公开(公告)号：US20060209176A1

公开(公告)日：2006-09-21

申请号：US11362800

申请日：2006-02-28

申请人： Akihiko Nakamura ,  Takaaki Ombe ,  Jun Hayashi ,  Noriaki Hayakawa

发明人： Akihiko Nakamura ,  Takaaki Ombe ,  Jun Hayashi ,  Noriaki Hayakawa

IPC分类号： H04N7/14

CPC分类号： G08B25/10 ,  H04L12/2803 ,  H04L12/2827 ,  H04W48/18 ,  H04W84/18 ,  Y02D70/10

摘要： A main controller used in a security system having a sensor or a camera performs wireless communication with the sensor or the camera so as to control the sensor or the camera. The main controller has a plurality of communication sections that perform wireless communication by using communication systems having different communication speeds. The camera transmits and receives information by performing wireless communication with the main controller. The camera is provided with a first camera communication section and a second camera communication section that perform wireless communication by using communication systems having different communication speeds, and a camera communication control section for selecting the first camera communication section and the second camera communication section according to the information to be transmitted and received, as a communication section to perform communication.

摘要翻译： 在具有传感器或相机的安全系统中使用的主控制器执行与传感器或相机的无线通信，以便控制传感器或相机。 主控制器具有通过使用具有不同通信速度的通信系统来执行无线通信的多个通信部分。 相机通过与主控制器进行无线通信来发送和接收信息。 相机具有第一相机通信部分和第二相机通信部分，其通过使用具有不同通信速度的通信系统执行无线通信，以及相机通信控制部分，用于根据第一相机通信部分和第二相机通信部分根据 要发送和接收的信息，作为通信部分进行通信。

公开(公告)号：US07650144B2

公开(公告)日：2010-01-19

申请号：US11362800

申请日：2006-02-28

申请人： Akihiko Nakamura ,  Takaaki Ombe ,  Jun Hayashi ,  Noriaki Hayakawa

发明人： Akihiko Nakamura ,  Takaaki Ombe ,  Jun Hayashi ,  Noriaki Hayakawa

IPC分类号： H04M3/00

CPC分类号： G08B25/10 ,  H04L12/2803 ,  H04L12/2827 ,  H04W48/18 ,  H04W84/18 ,  Y02D70/10

摘要： A main controller used in a security system having a sensor or a camera performs wireless communication with the sensor or the camera so as to control the sensor or the camera. The main controller has a plurality of communication sections that perform wireless communication by using communication systems having different communication speeds. The camera transmits and receives information by performing wireless communication with the main controller. The camera is provided with a first camera communication section and a second camera communication section that perform wireless communication by using communication systems having different communication speeds, and a camera communication control section for selecting the first camera communication section and the second camera communication section according to the information to be transmitted and received, as a communication section to perform communication.

摘要翻译： 在具有传感器或相机的安全系统中使用的主控制器执行与传感器或相机的无线通信，以便控制传感器或相机。 主控制器具有通过使用具有不同通信速度的通信系统来执行无线通信的多个通信部分。 相机通过与主控制器进行无线通信来发送和接收信息。 相机具有第一相机通信部分和第二相机通信部分，其通过使用具有不同通信速度的通信系统执行无线通信，以及相机通信控制部分，用于根据第一相机通信部分和第二相机通信部分根据 要发送和接收的信息，作为通信部分进行通信。

公开(公告)号：US20060253598A1

公开(公告)日：2006-11-09

申请号：US11362930

申请日：2006-02-28

申请人： Akihiko Nakamura ,  Takaaki Ombe

发明人： Akihiko Nakamura ,  Takaaki Ombe

IPC分类号： G06F15/16

CPC分类号： H04L67/025 ,  H04L12/2803 ,  H04L12/2818 ,  H04L12/282 ,  H04L12/4641 ,  H04L67/04 ,  H04L2012/2841 ,  H04L2012/2845

摘要： A protocol converting apparatus (communication relay apparatus) relays communications between a cellular phone and an specific network (VPN) so that the cellular phone is connected to the VPN in which communication is performed by using an independently set dedicated address. The protocol converting apparatus has a data communication section that performs data communication with the cellular phone, a VPN connecting section that performs data communication with the specific network (VPN), a protocol converting section that converts a communication protocol of communication data, and an address authentication specifying section that specifies a destination of the communication data.

摘要翻译： 协议转换装置（通信中继装置）中继蜂窝电话和特定网络（VPN）之间的通信，使得蜂窝电话通过使用独立设置的专用地址连接到进行通信的VPN。 协议转换装置具有与蜂窝电话进行数据通信的数据通信部，与特定网络（VPN）进行数据通信的VPN连接部，转换通信数据的通信协议的协议转换部， 认证指定部，其指定通信数据的目的地。

公开(公告)号：US09129999B2

公开(公告)日：2015-09-08

申请号：US12514193

申请日：2007-10-12

申请人： Yasumasa Iwata ,  Akihiko Nakamura

发明人： Yasumasa Iwata ,  Akihiko Nakamura

IPC分类号： B08B3/04 ,  H01L21/67 ,  H01L21/02

CPC分类号： H01L21/6708 ,  H01L21/02057

摘要： The treatment device 100 of the present invention is a treatment device for carrying out treatment to a treatment object 18 whose treatment surface includes a second treatment surface 18b and a first treatment surface 18a surrounding the second treatment surface 18b, the treatment device including: a table section 10 for placing the treatment object 18 thereon; and a first feeding section 24 for feeding a first treatment liquid to an approximate boundary between the first and the second treatment surfaces 18a, 18b and a second feeding section 46 for feeding a second treatment liquid to the second treatment surface 18b. Thus, the present invention provides a treatment device, a treatment method, and a surface treatment jig, each of the treatment device and the treatment method being capable of carrying out independent treatments to a treatment surface and an exposed surface surrounding the treatment surface, respectively.

摘要翻译： 本发明的处理装置100是对处理对象18进行处理的处理装置，处理对象18的处理面包括第二处理面18b和围绕第二处理面18b的第一处理面18a，处理装置包括： 用于将处理对象18放置在其上的部分10; 以及用于将第一处理液体供给到第一处理用表面18a，第二处理用面18b之间的大致边界的第一供给部24以及向第二处理面18b供给第二处理液的第二供给部46。 因此，本发明提供一种处理装置，处理方法和表面处理夹具，每个处理装置和处理方法能够分别对处理表面和处理表面周围的暴露表面进行独立处理 。

公开(公告)号：US08701734B2

公开(公告)日：2014-04-22

申请号：US12453816

申请日：2009-05-22

申请人： Akihiko Nakamura

发明人： Akihiko Nakamura

IPC分类号： B32B38/10 ,  H01L21/687

CPC分类号： H01L21/68728 ,  H01L21/67011 ,  H01L21/67092 ,  H01L21/6838 ,  Y10T156/11 ,  Y10T156/1111 ,  Y10T156/1137 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/1184 ,  Y10T156/1939 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1967

摘要： A separating apparatus according to the present invention includes a clamp for gripping an outer peripheral end of a supporting plate. The clamp grips the outer peripheral end of the supporting plate and separates the supporting plate from a wafer by gripping the supporting plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer. With this, a supporting plate can be separated from a wafer to which the supporting plate has been attached, without breaking the wafer.

摘要翻译： 根据本发明的分离装置包括夹持支撑板的外周端的夹具。 夹具夹持支撑板的外周端，并通过夹持支撑板将支撑板与晶片分离。 这使得可以在不破坏晶片的情况下将支撑板与晶片分离。 由此，支撑板可以与已经安装支撑板的晶片分离，而不会破坏晶片。

公开(公告)号：US08277679B2

公开(公告)日：2012-10-02

申请号：US13024675

申请日：2011-02-10

申请人： Akihiko Nakamura ,  Keisuke Watanabe

发明人： Akihiko Nakamura ,  Keisuke Watanabe

IPC分类号： H01F1/147

CPC分类号： H01F1/14766 ,  B22F1/004 ,  B32B15/01 ,  C22C9/00 ,  C22C33/0257 ,  C22C38/02 ,  C22C38/04 ,  C22C38/34 ,  C22C38/38 ,  C22C2202/02 ,  H01F1/26 ,  H01F41/0246

摘要： The object of the present invention is to provide a composite magnetic material having well-balanced magnetic properties and chemical properties, and a magnetic element using thereof. Concretely, the present provides the composite magnetic material comprising a binder and a magnetic powder contains followings: Mn not less than 0.25 wt % and not larger than 3 wt %, Si not less than 1 wt % and not larger than 7 wt %, Cr not less than 2 wt % and not larger than 8 wt %, and the rest of Fe and inevitable impurities with respect to the total weight of a magnetic powder material, and a ratio of powder particles having the major/minor axis is not less than 2 is not larger than 5% of the total powder particles.

摘要翻译： 本发明的目的是提供具有良好平衡的磁性能和化学性质的复合磁性材料，以及使用它的磁性元件。 具体地，本发明提供了包含粘合剂的复合磁性材料和含有以下的磁性粉末：Mn不低于0.25重量％且不大于3重量％，Si不小于1重量％且不大于7重量％，Cr 不小于2重量％且不大于8重量％，其余的Fe和不可避免的杂质相对于磁粉末材料的总重量，并且具有主轴/短轴的粉末颗粒的比例不小于 2不大于总粉末颗粒的5％。

公开(公告)号：US08181660B2

公开(公告)日：2012-05-22

申请号：US12322156

申请日：2009-01-29

申请人： Akihiko Nakamura ,  Junichi Katsuragawa ,  Yasumasa Iwata

发明人： Akihiko Nakamura ,  Junichi Katsuragawa ,  Yasumasa Iwata

IPC分类号： B08B3/00 ,  B08B3/12 ,  B08B6/00

CPC分类号： H01L21/67092 ,  H01L21/67017 ,  H01L21/67132 ,  Y10T156/1111 ,  Y10T156/1126 ,  Y10T156/1922

摘要： A treatment liquid permeation unit comprises: at least one vibration unit; and a vibration transmission unit for transmitting a vibration from the vibration unit. The vibration transmission unit is positioned between an adhesive with which a wafer is combined to a supporting plate or an adhesive adhered to a surface of the wafer and the vibration unit. A vibration from the vibration unit is transmitted via the vibration transmission unit. This promotes the treatment liquid for dissolving the adhesive to permeate the adhesive to which the treatment liquid is supplied. Therefore, the treatment liquid can more uniformly permeate the adhesive in a shorter time. This allows the treatment liquid for dissolving the adhesive to permeate the adhesive with which the wafer is combined to the supporting plate or to permeate the adhesive adhered to the surface of the wafer in a shorter time.

摘要翻译： 处理液体渗透单元包括：至少一个振动单元; 以及用于从振动单元传递振动的振动传递单元。 振动传递单元位于与晶片组合的粘合剂与粘合到晶片表面的粘合剂和振动单元之间。 来自振动单元的振动经由振动传递单元传递。 这促进了用于溶解粘合剂的处理液渗透到供应处理液的粘合剂。 因此，处理液可以在更短的时间内更均匀地渗透粘合剂。 这使得用于溶解粘合剂的处理液渗透到晶片与支撑板组合的粘合剂上，或者在更短的时间内渗透粘附到晶片表面的粘合剂。

公开(公告)号：US08167687B2

公开(公告)日：2012-05-01

申请号：US12309285

申请日：2007-05-24

申请人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Yasumasa Iwata

发明人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Yasumasa Iwata

IPC分类号： B24B1/00 ,  B24B41/06

CPC分类号： B24B41/068 ,  B24B7/228 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68318 ,  H01L2221/68327

摘要： A wafer can be thinned without occurrences of dimples. A support plate 1 has a number of through holes 10. A circuit forming surface of a wafer 2 is adhered to one surface of the support plate by an adhesive member 4, and a dimple prevention member 3 having a thickness of 100 μm or more and having an adhesive layer 30 on one face is adhered to the other surface, thus the openings at both ends of the through holes 10 are blocked. The support plate is vacuum adsorbed to a support table through the dimple prevention member, and a non circuit-forming face of the wafer is ground/polished to thin the wafer. The dimple prevention member is stripped off, and a solvent is penetrated into the adhesive member through the through holes to detach the wafer from the support plate.

摘要翻译： 晶片可以变薄而不发生凹坑。 支撑板1具有多个通孔10.晶片2的电路形成表面通过粘合构件4和厚度为100μm以上的凹坑防止构件3粘附到支撑板的一个表面，以及 在一个面上具有粘合剂层30粘附到另一个表面，因此通孔10的两端的开口被阻挡。 支撑板通过凹坑防止构件被真空吸附到支撑台上，并且将晶片的非电路形成面研磨/抛光以使晶片变薄。 剥去防止凹坑的构件，并且通过通孔将溶剂渗透到粘合构件中，以将晶片从支撑板上分离。

公开(公告)号：US07972654B2

公开(公告)日：2011-07-05

申请号：US11937266

申请日：2007-11-08

申请人： Akihiko Nakamura

发明人： Akihiko Nakamura

IPC分类号： B05D3/12 ,  B05D1/38

CPC分类号： H01L21/31051 ,  H01L21/76819 ,  H01L21/76837

摘要： A planarizing coating method for filling a step between patterns formed on a board surface, includes the steps of: preparing at least two types of coating liquids different in non-volatile matter densities, first coating one of the coating liquids higher in density on the board surface, rotating the board so as to leave the one coating liquid inside the step and such that, at the same time, substantially none of the one coating liquid is left on a pattern crest of the patterns, subsequently coating another of the coating liquids lower in non-volatile matter density on the board surface, and rotating the board so that the coating liquid lower in density is left on a coating film comprising the one coating liquid higher in density and such that, at the same time, substantially none of the other coating liquid lower in density left on the pattern crest.

摘要翻译： 用于在板表面上形成的图案之间填充台阶的平面化涂布方法包括以下步骤：制备不同于不挥发物质密度的至少两种类型的涂布液，首先在板上涂覆更高密度的涂布液之一 表面，旋转板，以使步骤中的一个涂布液体留下，并且同时基本上没有一个涂布液体留在图案的图案峰上，随后再涂覆另一个涂布液体 在板表面上的非挥发性物质密度，并且旋转板，使得密度较低的涂布液留在包含一个密度较高的一个涂布液的涂膜上，并且同时基本上没有一个 其他涂层液体密度较低，留在图案峰上。

公开(公告)号：US07919394B2

公开(公告)日：2011-04-05

申请号：US11517157

申请日：2006-09-07

申请人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

发明人： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L21/78 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68363

摘要： A method for thinning a substrate and a method for manufacturing a circuit device which make it possible to prevent the pattern of penetrating holes of a supporting plate from being transferred to the surface of the substrate and prevent non-uniform grinding of the surface of the substrate from occurring. The supporting plate and the substrate are joined by using an adhesive layer, and a sheet is attached to the supporting plate. The surface of the supporting plate to which the sheet has been attached is mounted and fixed by attraction onto an attracting head. The surface of the semiconductor wafer on which no circuit device is formed is ground by a grinder in this state.

摘要翻译： 一种用于使基板变薄的方法和用于制造电路器件的方法，其可以防止支撑板的穿透图案被转移到基板的表面并防止基板表面的不均匀研磨 从发生。 支撑板和基板通过使用粘合剂层接合，并且片材附接到支撑板。 已经安装了片材的支撑板的表面通过吸引安装和固定到吸引头上。 在该状态下，通过研磨机研磨不形成电路器件的半导体晶片的表面。