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公开(公告)号：US08211538B2
公开(公告)日：2012-07-03
申请号：US12815775
申请日：2010-06-15
申请人： Kenneth H. Heffner
发明人： Kenneth H. Heffner
CPC分类号： H01L23/57 , G06F21/87 , G06F2221/2143 , G06K19/073 , G06K19/07372 , H01L2924/0002 , H05K1/0275 , Y10S428/901 , Y10S428/916 , Y10T428/249955 , H01L2924/00
摘要： A security coating on an electronic circuit assembly comprises a mesh coating that may have a unique signature pattern and comprise materials that easily produce an image of the signature so that it is possible to determine if reverse engineering has been attempted. Spaces in the mesh may include electrical components to erase circuit codes to destroy the functionality and value of the protected die if the mesh coated is disturbed. The voids may include compositions to enhance the mesh signature and abrade the circuit if tampering takes place.
摘要翻译： 电子电路组件上的安全涂层包括可以具有唯一签名图案的网格涂层，并且包括容易产生签名图像的材料，使得可以确定是否已经尝试逆向工程。 网格中的空间可能包括电气部件，以擦除电路代码，以破坏受保护的裸片的功能和价值。 如果发生窜改，空隙可以包括用于增强网格签名并磨擦电路的组合物。
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公开(公告)号：US20100254095A1
公开(公告)日：2010-10-07
申请号：US12815775
申请日：2010-06-15
申请人： Kenneth H. Heffner
发明人： Kenneth H. Heffner
CPC分类号： H01L23/57 , G06F21/87 , G06F2221/2143 , G06K19/073 , G06K19/07372 , H01L2924/0002 , H05K1/0275 , Y10S428/901 , Y10S428/916 , Y10T428/249955 , H01L2924/00
摘要： A security coating on an electronic circuit assembly comprises a mesh coating that may have a unique signature pattern and comprise materials that easily produce an image of the signature so that it is possible to determine if reverse engineering has been attempted. Spaces in the mesh may include electrical components to erase circuit codes to destroy the functionality and value of the protected die if the mesh coated is disturbed. The voids may include compositions to enhance the mesh signature and abrade the circuit if tampering takes place.
摘要翻译： 电子电路组件上的安全涂层包括可以具有唯一签名图案的网格涂层，并且包括容易产生签名图像的材料，使得可以确定是否已经尝试逆向工程。 网格中的空间可能包括电气部件，以擦除电路代码，以破坏受保护的裸片的功能和价值。 如果发生窜改，空隙可以包括用于增强网格签名并磨擦电路的组合物。
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3.发明授权System and method for detecting unauthorized access to electronic equipment or components 有权用于检测未经授权的访问电子设备或组件的系统和方法公开(公告)号：US07429915B2
公开(公告)日：2008-09-30
申请号：US11170881
申请日：2005-06-30
IPC分类号： B60R25/10
CPC分类号： G08B13/128
摘要： An improved system and method for protecting sensitive electronic equipment or components against unauthorized access, by detecting and also reacting to unauthorized intrusions into the enclosures for the sensitive electronic equipment or components is disclosed. For example, a protective system for protecting sensitive electronic equipment or components against unauthorized access is disclosed that includes a fiber optic cable mesh or network attached to, or embedded in, the walls of the enclosure for the electronic equipment or components. A continuous signal or burst is applied to the fiber optic cable, which is coupled to an optical signal detection device. Thus, any attempt to remove or penetrate the walls of the enclosure interrupts the signal in the fiber optic cable, and the interruption of the signal is detected by the optical signal detection device. In response to the detection of the interruption of the signal in the fiber optic cable, a process can be initiated to erase, destroy or alter sensitive data contained within the electronic equipment or components. Also, a power source for the protective system is disclosed, which can be self-sustaining and contained within the protected enclosure for the sensitive electronic equipment or components.
摘要翻译： 公开了一种改进的系统和方法，用于通过检测并且还对未经授权的入侵敏感电子设备或组件的外壳来保护敏感的电子设备或组件以防止未经授权的访问。 例如，公开了一种用于保护敏感的电子设备或组件以防止未经授权的访问的保护系统，其包括附接到或嵌入在电子设备或组件的外壳的壁上的光纤电缆网或网络。 连续信号或脉冲串被施加到耦合到光信号检测装置的光纤电缆。 因此，任何去除或穿透外壳壁的尝试都会中断光缆中的信号，并且信号的中断由光信号检测装置检测。 响应于检测到光纤电缆中的信号的中断，可以开始一个过程来擦除，破坏或改变包含在电子设备或组件内的敏感数据。 此外，公开了一种用于保护系统的电源，其可以是自维持的并且包含在用于敏感电子设备或组件的受保护的外壳内。
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4.发明授权Diffuse reflectance method and apparatus for determining thickness of an infrared translucent layer 失效用于确定红外半透明层的厚度的漫反射方法和装置公开(公告)号：US06459488B1
公开(公告)日：2002-10-01
申请号：US09502059
申请日：2000-02-10
申请人： Kenneth H. Heffner
发明人： Kenneth H. Heffner
IPC分类号： G01B902
CPC分类号： G01B11/0675
摘要： A method for producing an interferogram of an infrared translucent layer that is on a reflective substrate, comprising generating parallel infrared interferometer beams by means of an infrared interferometer, converging the parallel infrared interferometer beams into converging infrared interferometer beams, sending the converging infrared interferometer beams onto the infrared translucent layer to produce diffusely reflected infrared interferometer rays from above and below the infrared translucent layer, and making the diffusely reflected infrared interferometer rays into parallel reflected infrared interferometer rays.
摘要翻译： 一种用于制造在反射基板上的红外半透明层的干涉图的方法，包括通过红外干涉仪产生平行红外干涉仪光束，将平行红外干涉仪光束会聚到会聚的红外干涉仪光束，将会聚的红外干涉仪光束发射到 红外半透明层产生从红外半透明层上下的漫反射红外干涉仪射线，并使漫反射红外干涉仪射线成平行反射红外干涉仪射线。
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公开(公告)号：US5877093A
公开(公告)日：1999-03-02
申请号：US549351
申请日：1995-10-27
CPC分类号： H01L23/573 , H01L21/56 , H01L23/24 , H01L23/295 , H01L2224/48091 , H01L2224/8592 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/181
摘要： Disclosed is a method of forming a primer coating and an opaque coating on an integrated circuit or multichip module. First a primer coating composition is applied to a surface of the integrated circuit device or multichip module to form a primer coating that increases the resistance of the surface to thermal and mechanical damage that may occur as a result of the application of the opaque coating. An opaque coating composition is then heated to a molten state and the molten opaque coating composition is applied over the primer coating to form an opaque coating that overlies active circuitry on the surface, to prevent optical and radiation based inspection and reverse engineering of the active circuitry.
摘要翻译： 公开了一种在集成电路或多芯片模块上形成底漆涂层和不透明涂层的方法。 首先，将底漆涂料组合物施加到集成电路器件或多芯片模块的表面以形成底漆涂层，其增加由于施加不透明涂层而可能发生的表面对热和机械损伤的电阻。 然后将不透明的涂料组合物加热至熔融状态，并将熔融的不透明涂料组合物施加在底漆涂层上以形成覆盖表面上的有源电路的不透明涂层，以防止基于光学和辐射的检查和有源电路的逆向工程 。
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公开(公告)号：US09947609B2
公开(公告)日：2018-04-17
申请号：US13416404
申请日：2012-03-09
IPC分类号： H01L23/48 , H01L23/58 , H01L23/498
CPC分类号： H01L23/481 , H01L23/49833 , H01L23/585 , H01L2224/16225 , H01L2224/73253 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , Y10T29/49126 , H01L2924/00
摘要： In some examples, an integrated circuit system includes a plurality of integrated circuit layers. At least one of the integrated circuit layers includes an integrated circuit die, which may not include any through-silicon vias that provide a pathway to an adjacent integrated circuit layer, and an interposer portion, which includes electrically conductive through-vias. The interposer portion may facilitate communication of the integrated circuit die with other integrated circuit layers of the integrated circuit system. In some examples, the stacked integrated circuit system may include more than one integrated circuit die, which may be in the same integrated circuit layer as at least one other integrated circuit die, or may be in a different integrated circuit layer.
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公开(公告)号：US08710618B2
公开(公告)日：2014-04-29
申请号：US11685029
申请日：2007-03-12
IPC分类号： H01L21/70
CPC分类号： H01L23/3121 , H01L23/295 , H01L23/3135 , H01L23/585 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/49109 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An integrated circuit (IC) package with a fibrous interface is provided. The package includes a substrate, a bond coat and a top coat. The substrate is configured to contain IC components and connections. The bond coat layer is configured to encapsulate the IC components. The top coat layer has at least a portion embedded in the bond coat layer. Moreover, the top coat layer includes a fibrous interface configured to provide security and strengthen the bond coat layer.
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公开(公告)号：US07495554B2
公开(公告)日：2009-02-24
申请号：US11329737
申请日：2006-01-11
申请人： Kenneth H. Heffner
发明人： Kenneth H. Heffner
IPC分类号： G08B21/00
CPC分类号： H05K1/0275 , G06F21/87 , H05K3/284 , H05K2201/10151 , Y10T70/5367
摘要： An anti-tamper system is provided. The anti-tamper system comprises a clamshell protective encasement adapted to encapsulate at least one device on a single circuit board such that at least one electrical connector of the single circuit board is accessible. The anti-tamper system also comprises one or more sensors embedded inside the clamshell protective encasement, the one or more sensors being adapted to detect unauthorized attempts to tamper with the clamshell protective encasement.
摘要翻译： 提供防篡改系统。 防篡改系统包括蛤壳保护套，其适于将至少一个装置封装在单个电路板上，使得单个电路板的至少一个电连接器可访问。 防篡改系统还包括嵌入在蛤壳式保护套内的一个或多个传感器，一个或多个传感器适于检测未经授权的篡改蛤壳式保护套装的尝试。
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公开(公告)号：US20080227302A1
公开(公告)日：2008-09-18
申请号：US11685029
申请日：2007-03-12
IPC分类号： H01L21/31
CPC分类号： H01L23/3121 , H01L23/295 , H01L23/3135 , H01L23/585 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/49109 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： an integrated circuit (IC) package with a fibrous interface is provided. The package includes a substrate, a bond coat and a top coat. The substrate is configured to contain IC components and connections. The bond coat layer is configured to encapsulate the IC components. The top coat layer has at least a portion embedded in the bond coat layer. Moreover, the top coat layer includes a fibrous interface configured to provide security and strengthen the bond coat layer.
摘要翻译： 提供了具有纤维界面的集成电路（IC）封装。 该包装包括基材，粘合涂层和顶涂层。 基板被配置为包含IC部件和连接。 接合涂层被配置为封装IC部件。 顶涂层具有至少一部分嵌入粘合涂层中的部分。 此外，顶涂层包括被配置为提供安全性并加强粘合涂层的纤维界面。
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公开(公告)号：US20080129501A1
公开(公告)日：2008-06-05
申请号：US11565376
申请日：2006-11-30
IPC分类号： G08B13/00
CPC分类号： G08B13/128 , G06F21/86 , G06F2221/2143 , G08B13/06
摘要： A secure chassis comprises a plurality of walls, wherein each wall comprises an inner portion; an outer portion; and a tamper sensor disposed between the inner portion and the outer portion of each wall, the tamper sensor configured to detect unauthorized tamper events; wherein the plurality of walls are coupled together to form an enclosure to house one or more components.
摘要翻译： 安全底盘包括多个壁，其中每个壁包括内部部分; 外部; 以及设置在每个壁的内部和外部之间的篡改传感器，所述篡改传感器被配置为检测未经授权的篡改事件; 其中所述多个壁联接在一起以形成容纳一个或多个部件的外壳。
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