公开(公告)号：US10735683B1

公开(公告)日：2020-08-04

申请号：US16378913

申请日：2019-04-09

Applicant: Obsidian Sensors, Inc.

Inventor： Lester Joseph Kozlowski

IPC: H04N5/374 ,  H04N5/357 ,  H04N5/378 ,  H04N9/04 ,  H01L27/146 ,  H03M1/00 ,  H03M1/12 ,  H04N5/3745

Abstract: A low-power image sensor includes a plurality of light-sensitive pixel cells, a plurality of analog-to-digital converters (ADCs) and image processing circuitry. The image sensor can be disposed in multiple semiconductor layers such that the pixel cells are disposed in a first layer and various other components are disposed in the second layer or between the first layer and the second layer. The image sensor is configured such that the analog output of a pixel cell is sampled by a first ADC and a second ADC within respective first and second dynamic ranges, the second dynamic range being greater than the first dynamic range. The first ADC and the second ADC sample the analog output with different sampling resolutions. The digital outputs of the first ADC and the second ADC are subsequently used by an image processor to generate a pixel value for an image frame.

公开(公告)号：US10150667B2

公开(公告)日：2018-12-11

申请号：US15431725

申请日：2017-02-13

Applicant: OBSIDIAN SENSORS, INC.

Inventor： Yaoling Pan ,  Omar Bchir

IPC: B81B7/00 ,  B81C1/00

Abstract: Conventional package for integration of MEMS and electronics suffer from profiles that are undesirably high to due to the thickness of the glass. Also in conventional package manufacturing, the MEMS and electronic devices are first individualized, and the individualized MEMS and electronics are combined into a package, and thus can be costly. To address these and other disadvantages, a panel level packaging is proposed. In this proposal, plural MEMS devices are integrated with plural semiconductor devices at a panel level, and the panel is then individualized into separate packages.

公开(公告)号：US20180230004A1

公开(公告)日：2018-08-16

申请号：US15431725

申请日：2017-02-13

Applicant: OBSIDIAN SENSORS, INC.

Inventor： Yaoling PAN ,  Omar BCHIR

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/008 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00214 ,  B81C2201/05 ,  B81C2203/0792 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2224/45099

Abstract: Conventional package for integration of MEMS and electronics suffer from profiles that are undesirably high to due to the thickness of the glass. Also in conventional package manufacturing, the MEMS and electronic devices are first individualized, and the individualized MEMS and electronics are combined into a package, and thus can be costly. To address these and other disadvantages, a panel level packaging is proposed. In this proposal, plural MEMS devices are integrated with plural semiconductor devices at a panel level, and the panel is then individualized into separate packages.

公开(公告)号：US20230288258A1

公开(公告)日：2023-09-14

申请号：US18121446

申请日：2023-03-14

Applicant: Obsidian Sensors, Inc.

Inventor： John HONG ,  Bing WEN ,  Sean ANDREWS ,  Heesun SHIN ,  Edward CHAN ,  Tallis CHANG ,  Ming YING

IPC: G01J3/45 ,  G01J3/02

CPC classification number: G01J3/45 ,  G01J3/0297 ,  G02B6/2935

Abstract: Systems and methods for spectrometry are disclosed. In some embodiments, the system comprises a Fourier Transform Spectrometer (FTS) comprising a waveguide and a delay element. In some embodiments, the method comprises determining a power spectral density of an input optical signal via the FTS.

公开(公告)号：US11685649B2

公开(公告)日：2023-06-27

申请号：US16982519

申请日：2019-03-20

Applicant: Obsidian Sensors, Inc.

Inventor： John Hong ,  Tallis Chang ,  Edward Chan ,  Bing Wen ,  Yaoling Pan ,  Kenji Nomura

IPC: B81C1/00 ,  B81B7/00 ,  G01J5/20

CPC classification number: B81C1/00269 ,  B81B7/0038 ,  B81C1/00285 ,  B81C2203/019 ,  B81C2203/0118 ,  B81C2203/035 ,  B81C2203/05 ,  G01J5/20

Abstract: A method of manufacturing MEMS housings includes: providing glass spacers; providing a window plate; attaching the window plate to the glass spacers; aligning the glass spacers with a device glass plate having MEMS devices thereon; bonding the glass spacers to the device glass plate; and singulating the glass spacers, window plate, and device glass plate to produce the MEMS housings.

公开(公告)号：US20240379694A1

公开(公告)日：2024-11-14

申请号：US18689802

申请日：2022-09-07

Applicant: OBSIDIAN SENSORS, INC.

Inventor： Heesun SHIN ,  Bing WEN ,  Edward CHAN ,  Sean ANDREWS ,  Tallis CHANG ,  John HONG

IPC: H01L27/146

Abstract: Electronic devices comprising pixels for sensing, methods for operating the electronic devices, and methods for manufacturing the electronic devices are disclosed. In some embodiments, the electronic devices comprise hinges for supporting the pixels. In some embodiments, the electronic devices are configured to provide a bias voltage to the pixels.

公开(公告)号：US20230236067A1

公开(公告)日：2023-07-27

申请号：US18097138

申请日：2023-01-13

Applicant: Obsidian Sensors, Inc.

Inventor： Edward CHAN ,  Bing WEN ,  John HONG ,  Tallis CHANG ,  Seung-Tak RYU

IPC: G01J5/24 ,  G01J1/42 ,  G01J1/46 ,  G01J5/02 ,  H04N5/33

CPC classification number: G01J5/24 ,  G01J1/4228 ,  G01J1/46 ,  G01J5/024 ,  H04N5/33 ,  G01J2001/444

Abstract: Methods of sensor readout and calibration and circuits for performing the methods are disclosed. In some embodiments, the methods include driving an active sensor at a voltage. In some embodiments, the methods include use of a calibration sensor, and the circuits include the calibration sensor. In some embodiments, the methods include use of a calibration current source and circuits include the calibration current source. In some embodiments, a sensor circuit includes a Sigma-Delta ADC. In some embodiments, a column of sensors is readout using first and second readout circuits during a same row time.

公开(公告)号：US20230061174A1

公开(公告)日：2023-03-02

申请号：US17896978

申请日：2022-08-26

Applicant: Obsidian Sensors, Inc.

Inventor： John HONG ,  Tallis CHANG ,  Bing WEN ,  Edward CHAN ,  Sean ANDREWS ,  Heesun SHIN

IPC: B81B7/02 ,  B81C1/00

Abstract: Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge. In some embodiments, the MEMS devices comprise a charge transfer circuit for providing the amount of charge.

公开(公告)号：US11284031B1

公开(公告)日：2022-03-22

申请号：US16983982

申请日：2020-08-03

Applicant: Obsidian Sensors, Inc.

Inventor： Lester Joseph Kozlowski

IPC: H04N5/374 ,  H04N5/357 ,  H04N9/04 ,  H01L27/146 ,  H03M1/00 ,  H04N5/3745

Abstract: A low-power image sensor includes a plurality of light-sensitive pixel cells, a plurality of analog-to-digital converters (ADCs) and image processing circuitry. The image sensor can be disposed in multiple semiconductor layers such that the pixel cells are disposed in a first layer and various other components are disposed in the second layer or between the first layer and the second layer. The image sensor is configured such that the analog output of a pixel cell is sampled by a first ADC and a second ADC within respective first and second dynamic ranges, the second dynamic range being greater than the first dynamic range. The first ADC and the second ADC sample the analog output with different sampling resolutions. The digital outputs of the first ADC and the second ADC are subsequently used by an image processor to generate a pixel value for an image frame.

公开(公告)号：US11282760B2

公开(公告)日：2022-03-22

申请号：US16660664

申请日：2019-10-22

Applicant: Obsidian Sensors, Inc.

Inventor： Yaoling Pan ,  Tallis Young Chang ,  John Hyunchul Hong

IPC: H01L23/31 ,  B81C1/00 ,  B81B7/00 ,  H01L21/56 ,  H01L21/683 ,  H01L21/768 ,  H01L23/522 ,  H01L23/528 ,  H01L27/12 ,  H01L33/52 ,  H01L33/62 ,  H01L51/00 ,  H01L51/52 ,  H01L51/56

Abstract: This disclosure provides devices and methods for 3-D device packaging with backside interconnections. One or more device elements can be hermetically sealed from an ambient environment, such as by vacuum lamination and bonding. One or more via connections provide electrical interconnection from a device element to a back side of a device substrate, and provide electrical interconnection from the device substrate to external circuitry on the back side of the device. The external circuitry can include a printed circuit board or flex circuit. In some implementations, an electrically conductive pad is provided on the back side, which is electrically connected to at least one of the via connections. In some implementations, the one or more via connections are electrically connected to one or more electrical components or interconnections, such as a TFT or a routing line.