公开(公告)号：US11471999B2

公开(公告)日：2022-10-18

申请号：US16042016

申请日：2018-07-23

Applicant: Applied Materials, Inc.

Inventor： Ashavani Kumar ,  Ashwin Chockalingam ,  Sivapackia Ganapathiappan ,  Rajeev Bajaj ,  Boyi Fu ,  Daniel Redfield ,  Nag B. Patibandla ,  Mario Dagio Cornejo ,  Amritanshu Sinha ,  Yan Zhao ,  Ranga Rao Arnepalli ,  Fred C. Redeker

IPC: B24B37/24 ,  B24D11/04 ,  B24B37/26 ,  B24D18/00 ,  B24B37/16 ,  B24B37/20 ,  B33Y80/00 ,  B33Y10/00 ,  B29C64/112 ,  B33Y30/00 ,  H01L21/306

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

公开(公告)号：US11980992B2

公开(公告)日：2024-05-14

申请号：US17946547

申请日：2022-09-16

Applicant: Applied Materials, Inc.

Inventor： Ashavani Kumar ,  Ashwin Chockalingam ,  Sivapackia Ganapathiappan ,  Rajeev Bajaj ,  Boyi Fu ,  Daniel Redfield ,  Nag B. Patibandla ,  Mario Dagio Cornejo ,  Amritanshu Sinha ,  Yan Zhao ,  Ranga Rao Arnepalli ,  Fred C. Redeker

IPC: B24B37/24 ,  B24B37/16 ,  B24B37/20 ,  B24B37/26 ,  B24D11/04 ,  B24D18/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  H01L21/306

CPC classification number: B24B37/245 ,  B24B37/26 ,  B24D11/04 ,  B24D18/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y80/00 ,  B24B37/16 ,  B24B37/20 ,  B24D2203/00 ,  B33Y30/00 ,  H01L21/30625

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.