TEMPERATURE ADJUSTMENT SYSTEM AND ELECTRONIC COMPONENT TESTING APPARATUS

    公开(公告)号:US20250027988A1

    公开(公告)日:2025-01-23

    申请号:US18708854

    申请日:2021-11-09

    Abstract: A temperature adjustment system for adjusting a temperature of a DUT electrically connected to a socket includes a first temperature adjustment device that supplies a fluid to an internal space in either the socket or a contact member that contacts the DUT when the DUT is pressed against the socket and a second temperature adjustment device that adjusts a temperature of an atmosphere in a chamber in which the socket and the contact member are disposed. The first temperature adjustment device includes a first supplier that supplies a first fluid and includes one or more connectors connected to one or more supply sources that supply the first fluid and a heat exchanger disposed between the one or more connectors and the internal space. The heat exchanger has a heat exchange part exposed in the chamber and exchanges heat between the first fluid and the atmosphere in the chamber.

    ELECTRONIC COMPONENT HANDLING APPARATUS AND ELECTRONIC COMPONENT TESTING APPARATUS

    公开(公告)号:US20230305053A1

    公开(公告)日:2023-09-28

    申请号:US18085794

    申请日:2022-12-21

    Inventor: Yuya Yamada

    CPC classification number: G01R31/2875 G01R1/0458 G01R31/2863 G01R31/2877

    Abstract: An electronic component handling apparatus that handles a DUT or a carrier accommodating the DUT, including: a pressing device that: electrically connects the DUT to a socket by pressing the DUT or the carrier toward the socket, and includes: a temperature control device that: controls a temperature of the DUT, and includes: a heater unit that is a heat source, the heater unit including: a flat heater; a first heat transfer material disposed on a first main surface of the flat heater; and a second heat transfer material disposed on a second main surface of the flat heater.

    ELECTRONIC COMPONENT HANDLING APPARATUS AND ELECTRONIC COMPONENT TESTING APPARATUS

    公开(公告)号:US20230251304A1

    公开(公告)日:2023-08-10

    申请号:US18085917

    申请日:2022-12-21

    Inventor: Yuya Yamada

    CPC classification number: G01R31/2863 G01R31/2865 G01R31/2891

    Abstract: An electronic component handling apparatus that handles a pressed body including a DUT or a carrier accommodating the DUT, includes: a pressing device that electrically connects the DUT to a socket by pressing the pressed body toward the socket, and includes: a contact plate that contacts the pressed body; and a retainer that holds the contact plate, the contact plate being separated from the retainer while the contact plate contacts the pressed body, and the contact plate being held by the retainer while the contact plate is separated from the pressed body.

    Handler apparatus, device holder, and test apparatus

    公开(公告)号:US09772373B2

    公开(公告)日:2017-09-26

    申请号:US14472385

    申请日:2014-08-29

    Abstract: Provided is a handler apparatus that conveys a device under test to a test socket, including: an actuator that, prior to fitting of a device holder to the test socket, fits the device holder, and adjusts a position of the device under test on the device holder; and a conveyer that conveys the device holder in which a position of the device under test has been adjusted, to fit the test socket, where the device holder includes: an inner unit to mount the device under test; an outer unit to retain the inner unit to be movable; and a release button to release a lock of movement of the inner unit, in response to being pressed from a side to which the device under test is mounted, and the actuator sets the inner unit to be movable by pressing the release button and adjusts a position of the inner unit.

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