公开(公告)号：US11661652B2

公开(公告)日：2023-05-30

申请号：US16412798

申请日：2019-05-15

Applicant: Applied Materials, Inc.

Inventor： Gang Peng ,  Halbert Chong ,  Marcus Pereira ,  David W. Groechel

IPC: C23C16/44 ,  B08B7/02 ,  H01L21/67 ,  H01J37/32

CPC classification number: C23C16/4407 ,  B08B7/028 ,  H01J37/32449 ,  H01J37/32862 ,  H01L21/67253 ,  H01J2237/335 ,  H01J2237/3321

Abstract: Embodiments described herein relate to a gas line cleaning system and a method of cleaning gas lines. The gas line cleaning system includes a connector having a first end and a second end, and a fluid system. The fluid system includes a fluid source configured to flow a fluid through a fluid conduit connected to the first end, and an ultrasonic transducer coupled to the fluid conduit configured to apply an ultrasonic energy to the fluid conduit to agitate the fluid. The ultrasonic energy creates a mechanical energy that reverberates in the fluid conduit and propagates into the fluid to remove particles that may have formed on an inside surface of a gas line connected to the second end and carry away particles inside the gas line.

公开(公告)号：US11519071B2

公开(公告)日：2022-12-06

申请号：US16778642

申请日：2020-01-31

Applicant: Applied Materials, Inc.

Inventor： Gang Grant Peng ,  David W. Groechel ,  Han Wang

IPC: C23C16/00 ,  C23C16/56 ,  H01J37/34 ,  C23C16/40 ,  H01J37/32

Abstract: One example of the disclosure provides a method of fabricating a chamber component with a coating comprising a yttrium containing material with desired film properties. In one example, the method of fabricating a coating material includes providing a base structure comprising an aluminum containing material. The method further includes forming a coating layer that includes a yttrium containing material on the base structure. The method also includes thermal treating the coating layer to form a treated coating layer.

公开(公告)号：US11378511B2

公开(公告)日：2022-07-05

申请号：US16690576

申请日：2019-11-21

Applicant: APPLIED MATERIALS, INC.

Inventor： Gang Grant Peng ,  Robert Douglas Mikkola ,  David Britz ,  Lance Scudder ,  David W. Groechel

IPC: G01N17/02 ,  G01N27/02 ,  G01N27/00 ,  G01N17/00

Abstract: A method for detecting corrosion on a conductive object includes submerging a surface of the conductive object at least partially in an aqueous solution, flowing current through the surface of the conductive object by forming a voltage differential across the surface, varying the voltage differential across the surface while monitoring the current through the surface of the conductive object, determining a total charge corresponding to a corrosion level of the surface of the conductive object based on current versus voltage levels. The corrosion level may further be utilized in selecting a cleaning process to remediate the corrosion of the surface based on the corrosion level and in applying a protective corrosion barrier to on at least part of the surface after the cleaning process.

公开(公告)号：US10434604B2

公开(公告)日：2019-10-08

申请号：US15955503

申请日：2018-04-17

Applicant: Applied Materials, Inc.

Inventor： Gang Peng ,  David W. Groechel ,  Jenn C. Chow ,  Tuochuan Huang ,  Han Wang

IPC: B23K26/352 ,  H01J37/32 ,  B23K26/12

Abstract: A system to provide a texture to a surface of a component for use in a semiconductor processing chamber is provided. The system includes an enclosure comprising a processing region, a support disposed in the processing region, a photon light source to generate a stream of photons, an optical module operably coupled to the photon light source, and a lens. The optical module includes a beam modulator to create a beam of photons from the stream of photons generated from the photon light source, and a beam scanner to scan the beam of photons across the surface of the component. The lens is used to receive the beam of photons from the beam scanner and distribute the beam of photons at a wavelength in a range between about 345 nm and about 1100 nm across the surface of the component to form a plurality of features on the component.

公开(公告)号：US20220108907A1

公开(公告)日：2022-04-07

申请号：US17063334

申请日：2020-10-05

Applicant: Applied Materials, Inc.

Inventor： Katherine Woo ,  Paul L. Brillhart ,  Jian Li ,  Shinnosuke Kawaguchi ,  David W. Groechel ,  Dorothea Buechel-Rimmel ,  Juan Carlos Rocha-Alvarez ,  Paul E. Fisher ,  Chidambara A. Ramalingam ,  Joseph J. Farah

IPC: H01L21/68 ,  H01J37/32 ,  H04Q9/00 ,  G01L9/08

Abstract: Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.

公开(公告)号：US11261533B2

公开(公告)日：2022-03-01

申请号：US15884006

申请日：2018-01-30

Applicant: Applied Materials, Inc.

Inventor： David W. Groechel ,  Gang Peng ,  Robert Mikkola

IPC: C25D3/44 ,  C25D5/00 ,  C25D5/18 ,  C25D3/66 ,  C25D17/02 ,  C25D21/10

Abstract: The present disclosure generally relates to methods of electro-depositing a crystalline layer of pure aluminum onto the surface of an aluminum alloy article. The methods may include positioning the article and an electrode in an electro-deposition solution. The electro-deposition solution includes one or more of an aluminum halide, an organic chloride salt, an aluminum reducing agent, a solvent such as a nitrile compound, and an alkali metal halide. The solution is blanketed with an inert gas, agitated, and a crystalline layer of aluminum is deposited on the article by applying a bias voltage to the article and the electrode.

公开(公告)号：US20250054797A1

公开(公告)日：2025-02-13

申请号：US18929425

申请日：2024-10-28

Applicant: Applied Materials, Inc.

Inventor： Katherine Woo ,  Paul L. Brillhart ,  Jian Li ,  Shinnosuke Kawaguchi ,  David W. Groechel ,  Dorothea Buechel-Rimmel ,  Juan Carlos Rocha-Alvarez ,  Paul E. Fisher ,  Chidambara A. Ramalingam ,  Joseph J. Farah

IPC: H01L21/68 ,  G01L9/08 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H04Q9/00

Abstract: Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.

公开(公告)号：US11776822B2

公开(公告)日：2023-10-03

申请号：US17051071

申请日：2019-05-02

Applicant: Applied Materials, Inc.

Inventor： Tuochuan Huang ,  Gang Peng ,  David W. Groechel ,  Vijay D. Parkhe ,  Shinnosuke Kawaguchi ,  David Benjaminson

IPC: H01L21/67 ,  B08B3/12 ,  H01L21/683

CPC classification number: H01L21/67028 ,  B08B3/12 ,  H01L21/6831

Abstract: Embodiments described herein relate a cleaning fixture and method to prevent chemical solutions from contacting the various substrate supporting member features and penetrating into the holes and the metal plate of the substrate supporting surface. The cleaning fixture includes a mounting plate having a plurality of thru-holes arranged on a bolt circle and configured to align with a plurality of thread holes disposed in an electrostatic chuck, a recess formed in the mounting plate, and a gas port formed through the mounting plate. A sealed plenum is formed between the recess of the mounting plate and a lower surface of the electrostatic chuck when the electrostatic chuck is coupled to the mounting plate. The gas port is fluidly coupled to the sealed plenum.

公开(公告)号：US12131934B2

公开(公告)日：2024-10-29

申请号：US17063334

申请日：2020-10-05

Applicant: Applied Materials, Inc.

Inventor： Katherine Woo ,  Paul L. Brillhart ,  Jian Li ,  Shinnosuke Kawaguchi ,  David W. Groechel ,  Dorothea Buechel-Rimmel ,  Juan Carlos Rocha-Alvarez ,  Paul E. Fisher ,  Chidambara A. Ramalingam ,  Joseph J. Farah

IPC: H01L21/67 ,  G01L9/08 ,  H01J37/32 ,  H01L21/68 ,  H04Q9/00 ,  H01L21/683

CPC classification number: H01L21/68 ,  G01L9/08 ,  H01J37/32724 ,  H04Q9/00 ,  H01J2237/20264 ,  H01L21/67103 ,  H01L21/6833 ,  H01L21/6838

Abstract: Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.

公开(公告)号：US11710647B2

公开(公告)日：2023-07-25

申请号：US17161557

申请日：2021-01-28

Applicant: Applied Materials, Inc.

Inventor： Richard Wells Plavidal ,  Scott Osterman ,  David W. Groechel ,  Gang Grant Peng ,  John Z. Smith

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/02

CPC classification number: H01L21/67023 ,  B08B3/024 ,  H01L21/02052 ,  H01L21/67207

Abstract: Embodiments of a methods and cleaning systems for cleaning components for use in substrate processing equipment are provided herein. In some embodiments, a cleaning system includes a boiler having a heater configured to heat a fluid; a clean chamber fluidly coupled to the boiler via at least one of a gas line and a liquid line, wherein the clean chamber includes one or more fixtures in an interior volume therein for holding at least one component to be cleaned, and wherein the clean chamber includes a heater for heating the interior volume; and an expansion chamber fluidly coupled to the clean chamber via a release line for evacuating the clean chamber, wherein the release line includes a release valve to selectively open or close a flow path between the expansion chamber and the clean chamber, and wherein the expansion chamber includes a chiller and a vacuum port.