摘要:
A random intrinsic chip ID generation employs a retention fail signature. A 1st and 2nd ID are generated using testing settings with a 1st setting more restrictive than the 2nd, creating more fails in the 1st ID bit string that includes 2nd ID bit string. A retention pause time controls the number of retention fails, adjusted by a BIST engine, wherein the fail numbers satisfy a predetermined fail target. Verification confirms whether the 1st ID includes the 2nd ID bit string, the ID being the one used for authentication. Authentication is enabled by a 3rd ID with intermediate condition such that 1st ID includes 3rd ID bit string and 3rd ID includes 2nd ID bit string. The intermediate condition includes a guard-band to eliminate bit instability problem near the 1st and 2nd ID boundary. The intermediate condition is changed at each ID read operation, resulting in a more secure identification.
摘要:
An apparatus comprising connecting IDVMON monitors with through silicon vias (TSV) to allow the monitors to be connected to probe pads located on the backside of the wafer. Because the backside of the wafer have significantly more space than the front side, the probe pads for IDVMON can be accommodated without sacrificing the silicon area.
摘要:
A random intrinsic chip ID generation employs a retention fail signature. A 1st and 2nd ID are generated using testing settings with a 1st setting more restrictive than the 2nd, creating more fails in the 1st ID bit string that includes 2nd ID bit string. A retention pause time controls the number of retention fails, adjusted by a BIST engine, wherein the fail numbers satisfy a predetermined fail target. Verification confirms whether the 1st ID includes the 2nd ID bit string, the ID being the one used for authentication. Authentication is enabled by a 3rd ID with intermediate condition such that 1st ID includes 3rd ID bit string and 3rd ID includes 2nd ID bit string. The intermediate condition includes a guard-band to eliminate bit instability problem near the 1st and 2nd ID boundary. The intermediate condition is changed at each ID read operation, resulting in a more secure identification.
摘要:
A row redundancy system is provided for replacing faulty wordlines of a memory array having a plurality of banks. The row redundancy system includes a remote fuse bay storing at least one faulty address corresponding to a faulty wordline of the memory array; a row fuse array for storing row fuse information corresponding to at least one bank of the memory array; and a copy logic module for copying at least one faulty address stored in the remote fuse bay into the row fuse array; wherein the copy logic module is programmed to copy the at least one faulty address into the row fuse information stored in the row fuse array corresponding to a predetermined number of banks in accordance with a selectable repair field size.
摘要:
A method and circuit for implementing precise eFuse resistance measurement, and a design structure on which the subject circuit resides are provided. An eFuse sense amplifier coupled to an eFuse array and used for current measurements includes balanced odd and even bitlines, and a plurality of programmable reference resistors connected to the balanced odd and even bitlines. First a baseline current measurement is made through one of the programmable reference resistors, and used to identify a network baseline resistance. A current measurement is made for an eFuse path including a selected eFuse and used to identify the resistance of the selected eFuse.
摘要:
A method and circuit for implementing eFuse resistance screening, and a design structure on which the subject circuit resides are provided. An eFuse is sensed using a first reference resistor. Responsive to the eFuse being sensed as blown with the first reference resistor, the eFuse is sensed using a second reference resistor having a higher resistance than the first reference resistor. Responsive to the eFuse being sensed as unblown with the second reference resistor, the eFuse is recorded as poorly blown. Reliability concerns are identified quickly and accurately without being required to measure the resistance of the eFuse.
摘要:
Embodiments of the present invention provide a memory array of dual part cells and design structure thereof. The memory array has a pair of twisted write bit lines and a pair of twisted read bit lines for each column. The twist is made by alternating the vertical position of each bit line pair in each section of a column, with the result of generating common mode nose and of reducing differential mode noise.
摘要:
Disclosed is a flexible command multiplication scheme for the built-in-self test (BIST) of a high-speed embedded memory array that segments BIST functionality into remote lower-speed executable instructions and local higher-speed executable instructions. A stand-alone BIST logic controller operates at a lower frequency and communicates with a command multiplier using a low-speed BIST instruction seed set. The command multiplier uses offset or directive registers to drive a logic unit or ALU to generate “n” sets of CAD information which are then time-multiplexed to the embedded memory at a speed “n” times faster than the BIST operating speed.
摘要:
A concurrent refresh mode is realized by allowing a memory array to be refreshed by way of a refresh bank select signal, while concurrently enabling a memory access operation in another array. The refresh address management is greatly simplified by the insertion of row address counter integrated within each array. In the preferred embodiment, any combination of a plurality of the memory arrays is refreshed simultaneously while enabling a memory access operation. This concurrent mode also supports a multi-bank operation.
摘要:
A two-port dynamic random access memory (DRAM) cell consisting of two transistors and two trench capacitors (2T and 2C DRAM cell) connecting two one transistor and one capacitor DRAM cell (1T DRAM cell) is described. The mask data and cross-section of the 2T 2C DRAM and 1T DRAM cells are fully compatible to each other except for the diffusion connection that couples two storage nodes of the two 1T DRAM cells. This allows a one-port memory cell with 1T and 1C DRAM cell and a two-port memory cell with 2T and 2C DRAM cell to be fully integrated, forming a true system-on chip architecture. Alternatively, by halving the capacitor, the random access write cycle time is further reduced, while still maintaining the data retention time. The deep trench process time is also reduced by reducing by one-half the trench depth.