Ultraviolet and ozone clean system

    公开(公告)号:US12159782B2

    公开(公告)日:2024-12-03

    申请号:US18370481

    申请日:2023-09-20

    Abstract: A cleaning apparatus for cleaning a substrate includes a lamp for emitting ultraviolet radiation in an irradiation region; a housing that houses the lamp; a water deflector spaced below the housing, the water deflector having a water inlet for receiving a supply of ozonated water and a water outlet for discharging ozonated water irradiated by the lamp into a substrate processing region beneath the water deflector, and defining a water flow path between the water inlet and the water outlet, the water flow path extending in the irradiation region; an upper reflector extending along and above the lamp; and a lower reflector extending along and below the water deflector, wherein the upper reflector and the lower reflector at least partially define the irradiation region and reflect ultraviolet radiation toward the water flow path, and wherein the lower reflector shields the substrate from ultraviolet radiation emitted by the lamp.

    Ultraviolet and ozone clean system

    公开(公告)号:US11798799B2

    公开(公告)日:2023-10-24

    申请号:US17397088

    申请日:2021-08-09

    CPC classification number: H01L21/02052 B08B3/10 B08B7/0057 B08B2203/005

    Abstract: A cleaning apparatus for cleaning a substrate includes a lamp for emitting ultraviolet radiation in an irradiation region; a housing that houses the lamp; a water deflector spaced below the housing, the water deflector having a water inlet for receiving a supply of ozonated water and a water outlet for discharging ozonated water irradiated by the lamp into a substrate processing region beneath the water deflector, and defining a water flow path between the water inlet and the water outlet, the water flow path extending in the irradiation region; an upper reflector extending along and above the lamp; and a lower reflector extending along and below the water deflector, wherein the upper reflector and the lower reflector at least partially define the irradiation region and reflect ultraviolet radiation toward the water flow path, and wherein the lower reflector shields the substrate from ultraviolet radiation emitted by the lamp.

    Megasonic clean with cavity property monitoring

    公开(公告)号:US11654460B2

    公开(公告)日:2023-05-23

    申请号:US17550903

    申请日:2021-12-14

    CPC classification number: B08B3/123 B08B13/00 G01B11/303

    Abstract: Embodiments of megasonic cleaning chambers are provided herein. In some embodiments, a megasonic cleaning chamber includes: a chamber body defining an interior volume therein; a substrate support to support a substrate disposed in the interior volume; a supply tube comprising a transparent material configured to direct a cleaning fluid to the substrate support; a megasonic power generator coupled to the supply tube to provide megasonic power to the cleaning fluid; a megasonic transducer coupled to the megasonic power generator and the supply tube to create megasonic waves in the cleaning fluid and to form cavities in the cleaning fluid, wherein the megasonic transducer is configured to direct the megasonic waves and cavities toward the substrate support; and one or more sensors configured to generate a signal indicative of a property of the cavities in the cleaning fluid.

    Apparatus and methods for fabricating a photomask substrate for EUV applications
    7.
    发明授权
    Apparatus and methods for fabricating a photomask substrate for EUV applications 有权
    用于制造用于EUV应用的光掩模基板的装置和方法

    公开(公告)号:US09250514B2

    公开(公告)日:2016-02-02

    申请号:US14199575

    申请日:2014-03-06

    CPC classification number: G03F1/80 G03F1/22

    Abstract: An apparatus and methods utilized a DC or AC power to supply through a conductive substrate support pedestal to a conductive photomask substrate during a photomask substrate manufacturing process for EUV or other advanced lithography applications are provided. In one embodiment, an apparatus for processing a photomask includes a substrate support pedestal configured to receive a conductive photomask, wherein the conductive photomask is fabricated from a dielectric material substrate with a conductive coating, and at least a conductive path formed in the substrate support pedestal in contact with the photomask substrate configured to be conductive.

    Abstract translation: 提供了一种在用于EUV或其它先进光刻应用的光掩模衬底制造过程中利用DC或AC电力通过导电衬底支撑基座提供给导电光掩模衬底的装置和方法。 在一个实施例中,一种用于处理光掩模的设备包括被配置为接收导电光掩模的基板支撑基座,其中导电光掩模由具有导电涂层的介电材料基板制成,并且至少形成在基板支撑基座中的导电路径 与配置为导电的光掩模基板接触。

    Baking chamber with shroud for mask clean

    公开(公告)号:US12085849B2

    公开(公告)日:2024-09-10

    申请号:US17229584

    申请日:2021-04-13

    CPC classification number: G03F1/82 B08B7/0078 H05B3/22

    Abstract: Embodiments of baking chambers are provided herein. In some embodiments, a baking chamber for baking a substrate includes: a chamber body enclosing an interior volume; a heater disposed in the interior volume, wherein the heater is configured to have a surface temperature of about 100 to about 400 degrees Celsius during use; a shroud disposed in the interior volume opposite the heater, wherein the shroud includes a central opening fluidly coupled to a gas inlet; a plurality of substrate lift pins configured to support a substrate in the interior volume between the heater and the shroud, wherein the shroud includes a plurality of first openings to facilitate the plurality of substrate lift pins; and a gas outlet disposed in the chamber body opposite the shroud such that a gas flow path through the interior volume extends from the gas inlet, around the heater, and to the gas outlet.

    Single-volume baking chamber for mask clean

    公开(公告)号:US11921422B2

    公开(公告)日:2024-03-05

    申请号:US17226762

    申请日:2021-04-09

    Abstract: Embodiments of baking chambers for baking a substrate and methods of use thereof are provided herein. In some embodiments, a multi-chamber process tool for processing a substrate including: a wet clean chamber for cleaning the substrate; and a baking chamber configured to heat the substrate to remove residue or haze left over after a wet clean process performed in the wet clean chamber, the baking chamber comprising: a chamber body enclosing an interior volume; a heater disposed in the interior volume, wherein the heater is configured to have a surface temperature of about 100 to about 400 degrees Celsius during use; a substrate support configured to support a substrate disposed in the interior volume, wherein the substrate support has a direct line of sight with the heater such that the heater heats the substrate support via convection; and a gas inlet and a gas outlet coupled to the interior volume.

    Pellicle adhesive residue removal system and methods

    公开(公告)号:US11467508B2

    公开(公告)日:2022-10-11

    申请号:US16448722

    申请日:2019-06-21

    Inventor: Banqiu Wu Eli Dagan

    Abstract: Embodiments of the present disclosure generally include apparatus and methods for removing adhesive residues from a surface of a lithography mask. In particular, the processing systems described herein provide for the delivery of a solvent to a discrete plurality of locations on the surface of the lithography mask to facilitate the removal of adhesive residue therefrom. In one embodiment, a method of processing a substrate includes positioning the substrate on a substrate support of a processing system, sealing individual ones of a plurality of cleaning units to a surface of the substrate at a corresponding plurality of locations, heating a cleaning fluid to a temperature between about 50° C. and about 150° C., flowing the cleaning fluid to, and thereafter, from, the plurality of cleaning units, and exposing the surface of the substrate to the cleaning fluid at the plurality of locations.

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