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公开(公告)号:US11960435B2
公开(公告)日:2024-04-16
申请号:US17692147
申请日:2022-03-10
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor: Pradeep Jayaraman , Dean Gonzales , Gerald R. Talbot , Ramon A. Mangaser , Michael J. Tresidder , Prasant Kumar Vallur , Srikanth Reddy Gruddanti , Krishna Reddy Mudimela Venkata , David H. McIntyre
IPC: G06F13/42 , H01L25/065
CPC classification number: G06F13/4291 , G06F13/4286 , H01L25/0652
Abstract: A semiconductor package for skew matching in a die-to-die interface, including: a first die; a second die aligned with the first die such that each connection point of a first plurality of connection points of the first die is substantially equidistant to a corresponding connection point of a second plurality of connection points of the second die; and a plurality of connection paths of a substantially same length, wherein each connection path of the plurality of connection paths couples a respective connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points.
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公开(公告)号:US20250088193A1
公开(公告)日:2025-03-13
申请号:US18466221
申请日:2023-09-13
Applicant: Advanced Micro Devices, Inc.
Inventor: Srikanth Reddy Gruddanti , Debasish Dwibedy , Manoj N. Kulkarni , Prasant Kumar Vallur , Priyadarshi Saxena
Abstract: A method for driver calibration in die-to-die interfaces can include calibrating a delay lock loop of a delay line unit cell, by at least one processor, based on drive and load conditions of one or more driver unit cells of a physical layer of a die-to-die interconnect. The method can additionally include generating a clock signal, by the at least one processor, based on the delay lock loop. The method can further include communicating data, by the at least one processor, over the die-to-die interconnect based on the clock signal. Various other methods and systems are also disclosed.
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公开(公告)号:US12088296B2
公开(公告)日:2024-09-10
申请号:US17554722
申请日:2021-12-17
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor: Ramon A. Mangaser , Srikanth Reddy Gruddanti , Prasant Kumar Vallur , Krishna Reddy Mudimela Venkata , Oikwan Tsang
Abstract: A clock circuit for clock gating using a cascaded clock gating control signal, including: a first B-latch accepting, as input, a clock gating control signal and enabled by a first clock signal; a second B-latch accepting, as input, an output from the first B-latch and enabled by a second clock signal; and a first logic outputting, based on the first B-latch, a first gated clock signal; and a second logic outputting, based on the second B-latch, a second gated clock signal.
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公开(公告)号:US20240395295A1
公开(公告)日:2024-11-28
申请号:US18201611
申请日:2023-05-24
Applicant: Advanced Micro Devices, Inc.
Inventor: Srikanth Reddy Gruddanti , Prasant Kumar Vallur , David Da-Wei Lin , Manoj N. Kulkarni , Priyadarshi Saxena
IPC: G11C7/22 , G11C7/10 , H03K19/003
Abstract: A signal processing circuit includes an analog front-end circuit and a digital delay circuit. The analog circuit receives a clock signal and provides a compensated clock signal. The digital delay circuit is coupled to the analog front-end circuit and provides a compensated sample clock signal in response to delaying the compensated clock signal. The analog circuit measures a variation of a power supply voltage and adjusts a gain through the analog circuit according to a measured variation of the power supply voltage.
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公开(公告)号:US12015412B1
公开(公告)日:2024-06-18
申请号:US18060857
申请日:2022-12-01
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor: Srikanth Reddy Gruddanti , Pradeep Jayaraman , Ramon A. Mangaser , Prasant Kumar Vallur , Krishna Reddy Mudimela Venkata , David H. McIntyre
CPC classification number: H03K5/249 , H03K5/14 , H03L7/0998 , H03K2005/00286
Abstract: A semiconductor package includes a first die having a phase locked loop outputting a local clock signal and a strobe signal to a first transmit block of the first die. The strobe signal has a phase offset relative to the local clock signal. A second die is aligned with the first die so each of a first plurality of connection points of the first die is substantially equidistant to a corresponding connection point of a second plurality of connection points of the second die. A plurality of connection paths of a substantially same length couple a connection points of the first plurality of connection points to corresponding connection points of the second plurality of connection points. Different connection paths transmit data signals from the first die to the second die based on the local clock signal and transmit the strobe signal from the first die to the second die.
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