摘要:
A method and system for controlling electron densities in a plasma processing system. By applying a dither voltage and a correction voltage to a voltage-controlled oscillator, electron (plasma) density of a plasma processing system (acting as an open resonator) may be measured and controlled as part of a plasma-based process.
摘要:
A system for measuring plasma electon densities (e.g., in the range of 1010 to 1012 cm−3) and for controlling a plasma generator (240). Measurement of the plasma density is essential if plasma-assisted processes, such depositions or etches, are to be adequately controlled using a feedback control. Both the plasma measurement method and system generate a control voltage that in turn controls the plasma generator (240) to maintain the plasma electron density at a pre-selected value. The system utilizes a frequency stabilization system to lock the frequency of a local oscillator (100) to the resonant frequency of an open microwave resonator (245) when the resonant frequency changes due to the introduction of a plasma within the open resonator. The amplified output voltage of a second microwave discriminator may be used to control a plasma generator (240).
摘要翻译:用于测量等离子体电离密度(例如,10 10 -10 cm -3 -3)的系统和用于控制等离子体发生器(240)的系统。 如果使用反馈控制充分控制等离子体辅助过程,这种沉积或蚀刻,则等离子体密度的测量是必不可少的。 等离子体测量方法和系统都产生控制电压,该控制电压又控制等离子体发生器(240)以将等离子体电子密度维持在预选值。 当谐振频率由于在开放谐振器内引入等离子体而改变时,系统利用频率稳定系统将本地振荡器(100)的频率锁定到开放式微波谐振器(245)的谐振频率。 第二微波识别器的放大的输出电压可以用于控制等离子体发生器(240)。
摘要:
A method and system for controlling electron densities in a plasma processing system. By applying a dither voltage and a correction voltage to a voltage-controlled oscillator, electron (plasma) density of a plasma processing system (acting as an open resonator) may be measured and controlled as part of a plasma-based process.
摘要:
A method for controlling the non-uniformities of plasma-processed semiconductor wafers by supplying the plasma with two electrical signals: a primary electrical signal that is used to excite the plasma, and a supplemental electrical signal. The supplemental signal may be composed of a plurality of electrical signals, each with a frequency harmonic to that of the primary signal. The phase of the supplemental signal is controlled with respect to the phase of the primary signal. By adjusting the parameters of the supplemental signal with respect to the primary signal, the user can control the parameters of the resultant plasma and, therefore, control the non-uniformities induced in the semiconductor wafer.
摘要:
A method and system for using transmission spectroscopy to measure a temperature of a substrate (135). By passing light through a substrate, the temperature of the substrate can be determined using the band-edge characteristics of the wafer. This in-situ method and system can be used as a feedback control in combination with a variable temperature substrate holder (182) to more accurately control the processing conditions of the substrate. By utilizing a multiplicity of measurement sites the variation of the temperature across the substrate (135) can also be measured.
摘要:
A plasma processing system includes an automated electrode retention mechanism (130) for providing automated engagement of a source electrode (152) with a drive electrode (154). In addition, an automated electrode handling system (320) is provided that has the ability to remove a source electrode (152) from the electrode retention mechanism and replace it with a second source electrode (152′) that is stored in a staging area (340) outside the plasma processing system vacuum chamber. The system may operate automatically under program control of a computer system (200) coupled thereto.
摘要:
A system for measuring plasma electron densities (e.g., in the range of 1010 to 1012 cm−3) and for controlling a plasma generator. Measurement of the plasma electron density is used as part of a feedback control in plasma-assisted processes, such as depositions or etches. Both the plasma measurement method and system generate a control voltage that in turn controls the plasma generator. A programmable frequency source sequentially excites a number of the resonant modes of an open resonator placed within the plasma processing apparatus. The resonant frequencies of the resonant modes depend on the plasma electron density in the space between the reflectors of the open resonator. The apparatus automatically determines the increase in the resonant frequency of an arbitrarily chosen resonant mode of the open resonator due to the introduction of a plasma and compares that measured frequency to data previously entered. The comparison is by any one of (1) dedicated circuitry, (2) a digital signal processor, and (3) a specially programmed general purpose computer. The comparator calculates a control signal which is used to modify the power output of the plasma generator as necessary to achieve the desired plasma electron density.
摘要:
A method and system for measuring at least one of a plasma density and an electron density (e.g., in a range of 1010 to 1012 electrons/cm−3) using plasma induced changes in the frequency of a microwave oscillator. Measurement of at least one of the plasma density and the electron density enables plasma-assisted processes, such as depositions or etches, to be controlled using a feedback control. Both the measurement method and system generate a control voltage that in turn controls a plasma generator to maintain at least one of the plasma density and the electron density at a pre-selected value.
摘要翻译:使用等离子体引起的微波振荡器的频率变化来测量等离子体密度和电子密度(例如,在1010至1012电子/ cm -3)的范围中的至少一个的方法和系统。 测量等离子体密度和电子密度中的至少一个使得能够使用反馈控制来控制诸如沉积或蚀刻的等离子体辅助处理。 测量方法和系统都产生控制电压,该控制电压又控制等离子体发生器以将等离子体密度和电子密度中的至少一个保持在预选值。
摘要:
Means and method including a novel waveguide sample holder for applying traveling microwaves to heat thin low-resistivity semiconductor ribbons and wafers without a susceptor. Traveling microwaves are applied to the semiconductor materials, both with and without a traveling wave resonator. Efficient coupling is obtained by unique placement of the samples in the waveguide.
摘要:
A method and apparatus for generating and controlling a plasma (130) formed in a capacitively coupled plasma system (100) having a plasma electrode (140) and a bias electrode in the form of a workpiece support member (170), wherein the plasma electrode is unitary and has multiple regions (Ri) defined by a plurality of RF power feed lines (156) and the RF power delivered thereto. The electrode regions may also be defined as electrode segments (420) separated by insulators (426). A set of process parameters A={n, τi, Φi, Pi, S; Li} is defined; wherein n is the number of RF feed lines connected to the electrode upper surface at locations Li, τi is the on-time of the RF power for the ith RF feed line, Φi is the phase of the ith RF feed line relative to a select one of the other RF feed lines, Pi is the RF power delivered to the electrode through the ith RF feed line at location Li, and S is the sequencing of RF power to the electrode through the RF feed lines. One or more of these parameters are adjusted so that operation of the plasma system results in a workpiece (176) being processed with a desired amount or degree of process uniformity.
摘要翻译:一种用于产生和控制形成在电容耦合等离子体系统(100)中的等离子体(130)的方法和装置,其具有工件支撑构件(170)形式的等离子体电极(140)和偏置电极,其中等离子体电极 是单一的并且具有由多个RF馈电线(156)限定的多个区域(RF)和传递给其的RF功率。 电极区域也可以被定义为由绝缘体(426)分离的电极段(420)。 一组过程参数A = {n,τi,i,P i, 被定义; 其中n是在位置L i1处连接到电极上表面的RF馈送线的数量,τi是针对i 是相对于其他RF馈线中选择的一个RF馈线的第i个RF馈线的相位,P < SUB> i SUB>是通过位置L i i处的第i个RF馈线传送到电极的RF功率,S是RF功率到 电极通过RF馈线。 调整这些参数中的一个或多个,使得等离子体系统的操作导致以期望的量或程度的均匀度处理工件(176)。