-
1.发明授权Multi-zoned plasma processing electrostatic chuck with improved temperature uniformity 有权多区域等离子处理静电卡盘具有改善的温度均匀性公开(公告)号：US09248509B2
公开(公告)日：2016-02-02
申请号：US14447557
申请日：2014-07-30
Applicant: Hamid Tavassoli , Surajit Kumar , Kallol Bera , Xiaoping Zhou , Shane C. Nevil , Douglas A. Buchberger, Jr.
Inventor： Hamid Tavassoli , Surajit Kumar , Kallol Bera , Xiaoping Zhou , Shane C. Nevil , Douglas A. Buchberger, Jr.
CPC classification number: B23B31/28 , B23B2231/24 , B23Q3/15 , H01L21/67069 , H01L21/6833 , H05H1/46 , Y10T279/23
Abstract: An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.
Abstract translation: 一种静电卡盘组件，包括具有顶表面以支撑工件的电介质层。 布置在电介质层下方的冷却通道底座包括设置在顶表面的内部下方的多个内部流体导管，以及设置在顶部表面外部的多个外部流体导管。 卡盘组件包括设置在内部和外部流体管道之间的冷却通道底部内的热断裂。 卡盘组件包括布置在冷却通道底部和底板下方的流体分配板，用于将从公共输入端输送的传热流体分配到每个内部或外部流体导管。 内部输入歧管的分支可以具有基本相等的流体电导。
-
2.发明申请MULTI-ZONED PLASMA PROCESSING ELECTROSTATIC CHUCK WITH IMPROVED TEMPERATURE UNIFORMITY 审中-公开具有改进温度均匀性的多区等离子体处理静电卡公开(公告)号：US20140346743A1
公开(公告)日：2014-11-27
申请号：US14447557
申请日：2014-07-30
Applicant: Hamid Tavassoli , Surajit Kumar , Kallol Bera , Xiaoping Zhou , Shane C. Nevil , Douglas A. Buchberger, JR.
Inventor： Hamid Tavassoli , Surajit Kumar , Kallol Bera , Xiaoping Zhou , Shane C. Nevil , Douglas A. Buchberger, JR.
CPC classification number: B23B31/28 , B23B2231/24 , B23Q3/15 , H01L21/67069 , H01L21/6833 , H05H1/46 , Y10T279/23
Abstract: An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.
Abstract translation: 一种静电卡盘组件，包括具有顶表面以支撑工件的电介质层。 布置在电介质层下方的冷却通道底座包括设置在顶表面的内部下方的多个内部流体导管，以及设置在顶部表面的外部部分下方的多个外部流体导管。 卡盘组件包括设置在内部和外部流体管道之间的冷却通道底部内的热断裂。 卡盘组件包括布置在冷却通道底部和底板下方的流体分配板，用于将从公共输入端输送的传热流体分配到每个内部或外部流体导管。 内部输入歧管的分支可以具有基本相等的流体电导。
-
3.发明申请MULTI-ZONED PLASMA PROCESSING ELECTROSTATIC CHUCK WITH IMPROVED TEMPERATURE UNIFORMITY 有权具有改进温度均匀性的多区等离子体处理静电卡公开(公告)号：US20120091104A1
公开(公告)日：2012-04-19
申请号：US13081412
申请日：2011-04-06
Applicant: Hamid Tavassoli , Surajit KUMAR , Kallol Bera , Xiaoping Zhou , Shane C. Nevil , Douglas A. Buchberger, JR.
Inventor： Hamid Tavassoli , Surajit KUMAR , Kallol Bera , Xiaoping Zhou , Shane C. Nevil , Douglas A. Buchberger, JR.
CPC classification number: B23B31/28 , B23B2231/24 , B23Q3/15 , H01L21/67069 , H01L21/6833 , H05H1/46 , Y10T279/23
Abstract: An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.
Abstract translation: 一种静电卡盘组件，包括具有顶表面以支撑工件的电介质层。 布置在电介质层下方的冷却通道底座包括设置在顶表面的内部下方的多个内部流体导管，以及设置在顶部表面的外部部分下方的多个外部流体导管。 卡盘组件包括设置在内部和外部流体管道之间的冷却通道底部内的热断裂。 卡盘组件包括布置在冷却通道底部和底板下方的流体分配板，用于将从公共输入端输送的传热流体分配到每个内部或外部流体导管。 内部输入歧管的分支可以具有基本相等的流体电导。
-
Patent Agency Ranking
4.发明申请ASSEMBLY FOR DELIVERING RF POWER AND DC VOLTAGE TO A PLASMA PROCESSING CHAMBER 有权用于将RF功率和直流电压传送到等离子体处理室的组件公开(公告)号：US20110297650A1
公开(公告)日：2011-12-08
申请号：US13085070
申请日：2011-04-12
Applicant: Hamid Tavassoli , Surajit Kumar , Shane C. Nevil , Douglas A. Buchberger, JR.
Inventor： Hamid Tavassoli , Surajit Kumar , Shane C. Nevil , Douglas A. Buchberger, JR.
CPC classification number: H01L21/67109 , H01L21/6831 , H01L21/68792
Abstract: A triaxial rod assembly for providing both RF power and DC voltage to a chuck assembly that supports a workpiece in a processing chamber during a manufacturing operation. In embodiments, a rod assembly includes a center conductor to be coupled to a chuck electrode for providing DC voltage to clamp a workpiece. Concentrically surrounding the center conductor is an annular RF transmission line to be coupled to an RF powered base to provide RF power to the chuck assembly. An insulator is disposed between the center conductor and RF transmission line. Concentrically surrounding the RF transmission line is a ground plane conductor coupled to a grounded base of the chuck to provide a reference voltage relative to the DC voltage. An insulator is disposed between the RF transmission line and the ground plane conductor.
Abstract translation: 一种三轴杆组件，用于在制造操作期间向卡盘组件提供RF功率和DC电压，该卡盘组件在处理室中支撑工件。 在实施例中，杆组件包括要耦合到卡盘电极的中心导体，用于提供直流电压以夹紧工件。 集中地围绕中心导体是环形RF传输线，其被耦合到RF供电底座以向卡盘组件提供RF功率。 绝缘体设置在中心导体和RF传输线之间。 围绕RF传输线的是一个接地平面导体，其耦合到卡盘的接地基座，以提供相对于直流电压的参考电压。 绝缘体设置在RF传输线和接地平面导体之间。
-
5.发明授权Multi-zoned plasma processing electrostatic chuck with improved temperature uniformity 有权多区域等离子处理静电卡盘具有改善的温度均匀性公开(公告)号：US08822876B2
公开(公告)日：2014-09-02
申请号：US13081412
申请日：2011-04-06
Applicant: Hamid Tavassoli , Surajit Kumar , Kallol Bera , Xiaoping Zhou , Shane C. Nevil , Douglas A. Buchberger, Jr.
Inventor： Hamid Tavassoli , Surajit Kumar , Kallol Bera , Xiaoping Zhou , Shane C. Nevil , Douglas A. Buchberger, Jr.
CPC classification number: B23B31/28 , B23B2231/24 , B23Q3/15 , H01L21/67069 , H01L21/6833 , H05H1/46 , Y10T279/23
Abstract: An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.
Abstract translation: 一种静电卡盘组件，包括具有顶表面以支撑工件的电介质层。 布置在电介质层下方的冷却通道底座包括设置在顶表面的内部下方的多个内部流体导管，以及设置在顶部表面的外部部分下方的多个外部流体导管。 卡盘组件包括设置在内部和外部流体管道之间的冷却通道底部内的热断裂。 卡盘组件包括设置在冷却通道底部和底板下方的流体分配板，用于将从公共输入端输送的传热流体分配到每个内部或外部流体导管。 内部输入歧管的分支可以具有基本相等的流体电导。
-
6.发明授权Assembly for delivering RF power and DC voltage to a plasma processing chamber 有权用于向等离子体处理室提供RF功率和DC电压的组件公开(公告)号：US08629370B2
公开(公告)日：2014-01-14
申请号：US13085070
申请日：2011-04-12
Applicant: Hamid Tavassoli , Surajit Kumar , Shane C. Nevil , Douglas A. Buchberger, Jr.
Inventor： Hamid Tavassoli , Surajit Kumar , Shane C. Nevil , Douglas A. Buchberger, Jr.
IPC: H05H1/46
CPC classification number: H01L21/67109 , H01L21/6831 , H01L21/68792
Abstract: A triaxial rod assembly for providing both RF power and DC voltage to a chuck assembly that supports a workpiece in a processing chamber during a manufacturing operation. In embodiments, a rod assembly includes a center conductor to be coupled to a chuck electrode for providing DC voltage to clamp a workpiece. Concentrically surrounding the center conductor is an annular RF transmission line to be coupled to an RF powered base to provide RF power to the chuck assembly. An insulator is disposed between the center conductor and RF transmission line. Concentrically surrounding the RF transmission line is a ground plane conductor coupled to a grounded base of the chuck to provide a reference voltage relative to the DC voltage. An insulator is disposed between the RF transmission line and the ground plane conductor.
Abstract translation: 一种三轴杆组件，用于在制造操作期间向卡盘组件提供RF功率和DC电压，该卡盘组件在处理室中支撑工件。 在实施例中，杆组件包括要耦合到卡盘电极的中心导体，用于提供直流电压以夹紧工件。 集中地围绕中心导体是环形RF传输线，其被耦合到RF供电底座以向卡盘组件提供RF功率。 绝缘体设置在中心导体和RF传输线之间。 集中围绕RF传输线是一个接地平面导体，其耦合到卡盘的接地基座，以提供相对于直流电压的参考电压。 绝缘体设置在RF传输线和接地平面导体之间。
-
公开(公告)号：US20110180243A1
公开(公告)日：2011-07-28
申请号：US12886255
申请日：2010-09-20
Applicant: KALLOL BERA , XIAOPING ZHOU , DOUGLAS A. BUCHBERGER, JR. , ANDREW NGUYEN , HAMID TAVASSOLI , SURAJIT KUMAR , SHAHID RAUF
Inventor： KALLOL BERA , XIAOPING ZHOU , DOUGLAS A. BUCHBERGER, JR. , ANDREW NGUYEN , HAMID TAVASSOLI , SURAJIT KUMAR , SHAHID RAUF
IPC: F28F3/12
CPC classification number: F28F3/12 , F28F2013/001
Abstract: Apparatus for controlling thermal uniformity of a substrate is provided herein. In some embodiments, the thermal uniformity of the substrate may be controlled to be more uniform. In some embodiments, the thermal uniformity of the substrate may be controlled to be non-uniform in a desired pattern. In some embodiments, an apparatus for controlling thermal uniformity of a substrate may include a substrate support having a support surface to support a substrate thereon; and a plurality of flow paths having a substantially equivalent fluid conductance disposed within the substrate support to flow a heat transfer fluid beneath the support surface.
Abstract translation: 本文提供了用于控制基板的热均匀性的装置。 在一些实施例中，可以将衬底的热均匀性控制得更均匀。 在一些实施例中，可以将所述衬底的热均匀性控制为以所需图案不均匀。 在一些实施例中，用于控制衬底的热均匀性的装置可以包括具有用于在其上支撑衬底的支撑表面的衬底支撑件; 以及多个流动路径，其具有设置在所述基板支撑件内的基本相当的流体电导，以使传热流体在所述支撑表面下方流动。
-
公开(公告)号：US09267742B2
公开(公告)日：2016-02-23
申请号：US12886255
申请日：2010-09-20
Applicant: Kallol Bera , Xiaoping Zhou , Douglas A. Buchberger, Jr. , Andrew Nguyen , Hamid Tavassoli , Surajit Kumar , Shahid Rauf
Inventor： Kallol Bera , Xiaoping Zhou , Douglas A. Buchberger, Jr. , Andrew Nguyen , Hamid Tavassoli , Surajit Kumar , Shahid Rauf
CPC classification number: F28F3/12 , F28F2013/001
Abstract: Apparatus for controlling the thermal uniformity of a substrate. In some embodiments, the thermal uniformity of the substrate is controlled to be more uniform. In some embodiments, the thermal uniformity of the substrate is controlled to be non-uniform in a desired pattern. In some embodiments, an apparatus for controlling thermal uniformity of a substrate includes a substrate support having a support surface to support a substrate thereon. A plurality of flow paths having a substantially equivalent fluid conductance are disposed within the substrate support to flow a heat transfer fluid beneath the support surface.
Abstract translation: 用于控制基板的热均匀性的装置。 在一些实施例中，将基板的热均匀性控制得更均匀。 在一些实施例中，基板的热均匀性被控制为以期望的图案不均匀。 在一些实施例中，用于控制衬底的热均匀性的装置包括具有用于在其上支撑衬底的支撑表面的衬底支撑件。 具有基本相当的流体电导的多个流动路径设置在基板支撑件内，以使传热流体在支撑表面下方流动。
-
-
-
-
-
-
-
Search Results
8
records
(took 0.01 seconds)
