公开(公告)号：US08502112B2

公开(公告)日：2013-08-06

申请号：US12773367

申请日：2010-05-04

Applicant: Patrick J. Sercel ,  Jeffrey P. Sercel ,  Jongkook Park

Inventor： Patrick J. Sercel ,  Jeffrey P. Sercel ,  Jongkook Park

IPC: B23K26/38 ,  B23K26/06 ,  H01L21/301

CPC classification number: G03F7/70383 ,  B23K26/0608 ,  B23K26/0613 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/067 ,  B23K26/0736 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/12 ,  B23K2103/50

Abstract: A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.

Abstract translation: 使用具有变形射束输送系统的激光器形成可变散光焦点光斑。 可变散光焦点光斑可以用于切割应用，例如划刻诸如发光二极管（LED）晶片的半导体晶片。 示例性变形射束输送系统包括一系列光学部件，其有意地引入散光以产生分离成两个主经线（即垂直和水平）的焦点。 像散焦点导致了一个不对称但是集中的束斑，其包括锋利的前缘和后缘。 调整散光焦点会改变压缩光束斑点的长宽比，从而可以调节目标处的能量密度，而不影响激光输出功率。 用适当优化的能量和功率密度划分晶片可以提高划线速度，同时最大限度地减少过热和附带材料损坏。

公开(公告)号：US08378258B2

公开(公告)日：2013-02-19

申请号：US11195348

申请日：2005-08-02

Applicant: Patrick J. Sercel ,  Jeffrey P. Sercel

Inventor： Patrick J. Sercel ,  Jeffrey P. Sercel

IPC: B23K26/40

CPC classification number: B23K26/0732 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/0738 ,  B23K26/0823 ,  B23K26/38 ,  B23K2101/04 ,  B23K2103/42 ,  B23K2103/50

Abstract: A laser machining system and method uses a shaped laser beam, such as a long, narrow beam, and effectively scans the beam in the narrow direction across a mask having an aperture pattern. The pattern on the mask is imaged onto a moving workpiece and the patterned laser beam selectively removes material from the workpiece. The workpiece may be moved using a coordinated synchronized rotational motion. The laser may use a longer wavelength (e.g., 248 nm) and the beam may be scanned at a high rate of speed to reduce the dissipation of the residual thermal energy in the material being machined. In one embodiment, this system and method may be used to machine a complex pattern into a curved surface with relatively high resolution and high speeds.

Abstract translation: 激光加工系统和方法使用诸如长的窄光束的成形激光束，并且有效地沿着窄方向扫描具有孔径图案的掩模的光束。 掩模上的图案被成像到移动的工件上，并且图案化的激光束选择性地从工件中去除材料。 可以使用协调的同步旋转运动来移动工件。 激光器可以使用更长的波长（例如，248nm），并且可以以高速率扫描光束，以减少被加工材料中剩余热能的耗散。 在一个实施例中，该系统和方法可用于将复杂图案加工成具有相对高分辨率和高速度的曲面。

公开(公告)号：US20100301027A1

公开(公告)日：2010-12-02

申请号：US12773367

申请日：2010-05-04

Applicant: Patrick J. Sercel ,  Jeffrey P. Sercel ,  Jongkook Park

Inventor： Patrick J. Sercel ,  Jeffrey P. Sercel ,  Jongkook Park

IPC: B23K26/00

CPC classification number: G03F7/70383 ,  B23K26/0608 ,  B23K26/0613 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/067 ,  B23K26/0736 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/12 ,  B23K2103/50

Abstract: A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.

Abstract translation: 使用具有变形射束输送系统的激光器形成可变散光焦点光斑。 可变散光焦点光斑可以用于切割应用，例如划刻诸如发光二极管（LED）晶片的半导体晶片。 示例性变形射束输送系统包括一系列光学部件，其有意地引入散光以产生分离成两个主经线（即垂直和水平）的焦点。 像散焦点导致了一个不对称但是集中的束斑，其包括锋利的前缘和后缘。 调整散光焦点会改变压缩光束斑点的长宽比，从而可以调节目标处的能量密度，而不影响激光输出功率。 用适当优化的能量和功率密度划分晶片可以提高划线速度，同时最大限度地减少过热和附带材料损坏。

公开(公告)号：US07388172B2

公开(公告)日：2008-06-17

申请号：US10782741

申请日：2004-02-19

Applicant: Patrick J. Sercel ,  Jeffrey P. Sercel ,  Jongkook Park

Inventor： Patrick J. Sercel ,  Jeffrey P. Sercel ,  Jongkook Park

IPC: B23K26/00

CPC classification number: G03F7/70383 ,  B23K26/0608 ,  B23K26/0613 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/067 ,  B23K26/0736 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/12 ,  B23K2103/50

Abstract: A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.

Abstract translation: 使用具有变形射束输送系统的激光器形成可变散光焦点光斑。 可变散光焦点光斑可以用于切割应用，例如划刻诸如发光二极管（LED）晶片的半导体晶片。 示例性变形射束输送系统包括一系列光学部件，其有意地引入散光以产生分离成两个主经线（即垂直和水平）的焦点。 像散焦点导致了一个不对称但是集中的束斑，其包括锋利的前缘和后缘。 调整散光焦点会改变压缩光束斑点的长宽比，从而可以调节目标处的能量密度，而不影响激光输出功率。 用适当优化的能量和功率密度划分晶片可以提高划线速度，同时最大限度地减少过热和附带材料损坏。

公开(公告)号：US20070298587A1

公开(公告)日：2007-12-27

申请号：US11762336

申请日：2007-06-13

Applicant: Jongkook Park ,  Jeffrey Sercel ,  Patrick Sercel

Inventor： Jongkook Park ,  Jeffrey Sercel ,  Patrick Sercel

IPC: H01L29/22 ,  H01L21/30

CPC classification number: H01L21/268 ,  B23K26/0732 ,  B23K26/0838 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2101/40 ,  B23K2103/172 ,  H01L21/78 ,  H01L21/7806 ,  H01L33/0079 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.

Abstract translation: 剥离过程用于通过照射材料层和基底之间的界面来分离材料层与基底。 根据一个示例性工艺，该层被分离成与衬底上的管芯对应的多个部分，并且均匀的束斑被成形为覆盖整数个部分。

公开(公告)号：US07846847B2

公开(公告)日：2010-12-07

申请号：US11762336

申请日：2007-06-13

Applicant: Jongkook Park ,  Jeffrey P. Sercel ,  Patrick J. Sercel

Inventor： Jongkook Park ,  Jeffrey P. Sercel ,  Patrick J. Sercel

IPC: H01L21/302 ,  H01L21/461

CPC classification number: H01L21/268 ,  B23K26/0732 ,  B23K26/0838 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2101/40 ,  B23K2103/172 ,  H01L21/78 ,  H01L21/7806 ,  H01L33/0079 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.

Abstract translation: 剥离过程用于通过照射材料层和基底之间的界面来分离材料层与基底。 根据一个示例性工艺，该层被分离成与衬底上的管芯对应的多个部分，并且均匀的束斑被成形为覆盖整数个部分。

公开(公告)号：US07241667B2

公开(公告)日：2007-07-10

申请号：US11215248

申请日：2005-08-30

Applicant: Jongkook Park ,  Jeffrey P. Sercel ,  Patrick J. Sercel

Inventor： Jongkook Park ,  Jeffrey P. Sercel ,  Patrick J. Sercel

IPC: H01L21/20 ,  B23K26/00

CPC classification number: H01L21/268 ,  B23K26/0732 ,  B23K26/0838 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2101/40 ,  B23K2103/172 ,  H01L21/78 ,  H01L21/7806 ,  H01L33/0079 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.

Abstract translation: 剥离过程用于通过照射材料层和基底之间的界面来分离材料层与基底。 根据一个示例性工艺，该层被分离成与衬底上的管芯对应的多个部分，并且均匀的束斑被成形为覆盖整数个部分。

公开(公告)号：US20060003553A1

公开(公告)日：2006-01-05

申请号：US11215248

申请日：2005-08-30

Applicant: Jongkook Park ,  Jeffrey Sercel ,  Patrick Sercel

Inventor： Jongkook Park ,  Jeffrey Sercel ,  Patrick Sercel

IPC: H01L21/301 ,  H01L21/46 ,  H01L21/78

CPC classification number: H01L21/268 ,  B23K26/0732 ,  B23K26/0838 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2101/40 ,  B23K2103/172 ,  H01L21/78 ,  H01L21/7806 ,  H01L33/0079 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.

Abstract translation: 剥离过程用于通过照射材料层和基底之间的界面来分离材料层与基底。 根据一个示例性工艺，该层被分离成与衬底上的管芯对应的多个部分，并且均匀的束斑被成形为覆盖整数个部分。

公开(公告)号：US20090127240A1

公开(公告)日：2009-05-21

申请号：US12125439

申请日：2008-05-22

Applicant: Patrick J. Sercel ,  Jeffrey P. Sercel

Inventor： Patrick J. Sercel ,  Jeffrey P. Sercel

IPC: B23K26/00

CPC classification number: B23K26/364 ,  A61F9/00802 ,  A61F9/00817 ,  A61F9/009 ,  A61F2009/00872 ,  A61F2009/00897 ,  B23K26/066 ,  B23K26/0823 ,  B23K2103/42 ,  B23K2103/50

Abstract: A system and method of laser machining rotates a workpiece about an axis of rotation, and translates the workpiece in a first direction along the axis of rotation. A mask defining a shape is translated in a second direction opposite the first direction, and a laser beam is directed at the mask such that the laser beam is scanned across the mask and at least a portion of the laser beam passes through the mask and toward the workpiece. The mask and the workpiece are translated with coordinating opposing motion to cause the laser beam to be imaged onto the workpiece with a shape or pattern corresponding to a shape or pattern defined by the mask. Rotation of the workpiece and the shape of the image on the workpiece produce different vectorial intensities such that material of the workpiece is removed to different respective depths to form a three-dimensional structure.

Abstract translation: 激光加工的系统和方法围绕旋转轴旋转工件，并且沿着旋转轴线沿第一方向平移工件。 限定形状的掩模在与第一方向相反的第二方向上平移，并且激光束被引导到掩模，使得激光束跨过掩模扫描，并且激光束的至少一部分穿过掩模并朝向 工件。 掩模和工件以协调的相对运动平移，使得激光束以对应于由掩模限定的形状或图案的形状或图案成像到工件上。 工件的旋转和图像在工件上的形状产生不同的矢量强度，使得工件的材料被移除到不同的相应深度以形成三维结构。

公开(公告)号：US07202141B2

公开(公告)日：2007-04-10

申请号：US11008589

申请日：2004-12-09

Applicant: Jongkook Park ,  Jeffrey P. Sercel ,  Patrick J. Sercel

Inventor： Jongkook Park ,  Jeffrey P. Sercel ,  Patrick J. Sercel

IPC: H01L29/22 ,  H01L21/30 ,  H01L21/46

CPC classification number: H01L21/268 ,  B23K26/0732 ,  B23K26/0838 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2101/40 ,  B23K2103/172 ,  H01L21/78 ,  H01L21/7806 ,  H01L33/0079 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.