface of the tray, supplying a coating liquid from the nozzle, and forming a coating liquid pool only on the non-recessed portion of the upper surface of the tray, moving the applicator in a horizontal direction while maintaining a certain distance with respect to the upper surface of the substrate for spreading the coating liquid of the coating liquid pool over the entire upper surface of the substrate, and releasing the substrate from the recessed portion of the tray.

摘要翻译： 一种涂布方法，其使用包括可旋转托盘的涂布装置，该托盘具有用于容纳基材的凹部并与基底一起旋转的涂布装置，用于供给涂布液的喷嘴和用于涂布涂布液的涂布器的步骤包括以下步骤： 基板进入托盘的凹部，将喷嘴定位在托盘的上表面的非凹部上，从喷嘴供给涂布液，并且仅在所述托盘的非凹部上形成涂布液池 托盘的上表面，沿着水平方向移动施加器，同时相对于基板的上表面保持一定距离，以将涂液池的涂布液涂覆在基板的整个上表面上，并释放基板 从托盘的凹陷部分。

公开(公告)号：US08377256B2

公开(公告)日：2013-02-19

申请号：US13613384

申请日：2012-09-13

申请人： Kimihiro Nakada ,  Yasumasa Iwata ,  Akihiko Nakamura ,  Yoshihiro Inao ,  Satoshi Kobari

发明人： Kimihiro Nakada ,  Yasumasa Iwata ,  Akihiko Nakamura ,  Yoshihiro Inao ,  Satoshi Kobari

IPC分类号： B32B38/10

CPC分类号： B32B43/006 ,  B32B2457/14 ,  H01L21/67132 ,  H01L21/6715 ,  Y10T156/1111 ,  Y10T156/1121 ,  Y10T156/19 ,  Y10T156/1922

摘要： A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

摘要翻译： 一种用于从包括基底和支撑板的层压板剥离支撑板的剥离方法，所述支撑板通过粘合剂层粘合到晶片上，其中粘合剂层由可溶于非极性溶剂或高极性溶剂的粘合剂形成 ; 并且剥离方法包括供给非极性溶剂或高极性溶剂，使得非极性溶剂或高极性溶剂至少保留在面向支撑板的层压体的该表面的边缘部分上，以及 在层压板的侧表面上。

公开(公告)号：US20120293285A1

公开(公告)日：2012-11-22

申请号：US13465259

申请日：2012-05-07

申请人： Daisuke KURIHARA ,  Akihiko NAKAMURA

发明人： Daisuke KURIHARA ,  Akihiko NAKAMURA

IPC分类号： H01H9/02

CPC分类号： H01H50/047 ,  H01H50/042 ,  H01H50/14 ,  H01H50/26 ,  H01H50/30

摘要： An electromagnetic relay includes an electromagnetic relay body having an electromagnet and a contact part, the contact part opening and closing along with movement of the electromagnet, a terminal member supporting the electromagnetic relay body, and a base member supporting the terminal member. The terminal member has a connecting part electrically connected to the electromagnetic relay body, the electromagnetic relay body is supported by the connecting part while providing a clearance between the base member and the electromagnetic relay body.

摘要翻译： 电磁继电器包括具有电磁体和接触部的电磁继电器主体，接触部分与电磁铁的移动一起开闭，支撑电磁继电器主体的端子部件和支撑端子部件的基座部件。 端子构件具有与电磁继电器本体电连接的连接部，电磁继电器主体由连接部支撑，同时在基座部件与电磁继电器体之间形成间隙。

公开(公告)号：US08297331B2

公开(公告)日：2012-10-30

申请号：US12492620

申请日：2009-06-26

申请人： Yoshihiro Inao ,  Akihiko Nakamura ,  Yasumasa Iwata

发明人： Yoshihiro Inao ,  Akihiko Nakamura ,  Yasumasa Iwata

IPC分类号： B32B38/10

CPC分类号： H01L21/67092 ,  H01L21/67011 ,  H01L21/6838 ,  Y10T156/1111 ,  Y10T156/1116 ,  Y10T156/1132 ,  Y10T156/1137 ,  Y10T156/1939 ,  Y10T156/1944

摘要： A separating apparatus includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes for expelling gas from a space between the sucking plate and the support plate. Each of the sucking holes has a diameter of not less than 0.3 mm and not more than an outer diameter of the support plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer.

摘要翻译： 分离装置包括用于通过抽吸粘附到支撑板的吸板。 吸盘具有用于从吸板和支撑板之间的空间排出气体的吸孔。 每个吸孔的直径不小于0.3mm且不大于支撑板的外径。 这使得可以在不破坏晶片的情况下将支撑板与晶片分离。

公开(公告)号：US08148457B2

公开(公告)日：2012-04-03

申请号：US12514633

申请日：2007-09-26

申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

IPC分类号： C08L31/00

CPC分类号： C09J153/00 ,  C08F212/08 ,  C08F220/06 ,  C08F220/18 ,  C08F290/046 ,  C08F2220/301 ,  C09J7/381 ,  C09J133/10 ,  C09J133/12 ,  C09J135/06 ,  C09J2205/114 ,  C09J2433/00 ,  C09J2453/00 ,  Y10T428/2852 ,  Y10T428/2891

摘要： Disclosed is an adhesive composition whose component is a polymer obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure, and an alkyl(meth)acrylate having a chain structure. The monomer composition further contains a carboxylic acid having an ethylene double bond, a bifunctional monomer, and a styrene macromonomer. The polymer has a styrene block segment. This can improve heat resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping of an adhesive composition that has been subjected to a high temperature process. As a result, there can be obtained an adhesive composition which has high heat resistance, adhesive strength in a high temperature environment, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.

摘要翻译： 公开了一种粘合剂组合物，其组分是通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯）和具有链结构的（甲基）丙烯酸烷基酯获得的聚合物。 单体组合物还含有具有乙烯双键的羧酸，双官能单体和苯乙烯大分子单体。 聚合物具有苯乙烯嵌段。 这可以提高耐热性，在高温环境下的粘合强度，耐碱性，以及剥离已经进行高温处理的粘合剂组合物的容易性。 结果，可以获得耐热性高，在高温环境下的粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。

公开(公告)号：US08136564B2

公开(公告)日：2012-03-20

申请号：US11633604

申请日：2006-12-04

申请人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

发明人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

IPC分类号： B32B37/10

CPC分类号： B32B38/1841 ,  B32B37/0046 ,  B32B2038/1891 ,  B32B2309/68 ,  B32B2457/14 ,  H01L21/68 ,  H01L21/68742 ,  Y10T156/17

摘要： An attaching device which makes it possible to accurately perform alignment when the diameters of a substrate and a supporting plate are substantially the same includes a mounting plate for mounting a semiconductor wafer thereon, a pressing plate for pressing a supporting plate onto the semiconductor wafer, and a pair of alignment members. The pair of alignment members are arranged to freely move back and forth in a horizontal direction, and blades for supporting a lower surface of the periphery of the supporting plate and pushing members for performing positioning in a state where the supporting plate is superposed on the semiconductor wafer are provided at tip ends of the alignment members.

摘要翻译： 一种连接装置，其能够在基板和支撑板的直径基本相同的情况下准确地进行对准，包括用于在其上安装半导体晶片的安装板，用于将支撑板按压到半导体晶片上的按压板，以及 一对对准构件。 一对对准构件被布置成在水平方向上自由地前后移动，并且用于支撑支撑板的周边的下表面的叶片和用于在支撑板叠置在半导体上的状态下执行定位的推动构件 晶片设置在对准构件的顶端。

公开(公告)号：US20110259527A1

公开(公告)日：2011-10-27

申请号：US13093412

申请日：2011-04-25

申请人： Kimihiro Nakada ,  Yasumasa Iwata ,  Akihiko Nakamura ,  Yoshihiro Inao ,  Satoshi Kobari

发明人： Kimihiro Nakada ,  Yasumasa Iwata ,  Akihiko Nakamura ,  Yoshihiro Inao ,  Satoshi Kobari

IPC分类号： B32B38/10

CPC分类号： B32B43/006 ,  B32B2457/14 ,  H01L21/67132 ,  H01L21/6715 ,  Y10T156/1111 ,  Y10T156/1121 ,  Y10T156/19 ,  Y10T156/1922

摘要： A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

摘要翻译： 一种用于从包括基底和支撑板的层压板剥离支撑板的剥离方法，所述支撑板通过粘合剂层粘合到晶片上，其中粘合剂层由可溶于非极性溶剂或高极性溶剂的粘合剂形成 ; 并且剥离方法包括供给非极性溶剂或高极性溶剂的步骤，使得非极性溶剂或高极性溶剂至少保留在层压体的面向支持体的表面的边缘部分上 板，并且在层压板的侧表面上。

公开(公告)号：US07650144B2

公开(公告)日：2010-01-19

申请号：US11362800

申请日：2006-02-28

申请人： Akihiko Nakamura ,  Takaaki Ombe ,  Jun Hayashi ,  Noriaki Hayakawa

发明人： Akihiko Nakamura ,  Takaaki Ombe ,  Jun Hayashi ,  Noriaki Hayakawa

IPC分类号： H04M3/00

CPC分类号： G08B25/10 ,  H04L12/2803 ,  H04L12/2827 ,  H04W48/18 ,  H04W84/18 ,  Y02D70/10

摘要： A main controller used in a security system having a sensor or a camera performs wireless communication with the sensor or the camera so as to control the sensor or the camera. The main controller has a plurality of communication sections that perform wireless communication by using communication systems having different communication speeds. The camera transmits and receives information by performing wireless communication with the main controller. The camera is provided with a first camera communication section and a second camera communication section that perform wireless communication by using communication systems having different communication speeds, and a camera communication control section for selecting the first camera communication section and the second camera communication section according to the information to be transmitted and received, as a communication section to perform communication.

摘要翻译： 在具有传感器或相机的安全系统中使用的主控制器执行与传感器或相机的无线通信，以便控制传感器或相机。 主控制器具有通过使用具有不同通信速度的通信系统来执行无线通信的多个通信部分。 相机通过与主控制器进行无线通信来发送和接收信息。 相机具有第一相机通信部分和第二相机通信部分，其通过使用具有不同通信速度的通信系统执行无线通信，以及相机通信控制部分，用于根据第一相机通信部分和第二相机通信部分根据 要发送和接收的信息，作为通信部分进行通信。

公开(公告)号：US20090288780A1

公开(公告)日：2009-11-26

申请号：US12448499

申请日：2007-11-26

申请人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Yasumasa Iwata

发明人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Yasumasa Iwata

IPC分类号： B32B37/12

CPC分类号： H01L21/02002 ,  H01L21/67132 ,  H01L21/68757 ,  Y10T29/49998 ,  Y10T156/1062 ,  Y10T156/1798

摘要： To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention.

摘要翻译： 为了提供具有高刚性的穿孔支撑板，用于通过插入粘合剂层来支撑晶片表面的穿孔支撑板包括用于偏转预防的加强部件。