公开(公告)号：US09248509B2

公开(公告)日：2016-02-02

申请号：US14447557

申请日：2014-07-30

申请人： Hamid Tavassoli ,  Surajit Kumar ,  Kallol Bera ,  Xiaoping Zhou ,  Shane C. Nevil ,  Douglas A. Buchberger, Jr.

发明人： Hamid Tavassoli ,  Surajit Kumar ,  Kallol Bera ,  Xiaoping Zhou ,  Shane C. Nevil ,  Douglas A. Buchberger, Jr.

IPC分类号： B23K10/00 ,  B23B31/28 ,  H01L21/67 ,  H01L21/683 ,  H05H1/46 ,  B23Q3/15

CPC分类号： B23B31/28 ,  B23B2231/24 ,  B23Q3/15 ,  H01L21/67069 ,  H01L21/6833 ,  H05H1/46 ,  Y10T279/23

摘要： An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.

摘要翻译： 一种静电卡盘组件，包括具有顶表面以支撑工件的电介质层。 布置在电介质层下方的冷却通道底座包括设置在顶表面的内部下方的多个内部流体导管，以及设置在顶部表面外部的多个外部流体导管。 卡盘组件包括设置在内部和外部流体管道之间的冷却通道底部内的热断裂。 卡盘组件包括布置在冷却通道底部和底板下方的流体分配板，用于将从公共输入端输送的传热流体分配到每个内部或外部流体导管。 内部输入歧管的分支可以具有基本相等的流体电导。

公开(公告)号：US20140346743A1

公开(公告)日：2014-11-27

申请号：US14447557

申请日：2014-07-30

申请人： Hamid Tavassoli ,  Surajit Kumar ,  Kallol Bera ,  Xiaoping Zhou ,  Shane C. Nevil ,  Douglas A. Buchberger, JR.

发明人： Hamid Tavassoli ,  Surajit Kumar ,  Kallol Bera ,  Xiaoping Zhou ,  Shane C. Nevil ,  Douglas A. Buchberger, JR.

IPC分类号： B23B31/28 ,  B23Q3/15

CPC分类号： B23B31/28 ,  B23B2231/24 ,  B23Q3/15 ,  H01L21/67069 ,  H01L21/6833 ,  H05H1/46 ,  Y10T279/23

摘要： An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.

摘要翻译： 一种静电卡盘组件，包括具有顶表面以支撑工件的电介质层。 布置在电介质层下方的冷却通道底座包括设置在顶表面的内部下方的多个内部流体导管，以及设置在顶部表面的外部部分下方的多个外部流体导管。 卡盘组件包括设置在内部和外部流体管道之间的冷却通道底部内的热断裂。 卡盘组件包括布置在冷却通道底部和底板下方的流体分配板，用于将从公共输入端输送的传热流体分配到每个内部或外部流体导管。 内部输入歧管的分支可以具有基本相等的流体电导。

公开(公告)号：US08822876B2

公开(公告)日：2014-09-02

申请号：US13081412

申请日：2011-04-06

申请人： Hamid Tavassoli ,  Surajit Kumar ,  Kallol Bera ,  Xiaoping Zhou ,  Shane C. Nevil ,  Douglas A. Buchberger, Jr.

发明人： Hamid Tavassoli ,  Surajit Kumar ,  Kallol Bera ,  Xiaoping Zhou ,  Shane C. Nevil ,  Douglas A. Buchberger, Jr.

IPC分类号： B23K10/00 ,  H05H1/46

CPC分类号： B23B31/28 ,  B23B2231/24 ,  B23Q3/15 ,  H01L21/67069 ,  H01L21/6833 ,  H05H1/46 ,  Y10T279/23

摘要： An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.

摘要翻译： 一种静电卡盘组件，包括具有顶表面以支撑工件的电介质层。 布置在电介质层下方的冷却通道底座包括设置在顶表面的内部下方的多个内部流体导管，以及设置在顶部表面的外部部分下方的多个外部流体导管。 卡盘组件包括设置在内部和外部流体管道之间的冷却通道底部内的热断裂。 卡盘组件包括设置在冷却通道底部和底板下方的流体分配板，用于将从公共输入端输送的传热流体分配到每个内部或外部流体导管。 内部输入歧管的分支可以具有基本相等的流体电导。

公开(公告)号：US20120091104A1

公开(公告)日：2012-04-19

申请号：US13081412

申请日：2011-04-06

申请人： Hamid Tavassoli ,  Surajit KUMAR ,  Kallol Bera ,  Xiaoping Zhou ,  Shane C. Nevil ,  Douglas A. Buchberger, JR.

发明人： Hamid Tavassoli ,  Surajit KUMAR ,  Kallol Bera ,  Xiaoping Zhou ,  Shane C. Nevil ,  Douglas A. Buchberger, JR.

IPC分类号： B23K10/00 ,  B23B31/28

CPC分类号： B23B31/28 ,  B23B2231/24 ,  B23Q3/15 ,  H01L21/67069 ,  H01L21/6833 ,  H05H1/46 ,  Y10T279/23

摘要： An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.

摘要翻译： 一种静电卡盘组件，包括具有顶表面以支撑工件的电介质层。 布置在电介质层下方的冷却通道底座包括设置在顶表面的内部下方的多个内部流体导管，以及设置在顶部表面的外部部分下方的多个外部流体导管。 卡盘组件包括设置在内部和外部流体管道之间的冷却通道底部内的热断裂。 卡盘组件包括布置在冷却通道底部和底板下方的流体分配板，用于将从公共输入端输送的传热流体分配到每个内部或外部流体导管。 内部输入歧管的分支可以具有基本相等的流体电导。

公开(公告)号：US09267742B2

公开(公告)日：2016-02-23

申请号：US12886255

申请日：2010-09-20

申请人： Kallol Bera ,  Xiaoping Zhou ,  Douglas A. Buchberger, Jr. ,  Andrew Nguyen ,  Hamid Tavassoli ,  Surajit Kumar ,  Shahid Rauf

发明人： Kallol Bera ,  Xiaoping Zhou ,  Douglas A. Buchberger, Jr. ,  Andrew Nguyen ,  Hamid Tavassoli ,  Surajit Kumar ,  Shahid Rauf

IPC分类号： F25B29/00 ,  F28F3/12 ,  F28F13/00

CPC分类号： F28F3/12 ,  F28F2013/001

摘要： Apparatus for controlling the thermal uniformity of a substrate. In some embodiments, the thermal uniformity of the substrate is controlled to be more uniform. In some embodiments, the thermal uniformity of the substrate is controlled to be non-uniform in a desired pattern. In some embodiments, an apparatus for controlling thermal uniformity of a substrate includes a substrate support having a support surface to support a substrate thereon. A plurality of flow paths having a substantially equivalent fluid conductance are disposed within the substrate support to flow a heat transfer fluid beneath the support surface.

摘要翻译： 用于控制基板的热均匀性的装置。 在一些实施例中，将基板的热均匀性控制得更均匀。 在一些实施例中，基板的热均匀性被控制为以期望的图案不均匀。 在一些实施例中，用于控制衬底的热均匀性的装置包括具有用于在其上支撑衬底的支撑表面的衬底支撑件。 具有基本相当的流体电导的多个流动路径设置在基板支撑件内，以使传热流体在支撑表面下方流动。

公开(公告)号：US08629370B2

公开(公告)日：2014-01-14

申请号：US13085070

申请日：2011-04-12

申请人： Hamid Tavassoli ,  Surajit Kumar ,  Shane C. Nevil ,  Douglas A. Buchberger, Jr.

发明人： Hamid Tavassoli ,  Surajit Kumar ,  Shane C. Nevil ,  Douglas A. Buchberger, Jr.

IPC分类号： H05H1/46

CPC分类号： H01L21/67109 ,  H01L21/6831 ,  H01L21/68792

摘要： A triaxial rod assembly for providing both RF power and DC voltage to a chuck assembly that supports a workpiece in a processing chamber during a manufacturing operation. In embodiments, a rod assembly includes a center conductor to be coupled to a chuck electrode for providing DC voltage to clamp a workpiece. Concentrically surrounding the center conductor is an annular RF transmission line to be coupled to an RF powered base to provide RF power to the chuck assembly. An insulator is disposed between the center conductor and RF transmission line. Concentrically surrounding the RF transmission line is a ground plane conductor coupled to a grounded base of the chuck to provide a reference voltage relative to the DC voltage. An insulator is disposed between the RF transmission line and the ground plane conductor.

摘要翻译： 一种三轴杆组件，用于在制造操作期间向卡盘组件提供RF功率和DC电压，该卡盘组件在处理室中支撑工件。 在实施例中，杆组件包括要耦合到卡盘电极的中心导体，用于提供直流电压以夹紧工件。 集中地围绕中心导体是环形RF传输线，其被耦合到RF供电底座以向卡盘组件提供RF功率。 绝缘体设置在中心导体和RF传输线之间。 集中围绕RF传输线是一个接地平面导体，其耦合到卡盘的接地基座，以提供相对于直流电压的参考电压。 绝缘体设置在RF传输线和接地平面导体之间。

公开(公告)号：US20110297650A1

公开(公告)日：2011-12-08

申请号：US13085070

申请日：2011-04-12

申请人： Hamid Tavassoli ,  Surajit Kumar ,  Shane C. Nevil ,  Douglas A. Buchberger, JR.

发明人： Hamid Tavassoli ,  Surajit Kumar ,  Shane C. Nevil ,  Douglas A. Buchberger, JR.

IPC分类号： B23K10/00 ,  B23B31/28

CPC分类号： H01L21/67109 ,  H01L21/6831 ,  H01L21/68792

摘要： A triaxial rod assembly for providing both RF power and DC voltage to a chuck assembly that supports a workpiece in a processing chamber during a manufacturing operation. In embodiments, a rod assembly includes a center conductor to be coupled to a chuck electrode for providing DC voltage to clamp a workpiece. Concentrically surrounding the center conductor is an annular RF transmission line to be coupled to an RF powered base to provide RF power to the chuck assembly. An insulator is disposed between the center conductor and RF transmission line. Concentrically surrounding the RF transmission line is a ground plane conductor coupled to a grounded base of the chuck to provide a reference voltage relative to the DC voltage. An insulator is disposed between the RF transmission line and the ground plane conductor.

摘要翻译： 一种三轴杆组件，用于在制造操作期间向卡盘组件提供RF功率和DC电压，该卡盘组件在处理室中支撑工件。 在实施例中，杆组件包括要耦合到卡盘电极的中心导体，用于提供直流电压以夹紧工件。 集中地围绕中心导体是环形RF传输线，其被耦合到RF供电底座以向卡盘组件提供RF功率。 绝缘体设置在中心导体和RF传输线之间。 围绕RF传输线的是一个接地平面导体，其耦合到卡盘的接地基座，以提供相对于直流电压的参考电压。 绝缘体设置在RF传输线和接地平面导体之间。

公开(公告)号：US20090159566A1

公开(公告)日：2009-06-25

申请号：US12340156

申请日：2008-12-19

申请人： Paul L. Brillhart ,  Richard Charles Fovell ,  Hamid Tavassoli ,  Xiaoping Zhou ,  Douglas A. Buchberger, JR. ,  Kallol Bera

发明人： Paul L. Brillhart ,  Richard Charles Fovell ,  Hamid Tavassoli ,  Xiaoping Zhou ,  Douglas A. Buchberger, JR. ,  Kallol Bera

IPC分类号： H01L21/306 ,  C23C16/513 ,  C23C14/22 ,  C23C14/34

CPC分类号： C23C16/4586 ,  C23C14/505

摘要： A pedestal assembly and method for controlling temperature of a substrate during processing is provided. In one embodiment, method for controlling a substrate temperature during processing includes placing a substrate on a substrate pedestal assembly in a vacuum processing chamber, controlling a temperature of the substrate pedestal assembly by flowing a heat transfer fluid through a radial flowpath within the substrate pedestal assembly, the radial flowpath including both radially inward and radially outward portions, and plasma processing the substrate on the temperature controlled substrate pedestal assembly. In another embodiment, plasma processing may be at least one of a plasma treatment, a chemical vapor deposition process, a physical vapor deposition process, an ion implantation process or an etch process, among others.

摘要翻译： 提供了一种用于在处理期间控制基板的温度的基座组件和方法。 在一个实施例中，用于在处理期间控制衬底温度的方法包括将衬底放置在真空处理室中的衬底基座组件上，通过使传热流体流过衬底基座组件内的径向流动路径来控制衬底基座组件的温度 径向流径包括径向向内和径向向外的部分，以及等离子体处理温度受控的衬底基座组件上的衬底。 在另一个实施例中，等离子体处理可以是等离子体处理，化学气相沉积工艺，物理气相沉积工艺，离子注入工艺或蚀刻工艺等中的至少一个。

公开(公告)号：US08980044B2

公开(公告)日：2015-03-17

申请号：US12855670

申请日：2010-08-12

申请人： Paul Lukas Brillhart ,  Richard Fovell ,  Hamid Tavassoli ,  Douglas A. Buchberger, Jr. ,  Douglas H. Burns ,  Kallol Bera ,  Daniel J. Hoffman ,  Kenneth W. Cowans ,  William W. Cowans ,  Glenn W. Zubillaga ,  Isaac Millan

发明人： Paul Lukas Brillhart ,  Richard Fovell ,  Hamid Tavassoli ,  Douglas A. Buchberger, Jr. ,  Douglas H. Burns ,  Kallol Bera ,  Daniel J. Hoffman ,  Kenneth W. Cowans ,  William W. Cowans ,  Glenn W. Zubillaga ,  Isaac Millan

IPC分类号： H01L21/67 ,  H01L21/683 ,  H01J37/32 ,  F25B49/02 ,  C23C16/46 ,  C23C16/50 ,  C23C16/503 ,  C23C16/52 ,  H01L21/3065 ,  H05H1/46

CPC分类号： H01L21/67248 ,  F25B49/02 ,  F25B2400/0401 ,  F25B2400/0403 ,  F25B2400/0411 ,  F25B2700/21174 ,  F25B2700/21175 ,  H01J37/32091 ,  H01J37/32183 ,  H01J37/32724 ,  H01J2237/2001 ,  H01L21/67069 ,  H01L21/67109 ,  H01L21/6831 ,  H05H2001/4682

摘要： A plasma reactor having a reactor chamber and an electrostatic chuck having a surface for holding a workpiece inside the chamber includes inner and outer zone backside gas pressure sources coupled to the electrostatic chuck for applying a thermally conductive gas under respective pressures to respective inner and outer zones of a workpiece-surface interface formed whenever a workpiece is held on the surface, and inner and outer evaporators inside respective inner and outer zones of the electrostatic chuck and a refrigeration loop having respective inner and cuter expansion valves for controlling flow of coolant through the inner and outer evaporators respectively. The reactor further includes inner and outer zone temperature sensors in inner and outer zones of the electrostatic chuck and a thermal model capable of simulating heat transfer through the inner and outer zones, respectively, between the evaporator and the surface based upon measurements from the inner and outer temperature sensors, respectively. Inner and outer zone agile control processors coupled to the thermal model govern the inner and outer zone backside gas pressure sources, respectively, in response to predictions from the model of changes in the respective pressures that would bring the temperatures measured by the inner and outer zone sensors, respectively, closer to a desired temperature.

摘要翻译： 具有反应室和具有用于将工件保持在室内的表面的静电卡盘的等离子体反应器包括耦合到静电卡盘的内部和外部区域背侧气体压力源，用于将相应压力下的导热气体施加到相应的内部和外部区域 每当工件保持在表面上时形成的工件表面界面，以及静电卡盘的内部和外部区域内的内部和外部蒸发器，以及具有各自的内部和切割器膨胀阀的制冷回路，用于控制冷却剂通过内部 和外部蒸发器。 反应器还包括静电卡盘的内部和外部区域中的内部和外部区域温度传感器以及能够模拟通过蒸发器和表面之间的内部和外部区域的热传递的热模型，其基于来自内部和 外部温度传感器。 耦合到热模型的内部和外部区域敏捷控制处理器分别响应于来自模型的各个压力的变化的预测来控制内部和外部区域背侧气体压力源，该模型将使由内部和外部区域测量的温度 传感器分别更接近所需的温度。

公开(公告)号：US08021521B2

公开(公告)日：2011-09-20

申请号：US11408558

申请日：2006-04-21

申请人： Douglas A. Buchberger, Jr. ,  Paul Lukas Brillhart ,  Richard Fovell ,  Hamid Tavassoli ,  Douglas H. Burns ,  Kallol Bera ,  Daniel J. Hoffman ,  Kenneth W. Cowans ,  Williams W. Cowans ,  Glenn W. Zubillaga ,  Isaac Millian

发明人： Douglas A. Buchberger, Jr. ,  Paul Lukas Brillhart ,  Richard Fovell ,  Hamid Tavassoli ,  Douglas H. Burns ,  Kallol Bera ,  Daniel J. Hoffman ,  Kenneth W. Cowans ,  Williams W. Cowans ,  Glenn W. Zubillaga ,  Isaac Millian

IPC分类号： H01T23/00

CPC分类号： H01L21/67248 ,  F25B49/02 ,  F25B2400/0401 ,  F25B2400/0403 ,  F25B2400/0411 ,  F25B2700/21174 ,  F25B2700/21175 ,  H01J37/32091 ,  H01J37/32183 ,  H01J37/32724 ,  H01J2237/2001 ,  H01L21/67069 ,  H01L21/67109 ,  H01L21/6831 ,  H05H2001/4682

摘要： A method of processing a workpiece in a plasma reactor having an electrostatic chuck for holding a workpiece in a chamber of the reactor includes providing a thermally conductive gas under pressure between a backside of the workpiece and a top surface of the electrostatic chuck, controlling the temperature of the electrostatic chuck, defining a desired workpiece temperature, measuring a current workpiece temperature or temperature related to the workpiece temperature and inputting the measured temperature to a thermal model representative of the electrostatic chuck. The method further includes determining from the thermal model a change in the pressure of the thermally conductive gas that would at least reduce the difference between the measured temperature and the desired temperature, and changing the pressure of the thermally conductive gas in accordance with the change determined from the thermal model.

摘要翻译： 在具有用于将工件保持在反应器的室中的静电卡盘的等离子体反应器中处理工件的方法包括在工件的背面和静电卡盘的顶表面之间提供压力下的导热气体，控制温度 定义所需的工件温度，测量与工件温度相关的当前工件温度或温度，并将测量温度输入到表示静电吸盘的热模型。 该方法还包括根据热模型确定导热气体的压力变化，其将至少减小测量温度和期望温度之间的差异，以及根据确定的变化来改变导热气体的压力 从热模型。