公开(公告)号：US20180013311A1

公开(公告)日：2018-01-11

申请号：US15587272

申请日：2017-05-04

Applicant: Apple Inc.

Inventor： Corey S. Provencher ,  Michael V. Yeh ,  Jason L. Pang

IPC: H02J7/02 ,  H01M10/615 ,  H01M10/6571 ,  H01M10/48

CPC classification number: H02J7/025 ,  H01M10/486 ,  H01M10/488 ,  H01M10/615 ,  H01M10/6571 ,  H01M2220/30 ,  H02J50/10

Abstract: A wireless power transmitting device may transmit wireless power signals to a wireless power receiving electronic device. The electronic device may have a coil that receives the transmitted wireless power signals and may have a power receiving circuit that rectifies the received wireless power signals to produce a corresponding direct-current voltage signal. The direct-current signal may be used to power circuitry in the electronic device and may be used to charge a battery in the electronic device. Control circuitry in the electronic device may use a temperature sensor to make temperature measurements. In response to detecting that the device is below a given threshold temperature and based on other information such as information on which applications are running on a controller in device, the device may supply drive current signals to the coil to heat the battery and improve battery performance.

公开(公告)号：US20180092213A1

公开(公告)日：2018-03-29

申请号：US15710579

申请日：2017-09-20

Applicant: Apple Inc.

Inventor： Corey S. Provencher ,  Meng Chi Lee ,  Derek J. Walters ,  Ian A. Spraggs ,  Flynn P. Carson ,  Shakti S. Chauhan ,  Daniel W. Jarvis ,  David A. Pakula ,  Jun Zhai ,  Michael V. Yeh ,  Alex J. Crumlin ,  Dennis R. Pyper ,  Amir Salehi ,  Vu T. Vo ,  Gregory N. Stephens

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0014 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/10159 ,  H05K2201/10674 ,  H05K2203/1316 ,  Y02P70/611

Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.

公开(公告)号：US10455738B2

公开(公告)日：2019-10-22

申请号：US15712071

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： David A. Pakula ,  Daniel W. Jarvis ,  Gregory N. Stephens ,  Ian A. Spraggs ,  Vu Thanh Vo ,  Amir Salehi ,  Dennis R. Pyper ,  Alex J. Crumlin ,  Corey S. Provencher ,  Derek J. Walters ,  Michael V. Yeh

IPC: H05K5/02 ,  H04B1/03 ,  H05K7/20 ,  G06F3/041 ,  H01M2/10 ,  H05K1/02 ,  H05K1/14 ,  G06F1/16 ,  H05K9/00 ,  H01M2/08 ,  H02J7/00 ,  G06F3/044

Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.