公开(公告)号：US10322471B2

公开(公告)日：2019-06-18

申请号：US15326180

申请日：2015-07-15

Applicant: Alpha Assembly Solutions Inc.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravindra Bhatkal ,  Bawa Singh

IPC: B23K31/02 ,  B23K35/26 ,  B23K35/00 ,  C22C13/00 ,  C22C13/02 ,  B23K1/00 ,  B23K1/002 ,  B23K1/005 ,  B23K1/08 ,  B23K35/02 ,  H01L23/00 ,  B23K101/40 ,  B23K101/42

Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.

公开(公告)号：US10065274B2

公开(公告)日：2018-09-04

申请号：US14909888

申请日：2014-08-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit Pandher ,  Bawa Singh ,  Rahul Raut ,  Sanyogita Arora ,  Ravindra Bhatkal ,  Bin Mo

IPC: B23K35/36 ,  B23K35/26 ,  B23K35/362 ,  B23K35/02 ,  B23K1/012 ,  B23K1/08 ,  B23K1/19 ,  C22C13/00

Abstract: A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.

公开(公告)号：US20170197281A1

公开(公告)日：2017-07-13

申请号：US15326180

申请日：2015-07-15

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravindra Bhatkal ,  Bawa Singh

IPC: B23K35/26 ,  H01L23/00 ,  B23K1/08 ,  B23K1/00 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/085 ,  B23K35/00 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K2101/40 ,  B23K2101/42 ,  C22C13/00 ,  C22C13/02 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29117 ,  H01L2224/29123 ,  H01L2224/29124 ,  H01L2224/29138 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29149 ,  H01L2224/29155 ,  H01L2224/29157 ,  H01L2224/2916 ,  H01L2224/29163 ,  H01L2224/29166 ,  H01L2224/29169 ,  H01L2224/29171 ,  H01L2224/29172 ,  H01L2224/2918 ,  H01L2224/83815 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01032 ,  H01L2924/01034 ,  H01L2924/01052 ,  H01L2924/01058

Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.