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公开(公告)号：US08513795B2
公开(公告)日：2013-08-20
申请号：US13337346
申请日：2011-12-27
Applicant: Ping-Lin Yang , Sa-Lly Liu , Chien-Min Lin
Inventor： Ping-Lin Yang , Sa-Lly Liu , Chien-Min Lin
IPC: H01L23/02
CPC classification number: H01L24/82 , H01L23/3677 , H01L23/48 , H01L23/5227 , H01L24/16 , H01L25/0657 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73253 , H01L2225/06517 , H01L2225/06531 , H01L2225/06551 , H01L2225/06572 , H01L2225/06589 , H01L2924/15788 , H01L2924/00 , H01L2224/05647 , H01L2924/00014
Abstract: A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face. The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies. At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die.
Abstract translation: 封装包括具有至少两个堆叠管芯的管芯堆叠，用于彼此进行非接触式通信。 堆叠的模具中的至少一个具有连接到其主面的衬底。 衬底在衬底中或衬底上具有多个导电迹线，用于向裸片传导功率并且用于从模具传导热量。 至少一个导电柱与基板的至少第一边缘上的导电迹线中的至少一个接合，用于将功率传导到至少一个管芯并且用于从至少一个管芯传导热量。
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公开(公告)号：US20130161811A1
公开(公告)日：2013-06-27
申请号：US13337346
申请日：2011-12-27
Applicant: Ping-Lin YANG , Sa-Lly LIU , Chien-Min LIN
Inventor： Ping-Lin YANG , Sa-Lly LIU , Chien-Min LIN
IPC: H01L23/498 , H01L21/50
CPC classification number: H01L24/82 , H01L23/3677 , H01L23/48 , H01L23/5227 , H01L24/16 , H01L25/0657 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73253 , H01L2225/06517 , H01L2225/06531 , H01L2225/06551 , H01L2225/06572 , H01L2225/06589 , H01L2924/15788 , H01L2924/00 , H01L2224/05647 , H01L2924/00014
Abstract: A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face. The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies. At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die.
Abstract translation: 封装包括具有至少两个堆叠管芯的管芯堆叠，用于彼此进行非接触式通信。 堆叠的模具中的至少一个具有连接到其主面的衬底。 衬底在衬底中或衬底上具有多个导电迹线，用于向裸片传导功率并且用于从模具传导热量。 至少一个导电柱与基板的至少第一边缘上的导电迹线中的至少一个接合，用于将功率传导到至少一个管芯并且用于从至少一个管芯传导热量。
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公开(公告)号：US07760009B2
公开(公告)日：2010-07-20
申请号：US12328305
申请日：2008-12-04
Applicant: Ping-Lin Yang , Hsin-Hsin Ko , Chung-Cheng Chou
Inventor： Ping-Lin Yang , Hsin-Hsin Ko , Chung-Cheng Chou
IPC: H03K3/01
CPC classification number: H03K19/0013
Abstract: A circuit includes a first power supply node at a first power supply voltage; a gated-node; and a first control device coupled between the first power supply node and the gated-node. The first control device is configured to pass the first power supply voltage to the gated-node or to disconnect the gated-node from the first power supply voltage. A second control device is coupled between the first power supply node and the gated-node. The second control device is configured to pass a gated-voltage to the gated-node or disconnect the gated-node from the gated-voltage. A voltage-drop device is coupled between the first power supply node and the gated-node, wherein the voltage-drop device is serially connected with the second control device. A negative-feedback current source is connected in parallel with the voltage-drop device. The negative-feedback current source is configured to provide a current tracking a variation of the gated-voltage at the gated-node.
Abstract translation: 电路包括第一电源电压的第一电源节点; 门控节点; 以及耦合在第一电源节点和门控节点之间的第一控制装置。 第一控制装置被配置为将第一电源电压传递到门控节点，或者将门控节点与第一电源电压断开。 第二控制装置耦合在第一电源节点和门控节点之间。 第二控制装置被配置为将门控电压传递到门控节点或将门控节点与门控电压断开。 电压降装置耦合在第一电源节点和门控节点之间，其中降压装置与第二控制装置串联连接。 负反馈电流源与降压装置并联连接。 负反馈电流源被配置为提供电流跟踪门控节点处的门控电压的变化。
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Patent Agency Ranking
公开(公告)号：US20100141330A1
公开(公告)日：2010-06-10
申请号：US12328305
申请日：2008-12-04
Applicant: Ping-Lin Yang , Hsin-Hsin Ko , Chung-Cheng Chou
Inventor： Ping-Lin Yang , Hsin-Hsin Ko , Chung-Cheng Chou
IPC: H03K3/01
CPC classification number: H03K19/0013
Abstract: A circuit includes a first power supply node at a first power supply voltage; a gated-node; and a first control device coupled between the first power supply node and the gated-node. The first control device is configured to pass the first power supply voltage to the gated-node or to disconnect the gated-node from the first power supply voltage. A second control device is coupled between the first power supply node and the gated-node. The second control device is configured to pass a gated-voltage to the gated-node or disconnect the gated-node from the gated-voltage. A voltage-drop device is coupled between the first power supply node and the gated-node, wherein the voltage-drop device is serially connected with the second control device. A negative-feedback current source is connected in parallel with the voltage-drop device. The negative-feedback current source is configured to provide a current tracking a variation of the gated-voltage at the gated-node.
Abstract translation: 电路包括第一电源电压的第一电源节点; 门控节点; 以及耦合在第一电源节点和门控节点之间的第一控制装置。 第一控制装置被配置为将第一电源电压传递到门控节点，或者将门控节点与第一电源电压断开。 第二控制装置耦合在第一电源节点和门控节点之间。 第二控制装置被配置为将门控电压传递到门控节点或将门控节点与门控电压断开。 电压降装置耦合在第一电源节点和门控节点之间，其中降压装置与第二控制装置串联连接。 负反馈电流源与降压装置并联连接。 负反馈电流源被配置为提供电流跟踪门控节点处的门控电压的变化。
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公开(公告)号：US08760255B2
公开(公告)日：2014-06-24
申请号：US13206584
申请日：2011-08-10
Applicant: Ping-Lin Yang , Jun-De Jin , Fu-Lung Hsueh , Sa-Lly Liu , Tong-Chern Ong , Chun-Jung Lin , Ya-Chen Kao
Inventor： Ping-Lin Yang , Jun-De Jin , Fu-Lung Hsueh , Sa-Lly Liu , Tong-Chern Ong , Chun-Jung Lin , Ya-Chen Kao
IPC: H01F5/00
CPC classification number: H01L25/0657 , H01F5/00 , H01F27/2804 , H01F41/046 , H01F2027/2809 , H01L23/48 , H01L23/5227 , H01L2225/06531 , H01L2924/0002 , Y10T29/4902 , H01L2924/00
Abstract: A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils.
Abstract translation: 通信结构包括具有第一线圈的第一半导体衬底和在第一半导体衬底上方具有第二线圈的第二半导体衬底。 第一和第二线圈的内边缘限定在第一线圈下方延伸并在第二线圈之上的体积的边界。 铁磁芯至少部分地位于边界内，使得在第一和第二线圈之间提供互感以在第一和第二线圈之间无线地传输信号或电力。
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公开(公告)号：US08560997B1
公开(公告)日：2013-10-15
申请号：US13557578
申请日：2012-07-25
Applicant: Ping-Lin Yang , Ming-Zhang Kuo , Cheng-Chung Lin , Jimmy Hsiao , Jia-Rong Hsu
Inventor： Ping-Lin Yang , Ming-Zhang Kuo , Cheng-Chung Lin , Jimmy Hsiao , Jia-Rong Hsu
IPC: G06F17/50
CPC classification number: G06F17/5072
Abstract: Among other things, one or more techniques for conditional cell placement are provided herein. In an embodiment, a conditional boundary is created for a first cell. For example, the conditional boundary enables the first cell to be placed relative to a second cell based on a conditional placement rule. In an embodiment, the first cell is placed in a first manner relative to the second cell based in a first scenario. In a second scenario, different than the first scenario, the first cell is placed in a second manner relative to the second cell. In this manner, conditional cell placement is provided, thus providing flexibility and improved layout efficiency with regard to semiconductor fabrication, for example.
Abstract translation: 其中还提供了一种或多种用于条件单元放置的技术。 在一个实施例中，为第一小区创建条件边界。 例如，条件边界使得能够基于条件放置规则相对于第二单元放置第一单元。 在一个实施例中，基于第一情况，第一小区相对于第二小区以第一方式放置。 在第二种情况下，与第一种情况不同，第一单元相对于第二单元以第二种方式放置。 以这种方式，提供条件单元布置，从而提供例如关于半导体制造的灵活性和改进的布局效率。
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公开(公告)号：US20110080201A1
公开(公告)日：2011-04-07
申请号：US12574998
申请日：2009-10-07
Applicant: Ping-Lin Yang , Yi-Tzu Chen
Inventor： Ping-Lin Yang , Yi-Tzu Chen
IPC: H03K5/04
CPC classification number: H03K7/08
Abstract: A pulse width timing includes a first complementary resistor-capacitor (RC) circuit having an input for receiving an input signal, and a second complementary RC circuit coupled to an output of the first complementary RC circuit, wherein the first and second complementary RC circuits cooperate to produce an output signal based on the input signal, the output signal being delayed and having an adjusted pulse width with respect to the input signal.
Abstract translation: 脉冲宽度定时包括具有用于接收输入信号的输入的第一互补电阻器 - 电容器（RC）电路和耦合到第一互补RC电路的输出的第二互补RC电路，其中第一和第二互补RC电路配合 为了产生基于输入信号的输出信号，输出信号被延迟并且相对于输入信号具有调整的脉冲宽度。
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公开(公告)号：US20130038418A1
公开(公告)日：2013-02-14
申请号：US13206584
申请日：2011-08-10
Applicant: Ping-Lin Yang , Jun-De Jin , Fu-Lung Hsueh , Sa-Lly Liu , Tong-Chern Ong , Chun-Jung Lin , Ya-Chen Kao
Inventor： Ping-Lin Yang , Jun-De Jin , Fu-Lung Hsueh , Sa-Lly Liu , Tong-Chern Ong , Chun-Jung Lin , Ya-Chen Kao
CPC classification number: H01L25/0657 , H01F5/00 , H01F27/2804 , H01F41/046 , H01F2027/2809 , H01L23/48 , H01L23/5227 , H01L2225/06531 , H01L2924/0002 , Y10T29/4902 , H01L2924/00
Abstract: A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils.
Abstract translation: 通信结构包括具有第一线圈的第一半导体衬底和在第一半导体衬底上方具有第二线圈的第二半导体衬底。 第一和第二线圈的内边缘限定在第一线圈下方延伸并在第二线圈之上的体积的边界。 铁磁芯至少部分地位于边界内，使得在第一和第二线圈之间提供互感以在第一和第二线圈之间无线地传输信号或电力。
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